JPS60226199A - Chip part mounting machine - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an apparatus used for assembling printed circuit boards for household appliances and industrial electronic equipment.

Conventional configuration and its problems Traditionally, chip component mounting machines that mount chip components such as transistor chips, IC chips, and resistor capacitors onto printed circuit boards employ a cam system, which makes it difficult to detect the conveyance status of chip components. There are many methods for detecting by vacuum change, which has the problem of not being able to detect the conveyance state of all chip components.

The conventional chip component mounting machine as described above will be explained below with reference to FIG.

In FIG. 1, chip parts fed from a parts feeding device 1 are sucked by a vacuum sucker 3 driven by a vertical drive cam 2. As shown in FIG.

After the vacuum suction machine descends to a place where it can pick up the chip component 5, the vacuum generator 4 is operated, and the chip component is fixed to the vacuum suction machine only during transportation by vacuum force.

The chip parts fixed to the vacuum suction device are moved to the raised position by a cam, -E lower drive cam 2, which drives the vacuum suction device 3 up and down.

The presence or absence of the chip component 5 is detected at the raised position.

The detection method is that the chip component is fixed to the vacuum suction device, and the chip component 6 is fixed by increasing the vacuum pressure.
The vacuum pressure detector 8 detects the presence or absence of. If the chip component 6 is fixed to the vacuum suction device and the detection is correct, the chip component 6 is moved to the mounting position by the longitudinal drive cam 6.

The chip components positioned at the mounting positions are mounted on the printed circuit board 7.

The mounted vacuum suction device is moved up and down by a vertical drive cam 2.

After mounting, the vacuum suction device is raised to the upper limit by the vertical drive cam 2, and is positioned to the original position by the rear drive cam 6.

Since the chip components are mounted by cam drive in this manner, there is a drawback that the only way to detect whether or not the chip components are being conveyed in a normal state is by detecting vacuum pressure.

For example, states a, c, and d as shown in FIG. 2 cannot be detected.

a is a normal state.

Purpose of the Invention The present invention has been made in view of the above-mentioned drawbacks of the conventional technology, and provides a chip component mounting machine that eliminates the problems of the prior art, achieves high speed, high reliability, and eliminates incorrect mounting of chip components. It is intended to.

Structure of the Invention The chip component mounting machine of the present invention comprises a vacuum suction device for vacuum suctioning chip components to be mounted, a near motor provided to drive the vacuum suction, and a near motor for driving the vacuum suction, and a position of the suction device and a height of the chip component. A position detector provided to detect the above-mentioned suction machine, a pattern signal generation circuit that regulates the operation pattern of the above-mentioned suction machine, and a current to the above-mentioned linear motor by inputting this reference signal and the signal from the above-mentioned position detector. It is composed of a servo amplifier circuit that outputs, and controls the amount of movement of the vacuum suction device.
By performing positioning control for positioning, load control when mounting chip components, detecting the presence or absence of chip components, and detecting incorrect chip components, the situation of producing defective products due to incorrect mounting of chip components is eliminated and reliability is improved. will improve. .

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 3 shows a configuration diagram of a chip mounting machine in one embodiment of the present invention.

The chip components 11 fed from the parts feeding device 17 are picked up by the vacuum suction device 10 directly connected to the drive section of the linear motor, and then positioned at the positioning station 14 at an angle determined by the mounting position command. At the same time, chip parts 11
Check whether potentiometer 1 is being conveyed in normal condition.
Detect and confirm the height using the signal from step 2.

The chip component 18 positioned in a normal state is picked up by a vacuum suction unit 13 directly connected to a linear motor and mounted on a printed board 16.

The above timing will be explained in detail with reference to the timing chart of FIG.

Figure 4 shows the timing of the vacuum suction device 10.13 for transporting and mounting chip parts. is the origin position state of the vacuum suction device, and step T1. in which the vacuum suction unit descends to suction the chip component according to the position command to the linear motor. Vibration absorption time after descent T2゜ Speed control to keep collision speed against chip parts constant T3. The waiting time T4 of the vacuum delay for driving the vacuum suction device is shown.

The vacuum suction unit is opened and operated from chip suction to chip attachment as shown in the timing chart.

After the positioning control step T5 in which the chip components picked up in step T4 are raised by the position command, the chip components are moved from the parts feeding device to the positioning station 14 as shown at timing C.
The conveyance is completed through the control step T6 of conveying to.

When the conveyance is completed, the chip portion conveyed from the parts feeder 17 is installed at the positioning station.

The installation and posture detection of chip components will be explained below.

Step T7 of installing the linear motor in the positioning station 14 according to the position command. Vibration absorption time after descent T8. Speed control T2 to keep the collision speed against the chip components constant.
Time to detect the posture of the chip component T1'a p Positioning to the origin position T4. The JA axis completes its operation.

The B axis is the timing T for transporting the chip components from the positioning station to the printed board. '~T',, f: Indicates.

As described above, by detecting the posture of the vacuum suction device 10 driven by a linear motor at the positioning station and the signals from its position detector, it is possible to detect postures that could not be detected using conventional vacuum methods. I was able to eliminate the vacuum detector.

Effects of the Invention As described above, the present invention detects the posture of chip components that could not be detected using conventional vacuum pressure detection methods, which eliminates incorrect mounting of different types of chip components and incorrect mounting of irregularly shaped components such as chip components placed horizontally. The quality and reliability of printed boards assembled using this method have been improved.

: Also, the drive unit and position detection unit are integrated, which improves accuracy.

[Brief explanation of drawings]

Figure 1 is a configuration diagram of a conventional cam type chip mount machine, and Figures 2 a to 2 d are explanatory diagrams showing the conveyance state of chip components.
indicates a good condition, and b to c indicates a defective conveyance condition. FIG. 3 is a configuration diagram showing a state of transporting chip components according to the present invention. FIG. 4 is a transport timing diagram of the present invention. 1o... Vacuum suction device, 11... Chip parts,
16...Printed circuit board. Name of agent: Patent attorney Toshio Nakao and 1 other person 1st
Figure 3, lIB vacuum

Claims (1)

[Claims] A vacuum suction machine that vacuum suctions chip components, resistors, capacitors, and semiconductors to be mounted; a positioning drive device that can position the vacuum suction machine vertically using a position command device;
It is composed of a drive device that moves the vacuum suction machine in the rotational direction, and a position detector is attached to the vertical positioning drive device, and the position detection signal is used as a circuit for determining the posture of the chip component. A chip component mounting machine equipped with a control unit that stops.