JPS62203308A - 複合部品 - Google Patents
複合部品Info
- Publication number
- JPS62203308A JPS62203308A JP4556686A JP4556686A JPS62203308A JP S62203308 A JPS62203308 A JP S62203308A JP 4556686 A JP4556686 A JP 4556686A JP 4556686 A JP4556686 A JP 4556686A JP S62203308 A JPS62203308 A JP S62203308A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- coil
- external lead
- terminals
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 title claims description 5
- 238000004804 winding Methods 0.000 claims description 11
- 238000005476 soldering Methods 0.000 claims description 9
- 239000003990 capacitor Substances 0.000 abstract description 17
- 229910000679 solder Inorganic materials 0.000 abstract description 10
- 238000003780 insertion Methods 0.000 abstract description 7
- 230000037431 insertion Effects 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 4
- 238000007598 dipping method Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4556686A JPS62203308A (ja) | 1986-03-03 | 1986-03-03 | 複合部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4556686A JPS62203308A (ja) | 1986-03-03 | 1986-03-03 | 複合部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62203308A true JPS62203308A (ja) | 1987-09-08 |
| JPH0521323B2 JPH0521323B2 (US20090163788A1-20090625-C00002.png) | 1993-03-24 |
Family
ID=12722898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4556686A Granted JPS62203308A (ja) | 1986-03-03 | 1986-03-03 | 複合部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62203308A (US20090163788A1-20090625-C00002.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6195879B1 (en) * | 1996-01-23 | 2001-03-06 | Funai Electric Company, Ltd. | Method for mounting wire-wound component on a printed circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5730831U (US20090163788A1-20090625-C00002.png) * | 1980-07-25 | 1982-02-18 |
-
1986
- 1986-03-03 JP JP4556686A patent/JPS62203308A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5730831U (US20090163788A1-20090625-C00002.png) * | 1980-07-25 | 1982-02-18 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6195879B1 (en) * | 1996-01-23 | 2001-03-06 | Funai Electric Company, Ltd. | Method for mounting wire-wound component on a printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0521323B2 (US20090163788A1-20090625-C00002.png) | 1993-03-24 |
