JPS62193784U - - Google Patents
Info
- Publication number
- JPS62193784U JPS62193784U JP8104786U JP8104786U JPS62193784U JP S62193784 U JPS62193784 U JP S62193784U JP 8104786 U JP8104786 U JP 8104786U JP 8104786 U JP8104786 U JP 8104786U JP S62193784 U JPS62193784 U JP S62193784U
- Authority
- JP
- Japan
- Prior art keywords
- dielectric substrate
- conductor carrier
- integrated circuit
- microwave integrated
- linear expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 230000005484 gravity Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Landscapes
- Design And Manufacture Of Integrated Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
従来構造の断面図、第３図は従来構造の他の例を
示す断面図である。
１……第１の誘電体基板、２……第２の誘電体
基板、３……第１の導体キヤリア、４……第２の
導体キヤリア、１１……第１の誘電体基板、１２
……第２の誘電体基板、１３……第１の導体キヤ
リア、１４……第２の導体キヤリア、１５……導
体キヤリア。
FIG. 1 is a sectional view of one embodiment of the present invention, FIG. 2 is a sectional view of a conventional structure, and FIG. 3 is a sectional view of another example of the conventional structure. DESCRIPTION OF SYMBOLS 1...First dielectric substrate, 2...Second dielectric substrate, 3...First conductor carrier, 4...Second conductor carrier, 11...First dielectric substrate, 12
... second dielectric substrate, 13 ... first conductor carrier, 14 ... second conductor carrier, 15 ... conductor carrier.
Claims (1)
１及び第２の誘電体基板を導体キヤリアを用いて
実装してなるマイクロ波集積回路において、前記
第１の誘電体基板をこれと線膨脹率が略等しい第
１の導体キヤリアに搭載するとともに、前記第１
の導体キヤリアに搭載しかつ第２の誘電体基板と
線膨脹率が略等しい第２の導体キヤリア上に前記
第２の誘電体基板を搭載したことを特徴とするマ
イクロ波集積回路。 (2) 第１の導体キヤリアに比重の小さい材質を
選択してなる実用新案登録請求の範囲第１項記載
のマイクロ波集積回路。[Claims for Utility Model Registration] (1) In a microwave integrated circuit formed by mounting first and second dielectric substrates equipped with a necessary circuit and necessary electrical components using a conductor carrier, the first A dielectric substrate is mounted on a first conductor carrier having a coefficient of linear expansion substantially equal to that of the dielectric substrate, and
A microwave integrated circuit characterized in that the second dielectric substrate is mounted on a second conductor carrier having substantially the same coefficient of linear expansion as the second dielectric substrate. (2) The microwave integrated circuit according to claim 1, wherein a material with low specific gravity is selected for the first conductor carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8104786U JPH0546310Y2 (en) | 1986-05-30 | 1986-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8104786U JPH0546310Y2 (en) | 1986-05-30 | 1986-05-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62193784U true JPS62193784U (en) | 1987-12-09 |
| JPH0546310Y2 JPH0546310Y2 (en) | 1993-12-03 |
Family
ID=30932422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8104786U Expired - Lifetime JPH0546310Y2 (en) | 1986-05-30 | 1986-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0546310Y2 (en) |
-
1986
- 1986-05-30 JP JP8104786U patent/JPH0546310Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0546310Y2 (en) | 1993-12-03 |
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