JPS6219747U - - Google Patents

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Publication number
JPS6219747U
JPS6219747U JP11203485U JP11203485U JPS6219747U JP S6219747 U JPS6219747 U JP S6219747U JP 11203485 U JP11203485 U JP 11203485U JP 11203485 U JP11203485 U JP 11203485U JP S6219747 U JPS6219747 U JP S6219747U
Authority
JP
Japan
Prior art keywords
semiconductor chip
semiconductor device
current fuse
current
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11203485U
Other languages
English (en)
Other versions
JPH0343721Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985112034U priority Critical patent/JPH0343721Y2/ja
Publication of JPS6219747U publication Critical patent/JPS6219747U/ja
Application granted granted Critical
Publication of JPH0343721Y2 publication Critical patent/JPH0343721Y2/ja
Expired legal-status Critical Current

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Breakers (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例に係わるヒユーズ内蔵
ダイオードを示す平面図、第２図は第１図のＡ―
Ａ線に相当する部分の断面図、第３図及び第４図
は第１図及び第２図のダイオードの製造方法を説
明するための断面図、第５図は本考案の変形例の
ヒユーズ内蔵ダイオードを示す平面図、第６図は
第５図のＢ―Ｂ線に相当する部分の断面図、第７
図は従来のヒユーズ内蔵ダイオードの樹脂封止前
の状態を示す平面図、第８図は樹脂封止後を示す
平面図である。 １５……ダイオードチツプ、１６……電流ヒユ
ーズ、１７……光不透過性保護樹脂、１８……透
明性保護樹脂、１９……透明性封止樹脂。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体チツプとこの半導体チツプの電流路に接
    続された電流ヒユーズとが一体に絶縁物封止され
    た半導体装置において、 前記半導体チツプは外来光から遮へいされ、前
    記電流ヒユーズの少なくとも溶断する部分は外部
    から目視できるように構成されていることを特徴
    とする過電流保護機能を有する半導体装置。
JP1985112034U 1985-07-22 1985-07-22 Expired JPH0343721Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985112034U JPH0343721Y2 (ja) 1985-07-22 1985-07-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985112034U JPH0343721Y2 (ja) 1985-07-22 1985-07-22

Publications (2)

Publication Number Publication Date
JPS6219747U true JPS6219747U (ja) 1987-02-05
JPH0343721Y2 JPH0343721Y2 (ja) 1991-09-12

Family

ID=30992523

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985112034U Expired JPH0343721Y2 (ja) 1985-07-22 1985-07-22

Country Status (1)

Country Link
JP (1) JPH0343721Y2 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5730351A (en) * 1980-07-30 1982-02-18 Nec Corp Resin-sealed type semiconductor device
JPS57166346U (ja) * 1981-04-13 1982-10-20

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5730351A (en) * 1980-07-30 1982-02-18 Nec Corp Resin-sealed type semiconductor device
JPS57166346U (ja) * 1981-04-13 1982-10-20

Also Published As

Publication number Publication date
JPH0343721Y2 (ja) 1991-09-12

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