JPS62199264U - - Google Patents

Info

Publication number
JPS62199264U
JPS62199264U JP8456786U JP8456786U JPS62199264U JP S62199264 U JPS62199264 U JP S62199264U JP 8456786 U JP8456786 U JP 8456786U JP 8456786 U JP8456786 U JP 8456786U JP S62199264 U JPS62199264 U JP S62199264U
Authority
JP
Japan
Prior art keywords
solder
temperature
amount
command pulse
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8456786U
Other languages
English (en)
Japanese (ja)
Other versions
JPH037073Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986084567U priority Critical patent/JPH037073Y2/ja
Publication of JPS62199264U publication Critical patent/JPS62199264U/ja
Application granted granted Critical
Publication of JPH037073Y2 publication Critical patent/JPH037073Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1986084567U 1986-06-03 1986-06-03 Expired JPH037073Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986084567U JPH037073Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-06-03 1986-06-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986084567U JPH037073Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-06-03 1986-06-03

Publications (2)

Publication Number Publication Date
JPS62199264U true JPS62199264U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-12-18
JPH037073Y2 JPH037073Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-02-21

Family

ID=30939185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986084567U Expired JPH037073Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-06-03 1986-06-03

Country Status (1)

Country Link
JP (1) JPH037073Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4940261A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1972-08-25 1974-04-15
JPS54117998A (en) * 1978-03-06 1979-09-13 Toshiba Corp Laser working device
JPS56146831A (en) * 1980-04-14 1981-11-14 Hitachi Ltd Temperature controlling method for continuous heat treatment apparatus
JPS5717369A (en) * 1980-07-04 1982-01-29 Toshiba Corp Method for soldering by laser
JPS57111089A (en) * 1980-12-27 1982-07-10 Omron Tateisi Electronics Co Method of sodering chip part
JPS57193277A (en) * 1981-05-25 1982-11-27 Toshiba Corp Soldering device by laser
JPS58122175A (ja) * 1982-01-18 1983-07-20 Nec Corp ハンダ付け装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4940261A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1972-08-25 1974-04-15
JPS54117998A (en) * 1978-03-06 1979-09-13 Toshiba Corp Laser working device
JPS56146831A (en) * 1980-04-14 1981-11-14 Hitachi Ltd Temperature controlling method for continuous heat treatment apparatus
JPS5717369A (en) * 1980-07-04 1982-01-29 Toshiba Corp Method for soldering by laser
JPS57111089A (en) * 1980-12-27 1982-07-10 Omron Tateisi Electronics Co Method of sodering chip part
JPS57193277A (en) * 1981-05-25 1982-11-27 Toshiba Corp Soldering device by laser
JPS58122175A (ja) * 1982-01-18 1983-07-20 Nec Corp ハンダ付け装置

Also Published As

Publication number Publication date
JPH037073Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-02-21

Similar Documents

Publication Publication Date Title
EP0118091B1 (en) Automatic wave soldering machine
US4121087A (en) Method and apparatus for controlling laser welding
JP3622714B2 (ja) 加工方法
JPS6186069A (ja) 自動はんだ付けシステムの制御装置
CN112139620B (zh) 一种全自动控制选择性波峰焊接的装置及方法
JPS62199264U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2018176246A (ja) レーザー式はんだ付け方法及びレーザー式はんだ付け装置
DE102020113788A1 (de) Lötvorrichtung zum Löten durch Laserlicht und mit einer Lötvorrichtung versehene Robotervorrichtung
KR100524253B1 (ko) 첨두 에너지를 가진 펄스 변조형 Nd-YAG 레이저를 이용한 벨로즈 용접
CN111069773B (zh) 一种光功率自动调节方法及其系统
JPS63309370A (ja) はんだ付方法
JPS62172791A (ja) リフロ−式ハンダ付方法及び装置
JPH0232070B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS61172669A (ja) 自動はんだ付けシステムの制御方法
JPS62292266A (ja) レ−ザはんだ付け方法
JPH0736474U (ja) レーザビームを利用した半田付け装置
JPH11330686A (ja) リフロー装置及びリフロー温度測定方法、リフロー方法
JPH01321072A (ja) リフロー式はんだ付け装置
JPH0144221Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS6343785A (ja) レ−ザビ−ム接合装置
JPS6254844B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0556237B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0832226A (ja) レーザーリフロー装置及び方法
JPH0829406B2 (ja) 自動ろう付装置
JPH05208266A (ja) こて式自動はんだ付け装置