JPS62193199A - Parts detector of parts mounting apparatus - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to an article loading machine, and provides an article detection device for an article loading machine suitable for detecting whether or not an adsorbed article is in a position where it can be loaded. Regarding.

[Background of the invention]

A chip component mounting machine is used to load articles onto a mounting machine, and a photoelectric switch for detecting component presence and a photoelectric switch for detecting component standing are used to detect whether a chip component is in a position where it can be mounted. For example, a photoelectric switch for detecting standing parts that changes the detection position depending on the size of the part is manufactured by Tokyo Sanyo Electric Co., Ltd.
It is described in the Chip Mounter Manual published in December 2017.

In recent years, the conversion of electronic components into chips has been progressing at an accelerated pace, and the number of papers related to this has been increasing. Conventional component detection devices that can accommodate larger components have the disadvantage of having limitations in the amount of movement and speed, and being restricted in how they can be handled, if they are of a type that changes the detection position.

[Purpose of the invention]

An object of the present invention is to detect whether an article picked up by a loading machine for articles such as chip parts is sucked in a posture suitable for loading, and if the article is not picked up correctly, perform a skip operation (
Only the item is discharged without being loaded. ) to prevent incorrect or defective installation.

[Summary of the invention]

When an article is suctioned by a suction nozzle, the article can have three postures: it is suctioned normally, it is suctioned standing up, or it is not suctioned. In order to reliably determine these adsorption states, we use the fact that there is a difference in the dimension of the product in the thickness direction to detect the difference in dimension using a line sensor and compare it with the normal value input in advance to the control device. This feature is characterized in that the posture of the article is determined, and if the article is not properly suctioned, no loading operation is performed and only the article is ejected.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to FIGS. 1 to 4. FIG. 1 is a schematic diagram of a chip component mounting machine to which the present invention is applied. The loading machine mainly includes a substrate transfer unit, which is an XY table 3 that moves a printed circuit board to the nozzle position of the index, a component supply unit 2 that co-phases the article to the nozzle position of the index nozzle, and It consists of a mounting part, a substrate loading/unloading part, etc., and the index head part VC and the rotary table IVc nozzle 6 are 3
The nozzles 6 are arranged at intervals of 61 f, and in synchronization with the intermittent rotation operation of the rotary table 10 by a drive device (not shown), the nozzles 6 repeat a cycle of standing still → moving (36 degrees) → standing still.

Unfortunately, the resting position of the nozzle 6 is a fixed position from ■ to qc), and the suction of the tip part (
The following operations are performed: (1), detection (2), angle adjustment (2), mounting of chip components (6), angle return (1, 7)), and ejection of defective components ((2)). The suction operation of the loading machine is such that while the nozzle 6 is moving, the VC component supply unit moves the S table 2 so that the component to be suctioned comes to the suction position, and at a certain timing while the nozzle 6 is stationary, the nozzle 6 at the suction position picks up the component. adsorbs. Similarly, the loading operation is to move three XY tables so that the desired position for mounting the board is at the loading position ■ while the nozzle 6 is moving, and at a certain timing while the nozzle 6 is stationary, the nozzle 6 at the loading position mounts the component. do. Previous work on adsorption of chip components uses vacuum adsorption force using air, and there is a possibility that the parts may be adsorbed in an upright position or may not be able to be adsorbed.

Therefore, a line sensor +j7 was placed at the nozzle stop position (3) to detect abnormal conditions of this part. FIG. 2 shows a configuration diagram of the detection section. In this figure, the nozzle 6 attracts the chip component 8 and is stationary at the detection position (2) in FIG. In addition, the line sensor 7 is a one-dimensional line sensor 7
In combination with the thickness detection circuit 10 and the illumination device 9, it is possible to accurately detect the dimension of the chip component in the thickness direction. The control device 2V'i issues a detection start command to this thickness detection circuit, works to take in the detection result, compares it with the normal thickness dimension programmed in advance, and determines whether the part is standing or not, based on the size. do. Here, when the nozzle 6 picks up the chip component in a standing state, the thickness becomes considerably thicker than when the chip parts are picked up normally, and this can be determined. , In addition, in the case of no parts, the thickness dimension becomes smaller, and it is still possible to distinguish. Third
FIG. 4 shows a circuit diagram and waveforms of the thickness detection circuit 10. 12 is a photocoupler that connects the human input signal of the line sensor SP to the diode 121 on the primary side and the transistor 1 on the secondary side.
The signal inverted by the insulating circuit 22 and the resistor 16.degree. 20 is input to the inverter 26, which inverts it again and outputs it.

+3i4 and 15 are also photocouplers, and 5T in the control
Diodes for the ART signal, line sensor CLK signal, and line sensor SLY signal, 131,
141.151 and transistor +32.142.152
and resistors +7, 18, and 19, the insulating circuit inverts the signal from the primary side to the secondary 1u11 and outputs it. There is a resistor 24 and a capacitor 25Vi, a kind of integration circuit, 6, and the input signal to the inverter 27 (STA
RT) is input with a delay. The secondary side resistors 21, 22 and 23, 27, 28 and 29 are inverters that invert the signals 5TART, CLK and SLv. In the 32 dD flip-flop, the output signal from the inverter 26 is input to the CK terminal, and when it rises, the signal applied to the D terminal is output to the terminal Q. 30 is A
The ND gate provides the terminal DK input signal when the output signals from the inverter 27 and the terminal Q of the D7 lip 70 tube 32 are both 1. 31 is an AND gate connected to the output sides of the inverters 28 and 29, and the output side is connected to the CK terminal of the counter 34. In FIG. 3, the input signal is the output signal S from the line sensor 7.
P (remains “H” while scanning the image sensor), CL
K (clock signal corresponding to the image sensor), 5LV
(When scanning the part where the fi image element is irradiated with light,
H11) and the detection start signal 5TART from the control device 11. These input signals are input with waveforms as shown in FIG. However, the detection start signal 5T
ART is input asynchronously with other input signals. As for the operation of the circuit, the AND signal of the CLK signal and the SLv signal is used as the input clock of the counter 34, and the output signal is latched by the latch 35 and used as the input data of the control device 11. The start and stop timing of this counter 34 and the latch timing are SP multiplied by the signal STA R'.
This is done using r-times signal D slip-flops 32 and 33. In terms of timing, the counting operation of the counter 34 starts at the rising edge of the SP multiplication signal after inputting the 5TART signal, and stops at the rising edge of the next SP multiplication signal.Also, the latch 35 performs latch production during the counting operation of the counter 34, and The latch operation stops at the same time as the stop.

Therefore, all of the count results can be latched accurately, and the values can be reliably held until the counting operation starts again.

(Effects of the Invention) According to the present invention, it is possible to detect whether or not the picked chip component is in a state where it can be mounted, thereby making it possible to prevent incorrect mounting and mounting defects, and improve the reliability of the chip component mounting machine. However, the use of a line sensor with flexibility also has the effect of easily responding to changes in component dimensions.

[Brief explanation of drawings]

FIG. 1 is a schematic configuration diagram of a chip component mounting machine, FIG. 2 is a configuration diagram of a detection circuit section, FIG. 3 is a detection circuit diagram, and FIG. 4 is a diagram showing waveforms of FIG. 3. 1... Rotor soy/deck 1 part 2... Parts supply part 3... XY table part 6... Nozzle
7...Detection circuit section 8...Chip parts 9...
・Lighting device 10...Thickness detection circuit 11...
Control device 32.33...D flip-flop 34
...Counter 35...Latch. Representative Patent Attorney Katsuo Ogawa) Rod 1 Kokuzm Mouth (Button & α1 Gakuλ

Claims (1)

[Claims] An intermittent-operating rotary table having a plurality of nozzles with means for attracting and holding articles is provided, and articles vacuum-adsorbed from an article cassette attached to an article supply section are held on the XY table and movable. In an article loading machine equipped with means for loading onto a printed circuit board,
An article illumination device, a line sensor that receives light from the illumination device through the article, and data detected by the line sensor on the thickness of the article are taken in and compared with normal thickness dimensions that have been set and input in advance. An article detection device for an article loading machine, characterized in that, as a result of comparison with the device, only articles having a normal thickness are loaded at the loading position.