JP2009216401A - Substrate inspection system and substrate inspection method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate inspection method and a substrate inspection system capable of displaying latest image data taken with a substrate inspection device by minimum operation. <P>SOLUTION: A substrate inspection device identifier for identifying the substrate inspection device is transmitted to a database server only by inputting display indication for displaying the lates image data taken with the substrate inspection device, and the database server having received the substrate inspection device identifier searches an image database on the basis of the substrate inspection device identifier and latest image data determined from the present time is transmitted to the substrate inspection device. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a substrate inspection system, and more particularly to a substrate inspection system and a substrate inspection method including a substrate inspection apparatus and a server for inspecting the appearance of a semiconductor wafer via a network.

  Conventionally, in a semiconductor substrate manufacturing process, a defect inspection of a semiconductor wafer is performed as appropriate. In this semiconductor device manufacturing process, each of the plurality of substrate inspection devices constituting the semiconductor manufacturing system is subject to scratches, dust adhesion, cracks, dirt, films on the surface of the semiconductor wafer, depending on the purpose. A defect inspection such as unevenness is performed (see, for example, Patent Document 1).

  When inspecting defects, the substrate inspection apparatus images a semiconductor wafer and stores it in a memory such as a hard disk. However, as the capacity of image data increases, the capacity of the hard disk for storage becomes larger. . Since it is more efficient to store these image data in a dedicated memory device, the image data obtained by imaging the semiconductor wafer is stored in a database server or the like which is a device different from the substrate inspection device.

For example, an image of 25 semiconductor wafers per lot is taken by the substrate inspection apparatus, and image data for one lot to several lots is temporarily stored, and then transmitted to the database server. The database server sequentially stores the transmitted image data.
JP-A-9-61365

  However, in recent years, with the increase in the diameter of the substrate, high-resolution imaging has been required for the substrate inspection apparatus, and the required storage capacity has increased, placing a heavy burden on image processing of the substrate inspection image. When the image data stored in the database server is displayed on the board inspection apparatus, the board inspection apparatus designates the condition of when the image is taken with which board inspection apparatus to the database server. There is a problem that it is necessary to search and display the image data based on the conditions, and the operation that the operator has to perform is complicated.

  The present invention has been made in view of the above problems, and a first object of the present invention is to provide a substrate inspection system and a substrate inspection method capable of reducing the storage capacity burden of the substrate inspection apparatus. A second object of the present invention is to provide a substrate inspection system and a substrate inspection method capable of displaying the latest image data captured by the substrate inspection apparatus with a minimum operation.

The present invention employs the following configuration in order to solve the above problems.
That is, the substrate inspection system of the present invention is a defect inspection system that stores image data of a substrate imaged by a plurality of substrate inspection devices in a database server connected by a network line, and the substrate inspection device images an object to be inspected. Each time the captured image data, the apparatus identifier for specifying the substrate inspection apparatus, and the imaging date / time information indicating the imaging date / time are transmitted to the database server as correspondence information, and the transmission of the transmitted information is completed Or a control unit that erases information in the storage unit of the substrate inspection apparatus when the capacity of the transmitted information exceeds a predetermined capacity of the storage unit of the substrate inspection apparatus.

  Furthermore, in the substrate inspection system of the present invention, the database server includes an inspection result storage unit for storing image data, and an apparatus identifier and the latest imaging date / time information according to an instruction to display the latest image data from the substrate inspection apparatus. And an inspection result server that reads out the latest stored image data from the inspection result storage unit and transmits the read image data to the substrate inspection apparatus.

  Further, according to the substrate inspection method of the present invention, a plurality of substrate inspection devices that image a substrate and inspect defects, and a database server that stores image data of an inspection object imaged by the substrate inspection device are connected via a network. A defect inspection method executed in a connected defect inspection system, and each time a substrate inspection apparatus images a substrate, the captured image data, a device identifier for specifying the substrate inspection device, and an imaged date and time are indicated. Image data transmission process for transmitting, storing and storing imaging date and time information to the database server as correlated information, and information transmitted by the image data transmission process every time the image data transmission process is completed, or board inspection And an image data erasing step of erasing image data of the substrate inspection apparatus when a predetermined capacity of the storage unit of the apparatus is exceeded.

  Further, according to the substrate inspection method of the present invention, in response to an instruction to display the latest image data from the substrate inspection apparatus, the database server stores a stored image corresponding to the apparatus identifier of the substrate inspection apparatus and the latest imaging date / time information. A latest inspection information transmission step of reading data and transmitting it to the substrate inspection device, and a latest inspection image display step of displaying based on the information transmitted in the latest inspection information transmission step by the display unit of the substrate inspection device. Features.

  According to the present invention, the image data captured by the board inspection apparatus is immediately transferred to the database server and erased, so that a large capacity is not required for the storage unit of the board inspection apparatus, so that the storage capacity is burdened. The device identifier for specifying the substrate inspection device is transmitted to the database server simply by inputting an instruction for displaying the latest image data captured by the substrate inspection device, and the database server that has received the device identifier Since the image database is searched based on the device identifier and the latest image data viewed from the current time is transmitted to the substrate inspection device, the latest image data captured by the substrate inspection device can be displayed with a minimum operation. It becomes possible.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram showing a configuration of a defect inspection system to which the present invention is applied.
In FIG. 1, the defect inspection system includes a host computer 101, a client computer 106, a plurality of inspection apparatuses 103, a database server 105, and the like, which are connected to a factory control LAN 102. The inspection apparatus 103 and the database server 105 are connected to an information communication LAN 104A and an information communication LAN 104B dedicated to the defect inspection system, separately from the factory control LAN 102.

  The host computer 101 is a factory management computer that controls the process of manufacturing the semiconductor device. The host computer 101 manages the flow and status of products (semiconductor substrates) in the entire manufacturing process in the factory. The host computer 101 exchanges information in the factory via the factory control LAN 102. That is, in the factory, each process of transporting, manufacturing, and inspecting the semiconductor wafer is controlled by the host computer 101.

  The client computer 106 is a general personal computer, and can be replaced by any personal computer that can be connected to the factory control LAN 102. If the Internet web browsing software is installed, the database server 105 can be accessed from anywhere.

  A plurality of manufacturing apparatuses and a plurality of inspection apparatuses 103 in the factory are connected to the factory control LAN 102, and products are manufactured and inspected according to instructions from the host computer 101, and the inspection results are sent to the host computer 101. It is like that.

  The inspection apparatus 103 takes in the board transferred to each inspection apparatus 103 by a factory transfer system (not shown) controlled by the host computer 101 into the inspection apparatus 103 and executes various inspections to determine whether the board is good or bad. judge. The inspection apparatus 103 includes a conveyance unit 107, an inspection unit 108, a defect determination unit 109, and the like. The transport unit 107 includes a robot arm or the like, takes out a product from a transport carrier in which a plurality of substrates are stored, and transports the substrate to the inspection unit 108. The inspection unit 108 is provided with an illuminating device for performing inspection of the substrate, an optical unit including an imaging device, and the like, and images the entire substrate such as the front surface, back surface, and bevel portion of the substrate. The defect determination unit 109 includes hardware and software that performs defect extraction and the like from the captured image to determine and analyze the quality of the substrate and analyzes the image captured by the inspection unit 108 by image processing and describes the inspection conditions. Based on the threshold value used for the determination, substrate quality is determined and defects are classified and analyzed. In addition, a display unit 146 such as a liquid crystal monitor for displaying inspection results and captured images, a keyboard and a not-shown operation unit such as a mouse for issuing various instructions, and the like are used to provide a GUI (Graphical User Interface). In this way, instructions are issued. Moreover, the control part 145 which controls these whole is provided.

  Further, the storage unit 144 in the inspection apparatus 103 is given only a minimum storage capacity. For example, it is a capacity that can store information such as inspection results and inspection image data for the immediately preceding one, and the information is transferred to the database server 105 for each inspection of one substrate. Then, the control unit 145 erases the transferred information when the transfer is completed. Alternatively, when the storage unit 144 exceeds a predetermined capacity, the control unit 145 may delete information such as image data in order from those inspected in the past. In addition, the storage unit 144 has a storage capacity capable of storing information for at least several times of inspection so that information such as image data can be stored as a backup in case the image data cannot be sent in case of emergency. ing.

  A plurality of inspection apparatuses 103 are connected to the in-factory control LAN 102, the information communication LAN 104A, and the information communication LAN 104B. Each inspection apparatus performs an inspection separately to determine the quality of the conveyed product. At this time, each inspection device 103 needs to change the number of substrates to be inspected, the inspection conditions, and the criteria for determining the substrates depending on the type and lot of the substrate to be inspected, and a recipe file describing the inspection conditions Are read from the host computer 101 or the like, and the inspection conditions are changed.

  The information communication LAN 104A is a local area communication network for transferring information such as recipe files and inspection results of each inspection apparatus 103 and image data captured at the time of inspection to the database server 105 at the normal time. Compared to, the capacity has been increased to transfer a large amount of information.

  The information communication LAN 104B is provided as a countermeasure when a failure occurs in the information communication LAN 104A due to duplication of the local communication network. When a failure occurs in the information communication LAN 104A, the image data can be continuously transferred to the database server 105 by using the information communication LAN 104B, and the inspection can be executed without stopping the inspection device 103. ing.

  The database server 105 includes a recipe storage unit 112, an inspection result storage unit 117, a database unit 118, a database registration unit 111, a recipe editing server 113, an inspection result server 110, and the like. Accordingly, the database server 105 can perform recipe management of the inspection apparatus 103, accumulation of result data of the inspection apparatus 103, and accumulation of status data of the inspection apparatus 103. The database server 105 can exchange information with the host computer 101 and access from other client computers 106 via the factory control LAN 102.

  The recipe storage unit 112 stores a recipe file used by each inspection apparatus 103. Here, an inspection apparatus ID (apparatus identifier) for identifying the inspection apparatus 103 and a name of the inspection apparatus 103 are given to the recipe file, and the recipe file is stored for each inspection apparatus ID or name.

  The inspection result storage unit 117 stores inspection result data such as defect classification results and substrate pass / fail judgment results transferred from each inspection apparatus 103 and image data captured by the inspection apparatus 103. The inspection result data and the image data are given the inspection device ID of the inspection device 103 that performed the inspection, the inspection date and time (imaging date and time information), and the unit ID indicating the unit that performed the inspection determination. The inspection device ID, the inspection date and time, and the unit ID are stored in association with the image data so that the date and unit can be identified.

  The database unit 118 includes a recipe database 114 for managing recipe information (not shown) in a database therein, an inspection result database 115 in which inspection result and image information is databased, operating statuses and failures of the inspection apparatuses 103 And a device management database 116 in which information is converted into a database.

  The database registration unit 111 has a function of receiving a recipe file, an inspection result file, an apparatus management information file, etc. transferred from each inspection apparatus 103 and registering each information in the database. As a result, all the information from the inspection apparatus 103 is made into a database so that retrieval and information reading can be performed.

  The recipe editing server 113 is connected to the in-factory control LAN 102, and can edit and add recipes in place of the inspection apparatus 103 according to instructions from the client computer 106. The recipe editing server 113 is equipped with a Web service function using Internet technology, and can display a recipe editing screen and an image used for recipe editing on the screen of the client computer 106. Further, the recipe editing server 113 searches for the designated recipe from the recipe database 114, reads the recipe to be actually edited from the recipe storage unit 112, executes editing and change, and then saves the recipe in the recipe storage unit 112 and at the same time The contents can be registered in the database 114.

  The inspection result server 110 is connected to the in-factory control LAN 102, searches for inspection results according to instructions from the client computer 106 and each inspection device 103, and acquires actual inspection result data and image data from the inspection result storage unit 117. It can be read and displayed on the screen of the client computer 106 or each inspection apparatus 103.

  For example, in the case of an instruction from the inspection apparatus 103, since the instruction signal is transmitted with the inspection apparatus ID of the inspection apparatus 103 attached, only image data that has been inspected by the inspection apparatus 103 is displayed on the screen. To do.

Next, the operation of the substrate inspection system as described above will be described taking semiconductor wafer inspection as an example.
(Basic recipe setting process)
First, the operator uses the client computer 106 to access the recipe editing server 113 and edit this basic recipe.

  This is because only the basic recipe is stored in advance in the recipe storage unit 112 of the database server 105 when the defect inspection system is installed in the factory. This basic recipe describes information necessary for the inspection apparatus 103 to execute the inspection, and the inspection can be executed. However, since it is not optimized for each wafer, it is applied to all the wafers. This is because an optimum test result cannot be obtained. In particular, in a semiconductor wafer, the inside of the wafer is divided into an inspection area and a non-inspection area, and it is necessary to set an inspection area and its inspection conditions.

  The operator instructs the setting of numerical values and areas on the screen so that the inspection area of the basic recipe displayed on the screen of the client computer 106 matches the inspection area of the wafer. The recipe editing server 113 receives the information, changes the recipe information, and redisplays it.

Then, after the setting of the inspection area suitable for the wafer is completed, the operator designates the recipe name or ID and instructs the storage. The recipe editing server 113 stores the recipe edited in the designated inspection area in the recipe storage unit 112. At the same time, the recipe ID and storage location information stored in the recipe database 114 are registered.
(Substrate loading process)
When a transport carrier transported by a factory transport system (not shown) arrives at the inspection apparatus 103, the host computer 101 issues an inspection start command to the corresponding inspection apparatus 103. At this time, the lot name, type name, process name, lot ID, slot in which the wafer in the carrier is stored, and information such as each wafer ID are also sent together.
(Inspection recipe setting process)
Based on the information sent from the host computer 101, the inspection apparatus 103 inquires the recipe database 114 for the corresponding recipe via the information communication LAN 104A, and downloads the necessary recipe file. At this time, if there is a previously downloaded file in the inspection apparatus 103, it is not necessary to download it, and only matching with the latest recipe is required.
(Inspection recipe tuning process)
However, when a wafer of a type to be inspected for the first time arrives at the inspection apparatus 103, the recipe tuning suitable for the wafer is executed before the inspection sequence. This is because in the wafer manufacturing process, the reflectivity and pattern layout change depending on the process, so it is difficult to include it under one optical condition, and the product name and the optical condition specific to the process are required. .

The inspection apparatus 103 transfers one wafer of the type to be inspected for the first time to the inspection unit 108 by the transfer unit 107, and automatically performs setting of the light amount of the lamp, imaging angle, filter selection, focus adjustment, etc. An operation for searching for a condition for capturing an image of a simple wafer is executed. When one or a plurality of optical conditions are selected, these conditions are written in a recipe file and changed to a recipe file that can be inspected under optimum conditions from the next time. At this time, the changed version information is also changed in the recipe file. The changed recipe file is stored in the recipe storage unit 112 of the database server 105 via the information communication LAN 104A and is simultaneously notified to the database registration unit 111. The database registration unit 111 reads the contents of the recipe file and registers necessary information in the recipe database 114.
(Inspection process)
Based on the corresponding recipe file, the inspection apparatus 103 takes out the wafer in the slot to be inspected from the transfer carrier by the transfer unit 107 and transfers it to the inspection unit 108 in the inspection apparatus 103. The inspection unit 108 sets the optical conditions and inspection conditions described in the recipe file, captures an image of the wafer, and passes the result to the defect determination unit 109.

The defect determination unit 109 executes image processing and analysis processing based on the information of the inspection unit 108, and performs wafer quality determination according to the determination conditions described in the recipe file.
When the inspection of one wafer is completed, the inspection apparatus 103 sends the wafer inspection result and image data to the base server 105 via the information communication LAN 104A each time the inspection is completed.

The sent wafer inspection results and image data are stored in the inspection result storage unit 117 of the database server 105 and simultaneously notified to the database registration unit 111. The database registration unit 111 reads the contents of the inspection result file and registers necessary information in the inspection result database 115. In the inspection result file, along with information such as the wafer lot name, product name, process name, lot ID, slot in which the wafer in the carrier is stored, and information such as each wafer ID, instructed from the host computer 101, It includes the ID of the inspection apparatus 103, the inspection date and time, the inspection result, that is, the wafer determination result, the determination reason, the defect classification result, and various information at the time of inspection.
(Image data deletion process)
In addition, the inspection apparatus 103 erases the transmitted wafer inspection result and image data information in the storage unit 144 when transmission is completed. Alternatively, the inspection result and the information of the image data are erased in order from the one inspected in the past when the predetermined capacity is exceeded.

When these operations are repeated and the inspection of all the wafers in the lot that is stored in the carrier is inspected, the inspection apparatus 103 notifies the host computer 101 of the completion of the inspection via the factory control LAN 102. .
(Inspection result registration process)
When the inspection for all the wafers in the corresponding lot is completed, the defect determination unit 109 executes determination as a lot. For example, a determination condition such as how many defective wafers are included in a lot is set to Fail is set in advance in the recipe file, and the determination is performed based on this condition. When the inspection of the lot is completed, it is stored in the inspection result storage unit 117 and simultaneously notified to the database registration unit 111 as in the wafer inspection result.

  At this time, the determination as a lot in the transfer carrier in which the wafers are stored is such that if all the wafers in the transfer carrier are one lot, the lot becomes one lot, and a plurality of lots are included in the transfer carrier. It occurs multiple times when

  In addition, when the inspection apparatus 103 is started, shut down, or maintenance is performed, information on the status change of the inspection apparatus 103 is transmitted to the database registration unit 111 of the database server 105 via the information communication LAN 104A. Notice. The database registration unit 111 registers the contents of the device information in the device management database 116 and updates the device status history.

In this way, recipe information, inspection result information, and the state of the inspection apparatus 103 that are changed for wafers flowing in the factory are all stored and accumulated in the database server 105.
(Substrate unloading process)
When the host computer 101 recognizes that the inspection in the transport carrier is completed, the host computer 101 instructs the transport system in the factory to move the transport carrier and causes it to be carried out. In this way, wafers are being manufactured in the factory.

Next, functions and operations of the database server 105 after the operation is started will be described.
In addition, although demonstrated as a display screen of the client computer 106 below, each inspection apparatus 103 can perform the same display and has the same function.

Next, an inspection result display function will be described.
FIG. 2 is a diagram illustrating an example of a screen displayed while the inspection apparatus 1 is performing an inspection.
When the operator wants to display the inspection result, when the operator selects the button 200 “DB Server” indicating the function of displaying the lot inspection result from the main page as shown in FIG. 2, the inspection result server 110 displays the inspection result database. Information on the last registered lot inspection result is retrieved from the inspection results registered in 115, and the inspection result of the lot is displayed as shown in FIG.

  More specifically, the substrate inspection system as described with reference to FIG. 1, that is, the inspection apparatus 103 that images a wafer as an object to be inspected and inspects the defect, and the wafer imaged by the inspection apparatus 103 A substrate inspection system connected to a database server 105 for storing image data via a network executes the following defect inspection method.

  That is, the inspection apparatus 103 images a wafer and transmits the captured image data to the database server 105 together with an apparatus identifier for specifying the inspection apparatus 103 and imaging date / time information indicating the date / time of imaging. Then, the database server 105 receives the image data, the device identifier, and the imaging date / time information transmitted from the inspection device 103, and stores the received image data, the device identifier, and the imaging date / time information in the image database in association with each other.

  The inspection apparatus 103 inputs a display instruction for displaying the latest image data captured by the inspection apparatus 103, and transmits the input display instruction to the database server 105 together with the apparatus identifier. Then, the database server 105 receives the display instruction and the device identifier transmitted from the inspection device 103, searches the image database based on the received device identifier, obtains the latest image data from the current time, The searched image data to be searched is transmitted to the inspection apparatus 103.

Then, the inspection apparatus 103 receives the search target image data transmitted from the inspection apparatus 103 and displays the received search target image.
The information display section 501 in FIG. 3 displays lot-related information such as a lot name, product name, process name, lot ID, ID of the inspection apparatus 103, and inspection date and time. Further, not only the corresponding inspection apparatus information but also information such as an apparatus ID, a manufacturing apparatus name, and a recipe name related to the manufacturing apparatus subjected to the inspection is included. The information display unit 501 can be easily recognized by the operator by sharing it with other screens to be described later. Conversely, some items that are used only on other screens are not described.

  The selection unit 502 is used when it is desired to change the display condition of the currently displayed screen. When the device ID is selected, the display is changed to the latest lot inspected by the inspection device 103 having the designated device ID. This makes it possible to see the inspection result of the specific inspection apparatus 103.

  By specifying “inspection conditions”, the result of a specific inspection condition can be displayed. Since the type of defect detected varies depending on the inspection condition, it is suitable for searching for a specific defect.

  When “next lot” 503 and “previous lot” 504 are clicked, the display changes to the lot registered next to the currently displayed lot or the previous lot. When the device ID is selected, the process shifts to the next lot and the previous lot of the selected inspection device 103. When the device ID is not specified, the lot registered in the inspection result database 115 is displayed. It is designed to transition in time order.

  When “redisplay” 505 is clicked, information on the currently displayed lot is obtained again from the inspection result database 115 and updated to the latest state. This is because when displaying the latest lot, the information of all slots and lot judgment results may not be displayed if it is in the middle of the lot. Is possible. Alternatively, when the inspection apparatus 103 is displayed in a limited manner, it is possible to confirm the inspection progress status of the corresponding inspection apparatus 103.

  When “Search” 506 is clicked, a separate search screen is displayed to search for and display a specific lot by setting conditions such as a lot name, product name, process name, lot ID, ID of the inspection apparatus 103 and inspection date and time. It becomes possible to do. This makes it possible to directly display the corresponding lot when the condition of the lot to be seen is known in advance.

  The image display unit 507 displays the inspection result of the wafer included in the corresponding lot as an image. The frame of each image is displayed in red and blue according to the determination result of the wafer so that a defective wafer can be identified at a glance. In addition, since the shape of the defect is displayed overlaid on the captured image, it is possible to recognize what result has occurred in the corresponding wafer. Furthermore, since LEVEL, which is a value indicating an index of the degree of badness of an image, is displayed below the image, it can be determined which slot has become Pass or Fail to what degree. It can be recognized.

  In the determination information section 508, the determination information of the corresponding lot is displayed. The determination information displays the determination result and the number of defective wafers in the same region in the wafer together with the number of fail wafers, the total number of wafers, and the defective wafer rate that are the reasons for the determination. In the lot judgment, when the trouble of the manufacturing equipment is caused along with the number of the fail wafers, the same defect tends to occur in a specific place. Therefore, the defects are repeatedly generated in the same area with respect to the wafers in the lot. Whether or not there is a lot judgment condition.

In addition, regarding LEVEL, which is an index of the degree of defect defect displayed on the image display unit 507, the worst value in the lot can be displayed.
The slot information portion 509 displays inspection result information for each slot in the lot. Information such as the determination result of each slot, the number of defects, and the defect area is displayed in a list.

  In the lot defect information portion 510, an image in which all defective portions in the lot are overlaid is displayed. Although the captured image is not displayed on the screen of the lot defect information section 510, the defect portion is displayed by superimposing information on all slots. Thereby, it is possible to determine at a glance whether there are defects at the same place in the lot or what kinds of defects. The status of the entire lot can be judged.

  This lot inspection result display screen can be accessed from the inspection apparatus 103 in addition to the client computer 106. When accessing from the inspection apparatus 103, the apparatus ID, product name, By adding identifiers such as process names and lot IDs, the status of the lot being inspected by the inspection apparatus 103 can be displayed. Further, the application on the inspection apparatus 103 side can periodically update to the latest information by turning on the automatic update function for the Internet search application. By using this function, it is possible to reduce the device display function that is installed and activated in each of the normal inspection apparatuses 103, leading to an increase in inspection speed by reducing the load on the application on the inspection apparatus 103 side, The development of the device 103 can be shortened and the price can be reduced.

FIG. 4 is a diagram showing a display example of a lot report screen.
When a recipe creation button 511 in the selection unit 502 in FIG. 3 is pressed, a lot report screen as shown in FIG. 4 is displayed. At this time, the inspection result server 110 searches the inspection result database 115, reads all the information in the lot, and displays a screen as will be described later.

The information display unit 701 in FIG. 4 displays information on lots as in the information display unit 501 in FIG. 3, and can check the currently displayed lot and its conditions.
In the graph display unit 702, a horizontal axis is a slot number, and a vertical axis is a graph displaying the number of defects and a change in LEVEL for each inspection condition. Although FIG. 3 shows the case where the front and back surfaces of the wafer are inspected, it is also possible to display the end face inspection of the wafer and the inspection result of a specific part of the wafer portion.

  The inspection result display unit 703 displays the inspection result of each slot in detail. Information on each slot includes a slot number, a wafer inspection result, the number of defective chips, a defect area, the number of defects, the number of defects for each optical condition, a LEVEL value for each optical condition, and the like. Further, for each inspection condition, the front surface inspection, the back surface inspection, and the single surface inspection are also displayed in a table format.

In the process information section 704, information on the process before the relevant lot performs this inspection is displayed.
In the pre-semiconductor manufacturing process, since a wafer is manufactured through 20 to 50 processes, each lot passes through a plurality of processes. Therefore, knowing the information of the process before the process to be inspected plays an important role in analyzing the reason for the occurrence of the defect. In other words, the fact that a defect always exists in the same place after a specific process means that the defect in the process where the defect first occurred is caused and the defect is also generated in the subsequent process. As a countermeasure, it is important to correct the process where the defect first occurred.

  In the process information section 704, the inspection results in all the processes that have passed through the corresponding lot are displayed for each process. The display contents include the number of defects, the inspection result, LEVEL, the defect occurrence rate, the number of wafers, the number of defects occurring in the same area in the same lot, and the like.

  In addition, by designating the save button 705 in the graph display unit 702 with a mouse click or the like, the report screen can be saved in a commercially available spreadsheet software format.

  Some commercially available spreadsheet software can be used to prepare graphs for editing, tabulating and changing table values, and can be used freely by ordinary operators. Therefore, the results of the inspection result server 110 can be edited. It is possible to share information by exchanging electronic data as long as it is widely available on the market.

FIG. 5 is a view showing a display example of the slot display screen.
When each image is clicked on the image display unit 507 in FIG. 3, a slot display screen as shown in FIG. 5 is displayed. Similarly, clicking on the slot number in the slot information section 509 can transit to FIG.

At this time, the inspection result server 110 obtains information on the designated slot by searching the inspection result database 115 and displays the information on the screen shown in FIG.
The information display unit 801 shown in FIG. 5 displays the same information as the information display unit 501 shown in FIG. 3. However, information on the type, process, lot, wafer, etc. is displayed for the previously selected slot information. Is done.

  In the defect site display portion 802, an image obtained by fringing the shape of the defect at the location where the defect has occurred on the wafer, the type of inspection area on the wafer, and the area to be inspected are displayed. Further, the defect shape is color-coded for each defect classification name, and an identification name that can be identified for each optical condition and inspection condition is displayed beside the defect shape.

  The slot inspection result information section 803 displays details of the wafer inspection result. As detailed information, in addition to the wafer determination results, the number of defects, defect area, presence / absence of review of defective parts by another apparatus or inspection apparatus 103, and the determination results at that time are also displayed. The

  In the defect table 804, information on the number, area, size, and position of the defect is displayed for each defect detected on the wafer, and for each identification name displayed on the defect site display unit 802. It is displayed.

  Information about the inspection conditions for the main inspection is displayed in the inspection information section 805 for each condition. Here, information such as optical conditions such as bright field observation, dark field observation, and diffraction observation, wafer determination results, defect count, defect area, and other special measurement results for each optical condition are displayed.

  In this embodiment, the inspection apparatus 103 can inspect the entire wafer for each optical condition and detect a plurality of defects on the wafer. Further, in order to further improve the defect detection accuracy, one wafer is inspected under a plurality of optical conditions, and inspection is executed by changing the inspection conditions for each location such as the front surface, back surface, and end surface of the wafer.

  In addition, the present embodiment is premised on an inspection apparatus 103 that can determine whether a wafer is good or bad from the results of all optical conditions and inspection conditions. Therefore, the inspection information for each condition is displayed in the inspection information section 805 for each condition, and the inspection result for the wafer including all inspection conditions and optical conditions is displayed in the slot inspection result information section 803. It is like that.

  In this way, by displaying in detail the information of the inspection apparatus 103 relating to the wafer, it is possible to obtain detailed information about the result detected from the wafer, and also the review results in this inspection apparatus 103 or other apparatus. Since it can be browsed together, it can be used for analysis of defects occurring on the wafer.

FIG. 6 is a view showing a display example of the wafer report screen.
When the report creation button 806 in the slot inspection result information section 803 in FIG. 5 is clicked, the screen is changed to the wafer report screen in FIG.

  At this time, the inspection result server 110 obtains the specified slot information and the corresponding wafer inspection history information by searching the inspection result database 115, and displays the information on the screen shown in FIG.

The information display unit 1001 in FIG. 6 displays the same information as the information display unit 801 in FIG.
The defect analysis graph unit 1002 displays the defects detected from the wafer as an area ratio for each defect classification name on the graph. The defect area of each classification name with respect to the defect area of the entire wafer is displayed as a so-called Pareto chart in which the percentage is displayed in descending order (%). Such a Pareto chart is a graph used for failure analysis, and it is a technique that allows one element to see at a glance which element is caused by a defect and the cause ratio for each element. As a result, the maximum reason for the defect of the corresponding wafer and its cause can be displayed in an easily understandable manner.

  The enlarged defect display unit 1003 displays an enlarged image of the defect and the outline of the defective part in order of the largest area among the classification names caused by the most defects displayed in the defect analysis graph unit 1002. Is displayed. Normally, three classification names and three defect sites are displayed.

  By viewing the defect analysis graph unit 1002 and the defect enlarged display unit 1003, the operator can see what results are generated on the wafer and what the shape of the defects is at the same time as the wafer image. It is possible to see, and to help identify the cause of the failure.

  The defect table unit 1004 displays a list of defects for each classification name in each inspection condition. In the defect list, these defects are arranged in order of defect area for each classification name, and the number of defects, total area, classification name, and the like are displayed.

In addition, regarding the locations where defects have occurred in the same region with respect to the plurality of wafers described in the lot information, the defect information and region, the number in the region, and the defect area are displayed.
In the process information part 1005, a list of inspection histories of the same wafer is displayed. With respect to the result of inspecting the same wafer in another process, the wafer determination result, the number of defects, the defect area, and the number of defect regions are displayed for each inspection condition. After the corresponding wafer has passed through all the processes, it is easy to find information on which process on the wafer has a high defect occurrence rate.

Further, by designating the save button with a mouse click or the like, the report screen as shown in FIG. 6 can be saved in the format of a commercially available spreadsheet software.
The process defect display unit 1006 displays the defect site by color-coding the defect history displayed in the process information unit 1005 for each process. As a result, if this wafer has defects in the same location across multiple processes, the effects of defects in the previous process may affect subsequent processes, or only in a specific process. It is possible to see information that there is a defect that has occurred or that a defect in the currently displayed process has occurred without being affected by other processes. Further, since it becomes difficult to see the screen when the number of processes through which the wafer has passed increases, only the processes and inspection conditions selected by selecting the processes and inspection conditions to be displayed in the process information section 1005 and pressing the update button are displayed. Can be displayed.

FIG. 7 is a diagram illustrating a display example of the image display screen.
When an arbitrary defect portion of the defect site display unit 802 in FIG. 5 is designated by mouse click or the like, or an arbitrary identification number in the defect table 804 is designated by mouse click or the like, an image display screen as shown in FIG. 7 is displayed. .

The information display unit 1201 in FIG. 7 displays the same information as the information display unit 801 in FIG.
The enlarged image display unit 1202 displays an enlarged image centered on the defect designated in FIG. 5, and an image of a similar region in which there is no defect is displayed in the vicinity thereof.

  In the wafer, there are areas of the same pattern shape called a plurality of chips in the plane. Therefore, it is possible to compare the defective part with the normal part by extracting the chip part having no defect as a center and displaying it on the right image, for example.

  The image display control unit 1203 changes the enlargement ratio of the enlarged image, controls the display / non-display of the border representing the defective portion, displays the defect identifier, displays the chip map indicating the wafer chip area frame, and changes the optical conditions. The change of the inspection condition can be controlled, and the display state of the enlarged image display unit 1202 can be controlled.

  The display area control unit 1204 displays the position of the currently displayed enlarged image on the wafer. In addition, the display position can be changed by designating another area with a mouse click or the like.

  When the screen of FIG. 7 is displayed, the positions of the left and right images currently displayed on the enlarged image display unit 1202 are displayed on the wafer. If the operator designates another location, the area is displayed. The centered image is displayed again, for example, on the left side of the enlarged image display unit 1202. In addition, since the position where the defect is detected is displayed on the display area control unit 1204, it is possible to select and display an arbitrary defect portion.

  The inspection result display unit 1205 displays information such as the defect identifier, defect area, defect position, and size of the currently displayed target defect and information on the inspection optical conditions. When another defect portion is designated by the mouse click or the like in the display area control unit 1204, the defect is displayed at the center of the right screen of the enlarged image display unit 1202 and designated in the inspection result display unit 1205. The information of the defect is displayed.

  If there are other images and inspection results for the currently displayed defect, the review information display unit 1206 displays the review image, the device name, and the determination result. This review includes a case where the inspection apparatus 103 itself captures an image again and a review result from apparatuses such as an optical microscope, a laser microscope, AFM, SEM, and OCD. If there is a review result that exists on the wafer other than the corresponding defect, the review result is displayed at the bottom of the list by changing the color, for example.

  The review image display unit 1207 displays an enlarged image of the review image selected by the review information display unit 1206. The first image in the first list is displayed, and the latest image is displayed. As a result, the image is displayed on the enlarged image display unit 1202. The defect image and the review image of the defect can be viewed at a time, and the operator can analyze and confirm the type and cause of the defect from various information.

Next, the inspection report function will be described.
FIG. 8 is a diagram illustrating a display example of the inspection result list screen.
The list selection unit 1401 in FIG. 8 can select the type of list display, a working list for all inspection results, a machine list limited to inspection by a specific inspection apparatus 103, a specific list A product list limited to a product name, a process list limited to a specific process, and a recipe list limited to a recipe specifying a product name and a process can be selected.

In the information display unit 1402, the examination conditions are displayed as in the other screens.
The report control unit 1403 can specify a period, an apparatus, a product name, a process, a recipe type, and a version in order to further limit elements to be reported.

  Further, by designating the list display button 1405 by clicking the mouse or the like, the corresponding list is displayed again at the bottom of the screen. Initially, all inspection results selected by the list selection unit 1401 are targeted, but by adding a restriction condition by the report control unit 1403, further narrowed inspection can be performed. However, since there are cases where it is not possible to narrow down as the inspection results become enormous, the number of lists displayed in the list section 1404 is limited to 200, and thereafter, the display response speed is increased without searching.

  The list section 1404 at the bottom of the screen displays information such as the time, product name, process name, recipe name, and inspection device name of the corresponding inspection result. For example, among the results of the inspection result server 110 searching the inspection result database 115 with the corresponding search conditions, the first 200 hits are displayed.

FIG. 9 is a diagram illustrating a display example of a report display screen.
When the report creation button 1406 is designated, the inspection result server 110 searches the inspection result database 115 again with the corresponding search conditions, analyzes the data, and transitions to the report display screen 800 as shown in FIG.

The information display unit 1501 in FIG. 9 displays information on the corresponding product name, process, and lot.
The statistical graph unit 1502 displays a graph centered on statistical information of the examination result that is the search target. In the lot outline graph, time is plotted on the horizontal axis, and the number of inspected lots, defect rate, LEVEL, etc. are displayed as a bar graph or a line graph with the vertical axis, and the lot transition is displayed.

  In the apparatus outline graph, the horizontal axis is the time axis, the number of lots for each inspection apparatus 103, the defect rate, LEVEL, etc. are displayed as a bar graph or a line graph with the vertical axis, so that the difference by the inspection apparatus 103 can be seen. It has become.

  In the process summary graph, the horizontal axis is the time axis, the number of lots inspected for each process, the defect rate, LEVEL, etc. are displayed as bar graphs or line graphs with the vertical axis, so that the differences between processes can be seen. It has become.

In the yield graph, the defect rate of the corresponding inspection is displayed as a pie chart.
In the recipe summary graph, the horizontal axis indicates the type of recipe that has been inspected, and the vertical axis indicates the number of lots, defect rate, LEVEL, etc. for each recipe. ing.

  In the apparatus outline graph, the apparatus ID of the inspection apparatus 103 is shown on the horizontal axis, and the number of lots, the defect rate, LEVEL, etc. of each inspection apparatus 103 are displayed on the vertical axis as a bar graph or a line graph. Can be understood.

In the statistical information section 1503, a list of search data for displaying the graph is displayed, and all the detailed data of each graph is displayed.
Further, by designating the save button with a mouse click or the like, the report screen as shown in FIG. 9 can be saved in the format of a commercially available spreadsheet software.

  The report display screen 800 can be changed to a full history report, a specific month report, a specific week report, or a specific day report by selecting a button in the information display unit 801. By creating these reports, it is possible to identify differences in the frequency of occurrence of defects based on product changes in the factory, equipment, products, recipes, etc., and create and view reports regularly This makes it possible to manage and analyze product yields.

FIG. 10 is a diagram showing a display example of the login screen, and FIG. 11 is a diagram showing a display example of the main screen after login.
In order to access the database server 105 from the client computer 106 shown in FIG. 1, a URL address designated by using a normal Internet application is accessed. Then, the user name 201 and the login password 202 are input on the login screen as shown in FIG. 10 by the Web service function of the inspection result server 110, and the main screen as shown in FIG. 11 is displayed. Further, when accessing from the inspection apparatus 103, the ID / password connected as a special login user is transmitted when the apparatus is activated. Apart from access from the inspection apparatus 103, the server can be operated from another computer using a browser. In this case, the server displays a login screen as shown in FIG. 10 connected to the URL.

  The database server 105 has four login modes depending on the user name, and the functions accessible in each mode are different. The first is an operator mode, in which only search and display of images and device states function. The second is a staff mode, which enables recipe editing and editing in addition to the operator mode function. The third mode is a maintenance mode. In addition to the staff mode, a login user can be changed or added, and a server function can be set. The fourth is an administrator mode, in which all settings and changes are possible. By setting these four modes, the system state is protected from being changed by the operation in the operator mode with the highest use frequency.

FIG. 11 is a diagram illustrating a display example of the main page displayed by the inspection result server 110.
When logging in, the inspection result server 110 shown in FIG. 1 displays the main page, and the operator can select any of the inspection result 301, recipe editing 302, and apparatus management 303 services. When the selected service is related to the recipe, the URL automatically moves to the URL of the recipe editing server 113, and can move without being conscious of between the inspection result server 110 and the recipe editing server 113. It is.

Here, the image inspection function transitioned from the main page will be described.
The image inspection function can select an inspection result display 304, an inspection report display 305, a report edit 300, and a DB edit 307 as the inspection result 301.

Next, report editing will be described with reference to FIG.
FIG. 12 is a diagram illustrating a display example of a report editing screen.
The report selection unit 1601 in FIG. 12 selects the report type, period, name, number of graphs, and the like. As the type of report, every product, every process, every recipe, every device, etc. can be selected. All report periods can be selected from monthly, weekly, and daily units. Then, the report to be edited is specified by the type and period of the report. In addition, when a name is assigned to each report, it is also possible to select by name.

  The graph detail setting unit 1602 can set the meaning of the graph to be displayed. Select whether the graph to be displayed is a pie graph or a normal graph, and what the unit axis is set to. The unit axis corresponds to the X axis of the graph and indicates time, process, recipe, device ID, and the like.

  In the case of a pie chart, the target to be displayed and the type of division can be selected. For example, if the defect rate is targeted and the division is classified as a defect classification type, the defect rate for each defect type can be displayed as a pie chart.

  In the case of a normal graph, it is possible to select a target and a split item to be displayed on a bar graph and a target and a type to be displayed on a line graph. For example, the unit axis of the graph is the date, the number of lots inspecting the target of the bar graph, and the division are the determination results. When the target of the line graph is the maximum value, minimum value, and average value of LEVEL, the lot outline graph of FIG. 9 can be displayed.

In this way, by resetting the contents of each graph in detail, the contents of the graph displayed on the report screen of FIG. 9 can be arbitrarily changed.
FIG. 13 is a diagram illustrating a display example for explaining the automatic report function.

  As an automatic report function, there is also a screen that allows you to select whether to automatically generate each report on the screen as shown in Fig. 13 and set who to notify by e-mail when a report is created. Daily / Weekly / By automatically creating a report with Monthly etc. and sending the created information to the concerned person by e-mail, it is possible to save the operator's trouble and prevent the creation and confirmation omission of the report. It becomes possible.

  The operator who has received the e-mail can use the link URL address described in the e-mail to view the report via the Internet and save it in his personal computer as spreadsheet software. And by accumulating this, it becomes possible to manage and verify the yield in the factory.

FIG. 14 is a diagram illustrating a display example of the DB maintenance screen.
The DB maintenance function will be described with reference to FIG.
Since the inspection result database 115 and the inspection result storage unit 117 in FIG. 1 have a finite capacity, the capacity becomes full during continuous use. Therefore, a screen for designating when to delete them is the DB maintenance screen of FIG.

  In FIG. 14, the protect item section 1801 can designate a wafer ID and lot ID to be permanently stored. The wafer ID and lot ID information designated here is not permanently deleted, and is always stored in the inspection result database 115 and the inspection result storage unit 117.

  In the protected product section 1802, a product name to be stored can be designated. The data of the product name designated here is not normally deleted, but is preferentially stored in the inspection result database 115 or the inspection result storage unit 117. However, if the storage area is filled with only the product name specified here, it is erased from the oldest.

  The deletion control unit 1803 can set conditions for deleting data. When the data base expiration date is exceeded, the data is transferred to the inspection result database 115 and removed from the DB. As a result, old data is removed from the inspection target, so that the DB search speed can be maintained.

  Next, when the archive storage period expires, the data in the inspection result database 115 is deleted and cannot be restored to the database. When the data storage time limit is exceeded, all information is deleted from the inspection result storage unit 117.

By setting at which timing to search whether or not these conditions are met, the search can be executed every day at the same time and the corresponding data can be deleted.
Apart from this, it is also possible to set a capacity limit so that database deletion and data deletion can be automatically executed when the storage area becomes less than a prescribed capacity.

  In this way, by regularly monitoring the data volume, it is possible to suppress a system down due to server capacity saturation and a decrease in search speed, and a good server function can be obtained.

  That is, the present invention is not limited to the above-described embodiments and the like, and can take various configurations or shapes without departing from the gist of the present invention.

It is a figure which shows the structure of the defect inspection system to which this invention is applied. It is a figure which shows the example of a screen currently displayed while the test | inspection apparatus 1 is performing test | inspection. It is a figure which shows the example of a display of a lot inspection result display screen. It is a figure which shows the example of a display of a lot report screen. It is a figure which shows the example of a display of a slot display screen. It is a figure which shows the example of a display of a wafer report screen. It is a figure which shows the example of a display of an image display screen. It is a figure which shows the example of a display of a test result list screen. It is a figure which shows the example of a display of a report display screen. It is a figure which shows the example of a display of a login screen. It is a figure which shows the example of a display of the main screen after login. It is a figure which shows the example of a display of a report edit screen. It is a figure which shows the example of a display for demonstrating an automatic report function. It is a figure which shows the example of a display of a DB maintenance screen.

Explanation of symbols

101 Host computer 102 Factory control LAN
103 Inspection Device 104A, 104B Information Communication LAN
DESCRIPTION OF SYMBOLS 105 Database server 106 Client computer 107 Conveyance part 108 Inspection part 109 Defect determination part 110 Inspection result server 111 Database registration part 112 Recipe storage part 113 Recipe edit server 114 Recipe database 115 Inspection result database 116 Apparatus management database 117 Inspection result storage part 118 Database Unit 144 Storage unit 145 Control unit 146 Display unit 200 Button 201 User name 202 Login password 301 Inspection result 302 Recipe editing 303 Device management 304 Inspection result display 305 Inspection report display 306 Report editing 307 DB editing 501 Information display unit 502 Selection unit 503 Next Lot 504 Previous lot 505 Redisplay 506 Search 507 Image display part 508 Judgment information part 509 511 Information display unit 511 Recipe creation button 701 Information display unit 702 Graph display unit 703 Inspection result display unit 704 Process information unit 705 Save button 801 Information display unit 802 Defective part display unit 803 Slot inspection result information unit 804 Defect Table 805 Conditional inspection information part 806 Report creation button 1001 Information display part 1002 Defect analysis graph part 1003 Defect enlarged display part 1004 Defect table part 1005 Process information part 1006 Process defect display part 1201 Information display part 1202 Enlarged image display part 1203 Image display Control unit 1204 Display area control unit 1205 Inspection result display unit 1206 Review information display unit 1207 Review image display unit 1401 List selection unit 1402 Information display unit 1403 Report control unit 1404 List section 1405 List display button 1406 Report creation button 1501 Information display section 1502 Statistics graph section 1503 Statistics information section 1601 Report selection section 1602 Graph details setting section 1801 Protect item section 1802 Protect product section 1803 Deletion control section

Claims (10)

A substrate inspection system for storing image data of a substrate imaged by a plurality of substrate inspection apparatuses in a database server connected by a network line,
The substrate inspection apparatus transmits image data captured every time the substrate is imaged, an apparatus identifier for identifying the substrate inspection apparatus, and imaging date / time information indicating the imaging date / time as information associated with the database server. And each time transmission of the transmitted information is completed, or when the capacity of the transmitted information exceeds a predetermined capacity of the storage unit of the substrate inspection apparatus, the storage unit of the substrate inspection apparatus A substrate inspection system comprising a control unit for erasing information. The database server includes an inspection result storage unit that stores the image data;
In response to an instruction to display the latest image data from the substrate inspection apparatus, the image data stored latest from the apparatus identifier and the latest imaging date / time information is read from the inspection result storage unit and transmitted to the substrate inspection apparatus. A test result server to
The board inspection system according to claim 1, further comprising:   The board inspection apparatus includes a display unit that displays image data transmitted from the database server, and an instruction to display the latest image data from the board inspection apparatus is performed by a button on the GUI of the display unit. The board inspection system according to claim 2, wherein:   A client PC for tuning the database server is connected via a network, and the database server displays a search target image of the board inspection apparatus and changes a display content according to an instruction from the client PC. The board inspection system according to claim 1, wherein the board inspection system is executed.   The network line includes a factory control LAN for exchanging information in the factory, and a dedicated information communication LAN for transmitting and receiving the image data from the board inspection device to the database server. The board | substrate inspection system of any one of Claim 1 to 4.   6. The substrate inspection system according to claim 5, wherein the information communication LAN includes two lines, a normal line for transferring a large amount of information and a line provided as a countermeasure when a failure occurs in the normal line. .   2. The storage unit of the substrate inspection apparatus has a backup storage capacity capable of storing the information for at least several inspections of the image data in case the image data cannot be sent. 7. The substrate inspection system according to any one of items 6 to 6. A defect inspection system in which a plurality of substrate inspection devices that image a substrate and inspect a defect and a database server that stores image data of the inspection object imaged by the substrate inspection device are connected via a network. A substrate inspection method,
Each time the substrate inspection apparatus captures an image of the substrate, the database server as information in which captured image data, an apparatus identifier for specifying the substrate inspection apparatus, and imaging date / time information indicating the date / time of imaging are associated with each other An image data transmission step for transmitting to the image data and storing the image data;
Each time the image data transmission step is completed, or when the information transmitted by the image data transmission step exceeds a predetermined capacity of the storage unit of the substrate inspection device, the information of the substrate inspection device is deleted. An image data erasing process to perform,
A substrate inspection method comprising: In response to an instruction to display the latest image data from the substrate inspection apparatus, the database server reads the stored image data corresponding to the apparatus identifier of the substrate inspection apparatus and the latest imaging date / time information. The latest inspection information transmission process to be transmitted to the inspection device;
The latest inspection image display step that the display unit of the substrate inspection apparatus displays based on the information transmitted in the latest inspection information transmission step,
The substrate inspection method according to claim 8, comprising:   A client PC for tuning the database server is connected via a network, and the database server displays a search target image display step for displaying a search target image of the substrate inspection apparatus and a display in the search target image display step. The substrate inspection method according to claim 8, further comprising: a display change step for changing contents, wherein the searched image display step and the display change step are executed according to an instruction from the client PC.