JPS62193763U - - Google Patents
Info
- Publication number
- JPS62193763U JPS62193763U JP8332386U JP8332386U JPS62193763U JP S62193763 U JPS62193763 U JP S62193763U JP 8332386 U JP8332386 U JP 8332386U JP 8332386 U JP8332386 U JP 8332386U JP S62193763 U JPS62193763 U JP S62193763U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounting structure
- conductive pattern
- electronic components
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第1図は、本考案に係る電子部品の取付構造を
示す側面図、第2図は、従来の電子部品の取付構
造を示す側面図である。
11……導電性パターン、13……半田、14
……電子部品、15……電極、16……紫外線硬
化用ゴム。
FIG. 1 is a side view showing an electronic component mounting structure according to the present invention, and FIG. 2 is a side view showing a conventional electronic component mounting structure. 11... Conductive pattern, 13... Solder, 14
...electronic parts, 15...electrodes, 16...rubber for ultraviolet curing.
Claims (1)
た電極を、半田溶融して取付けるようにした電子
部品の取付構造において、導電性パターンに電子
部品を、予め紫外線硬化用ゴムで固定したことを
特徴とする電子部品の取付構造。 An electronic component mounting structure in which electronic components are attached to a conductive pattern by melting solder with electrodes provided at both ends of the electronic component, characterized in that the electronic component is fixed to the conductive pattern in advance with ultraviolet curing rubber. Mounting structure for electronic components.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8332386U JPS62193763U (en) | 1986-05-30 | 1986-05-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8332386U JPS62193763U (en) | 1986-05-30 | 1986-05-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62193763U true JPS62193763U (en) | 1987-12-09 |
Family
ID=30936804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8332386U Pending JPS62193763U (en) | 1986-05-30 | 1986-05-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62193763U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0424993A (en) * | 1990-05-15 | 1992-01-28 | Tamura Seisakusho Co Ltd | Soldering for preventing solder crack |
-
1986
- 1986-05-30 JP JP8332386U patent/JPS62193763U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0424993A (en) * | 1990-05-15 | 1992-01-28 | Tamura Seisakusho Co Ltd | Soldering for preventing solder crack |