JPS6219261B2 - - Google Patents
Info
- Publication number
- JPS6219261B2 JPS6219261B2 JP11820778A JP11820778A JPS6219261B2 JP S6219261 B2 JPS6219261 B2 JP S6219261B2 JP 11820778 A JP11820778 A JP 11820778A JP 11820778 A JP11820778 A JP 11820778A JP S6219261 B2 JPS6219261 B2 JP S6219261B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- soldering
- product
- tape
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 26
- 238000005476 soldering Methods 0.000 claims description 25
- 238000007654 immersion Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 150000001875 compounds Chemical group 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11820778A JPS5545548A (en) | 1978-09-25 | 1978-09-25 | Excess solder removing method by using tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11820778A JPS5545548A (en) | 1978-09-25 | 1978-09-25 | Excess solder removing method by using tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5545548A JPS5545548A (en) | 1980-03-31 |
| JPS6219261B2 true JPS6219261B2 (enrdf_load_stackoverflow) | 1987-04-27 |
Family
ID=14730842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11820778A Granted JPS5545548A (en) | 1978-09-25 | 1978-09-25 | Excess solder removing method by using tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5545548A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019140841A1 (zh) * | 2018-01-19 | 2019-07-25 | 深圳市海目星激光智能装备股份有限公司 | 一种柔性压锡尖装置 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5243143A (en) * | 1990-11-13 | 1993-09-07 | Compaq Computer Corporation | Solder snap bar |
-
1978
- 1978-09-25 JP JP11820778A patent/JPS5545548A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019140841A1 (zh) * | 2018-01-19 | 2019-07-25 | 深圳市海目星激光智能装备股份有限公司 | 一种柔性压锡尖装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5545548A (en) | 1980-03-31 |
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