JPS5545548A - Excess solder removing method by using tape - Google Patents

Excess solder removing method by using tape

Info

Publication number
JPS5545548A
JPS5545548A JP11820778A JP11820778A JPS5545548A JP S5545548 A JPS5545548 A JP S5545548A JP 11820778 A JP11820778 A JP 11820778A JP 11820778 A JP11820778 A JP 11820778A JP S5545548 A JPS5545548 A JP S5545548A
Authority
JP
Japan
Prior art keywords
tape
solder
product
soldering
inclination angle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11820778A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6219261B2 (enrdf_load_stackoverflow
Inventor
Masashi Yako
Hidekazu Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11820778A priority Critical patent/JPS5545548A/ja
Publication of JPS5545548A publication Critical patent/JPS5545548A/ja
Publication of JPS6219261B2 publication Critical patent/JPS6219261B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP11820778A 1978-09-25 1978-09-25 Excess solder removing method by using tape Granted JPS5545548A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11820778A JPS5545548A (en) 1978-09-25 1978-09-25 Excess solder removing method by using tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11820778A JPS5545548A (en) 1978-09-25 1978-09-25 Excess solder removing method by using tape

Publications (2)

Publication Number Publication Date
JPS5545548A true JPS5545548A (en) 1980-03-31
JPS6219261B2 JPS6219261B2 (enrdf_load_stackoverflow) 1987-04-27

Family

ID=14730842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11820778A Granted JPS5545548A (en) 1978-09-25 1978-09-25 Excess solder removing method by using tape

Country Status (1)

Country Link
JP (1) JPS5545548A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5518165A (en) * 1990-11-13 1996-05-21 Compaq Computer Corporation Soldering techniques employing a snap bar

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN207930122U (zh) * 2018-01-19 2018-10-02 深圳市海目星激光智能装备股份有限公司 一种柔性压锡尖装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5518165A (en) * 1990-11-13 1996-05-21 Compaq Computer Corporation Soldering techniques employing a snap bar

Also Published As

Publication number Publication date
JPS6219261B2 (enrdf_load_stackoverflow) 1987-04-27

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