JPS62197863U - - Google Patents
Info
- Publication number
- JPS62197863U JPS62197863U JP8606186U JP8606186U JPS62197863U JP S62197863 U JPS62197863 U JP S62197863U JP 8606186 U JP8606186 U JP 8606186U JP 8606186 U JP8606186 U JP 8606186U JP S62197863 U JPS62197863 U JP S62197863U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- water cooling
- insulating material
- thermally conductive
- cooling fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000000498 cooling water Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Description
第１図は、この考案の第１の実施例を示す半導
体装置用水冷フインの構成図、第２図は、この考
案の第２の実施例を示す半導体装置用水冷フイン
の製造法を示す説明図、第３図Ａ，Ｂは、従来の
半導体装置用水冷フインを用いた半導体スタツク
を示す構成図である。
１……半導体装置用水冷フイン、２……放熱体
ブロツク、４……平形半導体素子、１３……冷却
水用パイプ。なお、各図中、同一符号は同一また
は相当部分を示す。
FIG. 1 is a configuration diagram of a water cooling fin for a semiconductor device showing a first embodiment of this invention, and FIG. 2 is an explanation showing a manufacturing method of a water cooling fin for a semiconductor device showing a second embodiment of this invention. 3A and 3B are configuration diagrams showing a semiconductor stack using a conventional water cooling fin for semiconductor devices. DESCRIPTION OF SYMBOLS 1... Water cooling fin for semiconductor device, 2... Heat sink block, 4... Flat semiconductor element, 13... Cooling water pipe. In each figure, the same reference numerals indicate the same or corresponding parts.
Claims (1)
を備えた半導体装置用水冷フインにおいて、前記
冷却水用パイプを高熱伝導性絶縁材料で形成した
ことを特徴とする半導体装置用水冷フイン。 ２ 上記高熱伝導性絶縁材料が酸化アルミニウム
若しくは窒化アルミニウムであることを特徴とす
る実用新案登録請求の範囲第１項記載の半導体装
置用水冷フイン。[Claims for Utility Model Registration] 1. A water cooling fin for a semiconductor device comprising a cooling water pipe penetrating through a heat sink block, characterized in that the cooling water pipe is made of a highly thermally conductive insulating material. Water cooling fins for equipment. 2. The water cooling fin for a semiconductor device according to claim 1, wherein the highly thermally conductive insulating material is aluminum oxide or aluminum nitride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8606186U JPS62197863U (en) | 1986-06-07 | 1986-06-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8606186U JPS62197863U (en) | 1986-06-07 | 1986-06-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62197863U true JPS62197863U (en) | 1987-12-16 |
Family
ID=30942026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8606186U Pending JPS62197863U (en) | 1986-06-07 | 1986-06-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62197863U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010103582A (en) * | 2004-03-31 | 2010-05-06 | Dowa Holdings Co Ltd | Aluminum bonding member |
-
1986
- 1986-06-07 JP JP8606186U patent/JPS62197863U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010103582A (en) * | 2004-03-31 | 2010-05-06 | Dowa Holdings Co Ltd | Aluminum bonding member |
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