JPS6389252U - - Google Patents
Info
- Publication number
- JPS6389252U JPS6389252U JP18280686U JP18280686U JPS6389252U JP S6389252 U JPS6389252 U JP S6389252U JP 18280686 U JP18280686 U JP 18280686U JP 18280686 U JP18280686 U JP 18280686U JP S6389252 U JPS6389252 U JP S6389252U
- Authority
- JP
- Japan
- Prior art keywords
- base member
- package
- chassis
- sub
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 3
- 229910052751 metal Inorganic materials 0.000 claims 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第1図は本考案の一実施例の縦断面図、第2図
は本考案における実装状態の縦断面図、第3図は
従来構造の縦断面図、第4図はその実装状態の縦
断面図である。
1……搭載部品、2……ベース部材、3……サ
ブシヤーシ、4……取付金具、5……ねじ、6…
…リードピン、7……無酸素銅板、11……搭載
部品、12……ベース部材、13……サブシヤー
シ、14……取付金具、15……ねじ、16……
リードピン。
Fig. 1 is a longitudinal cross-sectional view of an embodiment of the present invention, Fig. 2 is a longitudinal cross-sectional view of the mounted state of the present invention, Fig. 3 is a longitudinal cross-sectional view of the conventional structure, and Fig. 4 is a longitudinal cross-sectional view of the mounted state. It is a diagram. 1...Mounted parts, 2...Base member, 3...Sub chassis, 4...Mounting bracket, 5...Screw, 6...
... Lead pin, 7 ... Oxygen-free copper plate, 11 ... Mounted parts, 12 ... Base member, 13 ... Sub chassis, 14 ... Mounting bracket, 15 ... Screw, 16 ...
lead pin.
Claims (1)
るとともに、このベース部材をサブシヤーシに接
触させて実装を行うパツケージにおいて、前記ベ
ース部材は前記サブシヤーシとの実装面に軟性の
金属板をろー材で一体に取着したことを特徴とす
るパツケージ。 (2) 軟性の金属板は無酸素銅板であり、これを
銀ろー材で金属性ベース部材に取着してなる実用
新案登録請求の範囲第1項記載のパツケージ。[Claims for Utility Model Registration] (1) In a package in which mounting components are fixed to a highly rigid base member and mounting is carried out by bringing this base member into contact with a sub-chassis, the base member is mounted on a mounting surface with the sub-chassis. A package cage characterized by a soft metal plate integrally attached with a filter material. (2) The package according to claim 1, wherein the soft metal plate is an oxygen-free copper plate, which is attached to a metal base member using a silver filler.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18280686U JPS6389252U (en) | 1986-11-29 | 1986-11-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18280686U JPS6389252U (en) | 1986-11-29 | 1986-11-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6389252U true JPS6389252U (en) | 1988-06-10 |
Family
ID=31128948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18280686U Pending JPS6389252U (en) | 1986-11-29 | 1986-11-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6389252U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008166405A (en) * | 2006-12-27 | 2008-07-17 | Funai Electric Co Ltd | Electronic equipment and substrate mounting structure |
-
1986
- 1986-11-29 JP JP18280686U patent/JPS6389252U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008166405A (en) * | 2006-12-27 | 2008-07-17 | Funai Electric Co Ltd | Electronic equipment and substrate mounting structure |
JP4687646B2 (en) * | 2006-12-27 | 2011-05-25 | 船井電機株式会社 | Electronic equipment and board mounting structure |
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