JPS62191745A - Apparatus for detecting surface flaw - Google Patents
Apparatus for detecting surface flawInfo
- Publication number
- JPS62191745A JPS62191745A JP3318686A JP3318686A JPS62191745A JP S62191745 A JPS62191745 A JP S62191745A JP 3318686 A JP3318686 A JP 3318686A JP 3318686 A JP3318686 A JP 3318686A JP S62191745 A JPS62191745 A JP S62191745A
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- Japan
- Prior art keywords
- circuit
- noise
- signal
- power source
- detector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000463 material Substances 0.000 claims abstract description 14
- 230000007547 defect Effects 0.000 claims description 24
- 238000001514 detection method Methods 0.000 claims description 16
- 230000001360 synchronised effect Effects 0.000 abstract description 14
- 238000010438 heat treatment Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- 230000002950 deficient Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 230000006698 induction Effects 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 101100011509 Drosophila melanogaster Baldspot gene Proteins 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は例えは鉄鋼製品を生産するラインにおいて、
それら鉄鋼製品表面に存在する欠陥を検出する表面欠陥
探傷装置に関するものである。[Detailed Description of the Invention] [Industrial Application Field] This invention can be applied, for example, to a line for producing steel products.
The present invention relates to a surface defect detection device for detecting defects existing on the surface of these steel products.
第5図は2例えば特開昭57−111437号公報に示
された。従来の表面欠陥探傷装置を示す図である。FIG. 5 is shown in, for example, Japanese Unexamined Patent Publication No. 57-111437. FIG. 2 is a diagram showing a conventional surface defect detection device.
図において、(1)はスラブ等の被検材、(2)は被検
材(1)の表面を加熱するための表面加熱器、(31は
被検材(1)の表面から放射される赤外線を走査させな
がら検出するところの赤外線スキャナ、(4)は赤外線
スキャナ(3)の映像信号を処理するところの映像処理
器である。In the figure, (1) is the material to be tested such as a slab, (2) is a surface heater for heating the surface of the material to be tested (1), and (31 is the radiation emitted from the surface of the material to be tested (1). An infrared scanner detects infrared rays while scanning them, and (4) is an image processor that processes a video signal from the infrared scanner (3).
次に1作について説明する。例えは被検材(1)の表面
を誘導加熱装置等の表面加熱器(2)で加熱すると、被
検材(1)の表面に存在する凹状傷(ワレ傷)や凸状m
(ヘゲ傷)等の欠陥部では熱伝導状態や熱輻射状態が欠
陥の存在しない健全部と異なるために、欠陥部の温度が
周辺部より高くなることが知られている。Next, I will explain one work. For example, when the surface of the test material (1) is heated with a surface heater (2) such as an induction heating device, concave scratches (cracks) and convex m
It is known that the temperature of a defective part (such as a bald spot) is higher than that of the surrounding part because the heat conduction state and thermal radiation state are different from those of a healthy part without a defect.
従って2表面加熱後の被検材(1)の表面を赤外線スキ
ャナ(3:で走査撮像し、映像処理器(4)で信号処理
して、温度の高い部分を検出することによって。Therefore, the surface of the specimen (1) after surface heating is scanned and imaged with an infrared scanner (3), and the signal is processed with an image processor (4) to detect the high temperature part.
欠陥部を検出することが可能となる。It becomes possible to detect defective parts.
以上が第5図に示す従来例の動作原理である。The above is the operating principle of the conventional example shown in FIG.
一般に1表面加熱器(2)は電気エネルギーを利用した
ものが多く、この場合、電源としては商用の交流電源が
用いられるのか普通である。これらの又流電源は熱エネ
ルギーを発生するために大電流が必要とされ、この・電
流は往々にして、交流電源の周波数に同期したスパイク
ノイズを発生し、映像処理器(4)の正常な動作の妨げ
となることがある。Generally, most of the surface heaters (2) utilize electrical energy, and in this case, a commercial AC power source is usually used as the power source. These alternating current power supplies require large currents to generate thermal energy, and this current often generates spike noise synchronized with the frequency of the alternating current power supply, disrupting the normal operation of the image processor (4). It may interfere with operation.
例えば表面加熱器(2)の中でトランスやインダクタな
どを使用すれは、これらトランスやインダクタの鉄心の
もつヒステリシス性に起因する突入電流が又流電流の極
性が変わるタイミングに同期して発生し、ノイズ源とな
り得る。又2表面加熱器(2)として、誘導加熱器を使
用した場合、誘導加熱のための高周波電流が必要となり
、この高周波電流発生のための回路5例えはサイリスタ
によるチョッパー回路が高周波電流の極性が変わるタイ
ミングに同期したノイズを発生する。For example, when transformers and inductors are used in the surface heater (2), inrush currents due to the hysteresis of the cores of these transformers and inductors occur in synchronization with the timing when the polarity of the current changes. Can be a source of noise. In addition, when an induction heater is used as the surface heater (2), a high-frequency current is required for induction heating, and a circuit 5 for generating this high-frequency current 5 For example, a chopper circuit using a thyristor is used to control the polarity of the high-frequency current. Generates noise synchronized with the changing timing.
第2図は電源の電流波形と赤外線スキャナ(3)の映像
信号の関係の1例を示す図である。図において、(al
は電源の電流波形、(b)は赤外線スキャナ(3)の映
像信号、(C)は映像如神器(41内で映像信号ら)に
対する比較価として使われる欠陥判定レベルであり、t
l、t2.t5.t4は電流波形fa)の極性が変わる
時刻、N1.N2.N3.N4は時刻1.、12.13
.1゜に同期して映像信号(blに1畳するノイズ波形
。FIG. 2 is a diagram showing an example of the relationship between the current waveform of the power supply and the video signal of the infrared scanner (3). In the figure, (al
is the current waveform of the power supply, (b) is the video signal of the infrared scanner (3), (C) is the defect judgment level used as a comparison value for the video signal (video signal etc. in 41), and t
l, t2. t5. t4 is the time when the polarity of the current waveform fa) changes, N1. N2. N3. N4 is time 1. , 12.13
.. Noise waveform that adds 1 tatami to the video signal (bl) in synchronization with 1°.
Δtは電流波形(atの極性が変わる時刻からノイズが
発生するまでの遅れ時間、Fは映像信号(b)の中の欠
陥部に相当する波形である。例えは第2図に示す波形例
では映像信号ら)が、欠陥判定レベル(c1以上となっ
たとき、欠陥有と判定するようになっている。赤外線ス
キャナ(3)としては欠陥部分で映像信号が大きくなる
タイプのものを使用しているため、Fの部分が欠陥部と
判定されるようになっている。さてこの例では、を源の
電流波形(a)の極性が食わる時刻に同期したノイズN
、r N21 N3+ NAか映像信号(blに重畳し
、このうちN2及びN4が判定レベル(c1以上となっ
ているためN2. N4 の部分も欠陥であると判定
され誤検出となってしまう。Δt is the current waveform (delay time from the time when the polarity of at changes until noise occurs), and F is the waveform corresponding to the defective part in the video signal (b).For example, in the waveform example shown in Fig. 2, When the video signal (video signal, etc.) reaches a defect determination level (c1 or higher), it is determined that there is a defect.The infrared scanner (3) used is of a type in which the video signal increases at the defective part. Therefore, the part F is determined to be a defective part.In this example, the noise N is synchronized with the time when the polarity of the source current waveform (a) changes.
, r N21 N3+ NA is superimposed on the video signal (bl, of which N2 and N4 are higher than the determination level (c1), so the N2.N4 part is also determined to be defective, resulting in an erroneous detection.
このように、従来の表面欠陥探傷装置では、商用電源や
高周波電源の電源周波数に同期したノイズの影響を受け
、欠陥検出の信頼性を著しく損ねていた。As described above, conventional surface defect detection devices are affected by noise synchronized with the power frequency of a commercial power source or a high-frequency power source, significantly impairing the reliability of defect detection.
この発明は上記のような問題点を改善するためになされ
たもので、ノイズの影響な受けない高信頼性の表面欠陥
探傷装置を得ることを目的とする。This invention was made to improve the above-mentioned problems, and aims to provide a highly reliable surface defect detection device that is not affected by noise.
この発明に係る表面欠陥探傷装置は、赤外線スキャナと
、信号処理器の間にノイズ除去回路を設け、このノイズ
除去回路のノイズ除去処理のタイミングと表面加熱器の
又流電源周波数との間の同期をとる同期回路を設けてい
る。The surface defect detection device according to the present invention includes a noise removal circuit provided between an infrared scanner and a signal processor, and synchronizes the timing of the noise removal processing of the noise removal circuit with the cross-current power frequency of the surface heater. A synchronization circuit is provided to take the following.
この発明における同期回路はノイズ除去回路のノイズ除
去処理のタイミングと表面加熱器の交流ii[周波数と
の間の同期を、ノイズ除去回路のノイズ除去処理が表面
加熱器の交流電源の発生するノイズの発生タイミングと
合致するように行うようになっているため9表面加熱器
の交流電源に起因するノイズを確実に除去することがで
きる。The synchronous circuit in this invention synchronizes the timing of the noise removal process of the noise removal circuit and the AC ii [frequency of the surface heater. Since this is done to coincide with the generation timing, it is possible to reliably remove noise caused by the AC power source of the 9 surface heaters.
以下、この発明の一実施例について9図を用いて説明す
る。第1図において、(1)はスラグ等の被検材、(2
)は被検材表面を加熱するための表面加熱器、(3)は
被検材(1)の表面から放射される赤外巌を走査させな
がら検出するところの赤外線検出器。Hereinafter, one embodiment of the present invention will be described using FIG. 9. In Figure 1, (1) is the material to be tested such as slag, (2
) is a surface heater for heating the surface of the material to be inspected, and (3) is an infrared detector that detects while scanning the infrared beam emitted from the surface of the material to be inspected (1).
(4)は赤外線検出器(3)の出力信号を処理するとこ
ろの信号処理器、(5)は赤外線検出器(3)の出力信
号に重畳したノイズを除去するためのノイズ除去回路。(4) is a signal processor for processing the output signal of the infrared detector (3), and (5) is a noise removal circuit for removing noise superimposed on the output signal of the infrared detector (3).
(61は表面加熱器(21とノイズ除去回路(5)との
間の同期をとるための同期回路である。(61 is a synchronization circuit for synchronizing the surface heater (21) and the noise removal circuit (5).
第1図には図示されていないか実際の装置では表面加熱
器(2)、赤外線検出器(3)を支える支持体。A support that is not shown in FIG. 1 or supports the surface heater (2) and the infrared detector (3) in the actual device.
信号処理器(4)の処理出力を表示するための表示器。A display for displaying the processing output of the signal processor (4).
又これらの装置に動力源を与える装置、及び各部の装作
な行うための操作部等も含まれる。It also includes a device that provides a power source to these devices, and an operating section for configuring each part.
次に動作について説明する。被検材+1+の表面を表面
加熱器(2)で加熱すると、被検材(1)表面の欠陥部
では健全部より温度が高くなり、健全部に比べて波長の
短い赤外線を発生、送出する。この赤外線を、赤外線検
出器(3)で走査撮像し、ノイズ除去回路(51を経て
信号処理器(4)にて信号処理して被検材(1)表面の
温度の高い部分、すなわち赤外線波長の短い部分を欠陥
として検出する。Next, the operation will be explained. When the surface of the test material +1+ is heated with the surface heater (2), the defective areas on the surface of the test material (1) will have a higher temperature than the healthy areas, and will generate and send out infrared rays with a shorter wavelength than the healthy areas. . This infrared rays are scanned and imaged by an infrared detector (3), passed through a noise removal circuit (51), and processed by a signal processor (4) to detect the high temperature area of the surface of the material to be inspected (1), that is, the infrared wavelength. Detect short parts of as defects.
さて、同期回路(61は、第3図に示すようなタイミン
グにてゲート信号を発生する回路である。図において、
(a)は電源の電流波形、(b)は赤外線検出器(3)
の出力信号、(d)は同期回路(6)の発生するグー1
4号、(e)はノイズ除去回路(5)にてノイズ除去さ
れた後の信号波形である。ゲート信号(d)は電源電流
(a)の極性が変わる時刻t、、 t2. t5. t
l を起点とし、これより一定時間t、経過した後、
一定時間twO幅のゲートを持つ信号である。t、及
びtwはゲートがちょうどノイズN11 N21 N、
、 N4が発生する時刻に合致するようあらかじめ調整
してあり、を源電流(a)に同期して発生するノイズは
電源周波数又はその倍の周波数でくり返し発生する性潰
を持っているため、ケート信号(d)のゲートがノイズ
発生タイミングとずれるようなことはない。Now, the synchronous circuit (61 is a circuit that generates a gate signal at the timing shown in FIG. 3. In the figure,
(a) is the current waveform of the power supply, (b) is the infrared detector (3)
The output signal of (d) is the goo 1 generated by the synchronous circuit (6).
No. 4 (e) is the signal waveform after noise removal by the noise removal circuit (5). The gate signal (d) is generated at time t, t2. when the polarity of the power supply current (a) changes. t5. t
Starting from l, after a certain period of time t has elapsed,
This is a signal that has a gate with a constant time twO width. t and tw, the gate is just noise N11 N21 N,
, is adjusted in advance to match the time when N4 occurs, and the noise generated in synchronization with the source current (a) has the characteristic of repeatedly occurring at the power supply frequency or twice its frequency. There is no possibility that the gate of signal (d) deviates from the noise generation timing.
ゲート信号(dlを入力したノイズ除去回路(5)は赤
外線検出器(31の出力信号(b)のうちゲート信号(
diのゲート部分の信号を信号処理器(6)に伝達しな
いようにするため信号telのようにゲート信号のゲー
トに対応する部分の信号が零信号となった信号を出力す
る、
第1図の実施例に示される表面欠陥探傷装置は以上のよ
うになっているため、有害な電源ノイズが赤外線検出器
(3)の出力信号に重畳し、このノイズが欠陥判定レベ
ル以上となることによって、ノイズを欠陥と誤判定する
ようなことがないため。The noise removal circuit (5) inputting the gate signal (dl) detects the gate signal (out of the output signal (b) of the infrared detector (31)
In order to prevent the signal at the gate portion of di from being transmitted to the signal processor (6), a signal in which the portion of the gate signal corresponding to the gate becomes a zero signal, such as the signal tel, is output. Since the surface defect detection device shown in the embodiment is configured as described above, harmful power supply noise is superimposed on the output signal of the infrared detector (3), and when this noise exceeds the defect determination level, the noise This prevents the product from being mistakenly judged as a defect.
信頼性の高い探傷を行うことができる。Highly reliable flaw detection can be performed.
さて、第1図の実施例における信号のタイミング関係を
示す。第3図において、欠陥部Fの信号が大きくなる例
を示しているが、赤外線検出器(31によっては、欠陥
部で信号か小さくなるような種類のものもあり、この場
合は赤外線検出器(31の出力信号(blの信号レベル
が欠陥判定レベルよりも小さくなった時欠陥有りと判定
するようにする必要がある。このときは、ノイズ除去回
路(5)ではゲート部で零信号を出力するのではなく、
欠陥判定レベルより大きな信号を出力するようにしてや
れは。Now, the timing relationship of the signals in the embodiment of FIG. 1 will be shown. In Fig. 3, an example is shown in which the signal at the defective part F increases, but depending on the type of infrared detector (31), the signal decreases at the defective part, and in this case, the infrared detector (31) It is necessary to determine that there is a defect when the signal level of the output signal 31 (bl) becomes smaller than the defect determination level.In this case, the noise removal circuit (5) outputs a zero signal at the gate section. rather than
Why not output a signal larger than the defect detection level?
全く同様に効果を得ることができる。また第3図では、
信号(b)に重畳するノイズN、、 N2. N、、
N4のすべてのノイズを除去するようになっているが。You can get exactly the same effect. Also, in Figure 3,
Noise N,, N2. superimposed on signal (b). N...
Although it is supposed to remove all the noise of N4.
要は有害なノイズを除去すれは良いわけで9例えばN2
. N4だけを除去するようt2及びtl に同期して
ゲートを発生するようなゲート信号(dlを同期回路(
61が出力するようにすることも可能である。The point is that it is good to remove harmful noise9.For example, N2
.. A gate signal (dl is generated by a synchronous circuit (
61 may also be output.
さらに、ゲート信号(d)のゲート発生の起点であるt
l、 t2. を釦 tlを第3図では電源電流(a
)の極性が変わる時刻としているが、必すしもこの通り
でなくても良く9例えは電源電流(a)の極大点、極小
点等、11源電流(alの一周期のうちの特定の場所を
選びさえすればどの点でも良い。又、負荷のインピーダ
ンスに大きな変動がなけれは電源電流(a+の代りに!
諒電圧を使用しても良い。ノイズの発生原因が電圧波形
に関係するものであれはむしろ電源電圧を使用すべきで
ある。Furthermore, t is the starting point of gate generation of gate signal (d).
l, t2. button tl In Figure 3, the power supply current (a
), but this is not necessarily the time when the polarity of the source current (a) changes, but this does not necessarily have to be the case. Any point is fine as long as you choose .Also, as long as there are no large fluctuations in the load impedance, the power supply current (instead of a+!
You may use the voltage. If the cause of noise is related to the voltage waveform, the power supply voltage should be used instead.
さて第4図は第1図に示す実施例の同期回路(6)の動
作例の別の実施例を示すものである。本実施例ではノイ
ズ除去回路(5)としてはサンプルホールド回路が使用
されており1表面加熱器(2)として高周波電源を使用
した9例えば誘導加熱方式を採用している。同期回路(
6)は高周波電源の周波数とサンプルホールド回路すな
わちノイズ除去回路(5)のサンプリング周波数との間
の同期をとっている。Now, FIG. 4 shows another embodiment of the operation of the synchronous circuit (6) of the embodiment shown in FIG. In this embodiment, a sample hold circuit is used as the noise removal circuit (5), and an induction heating method, for example, is used as the surface heater (2) using a high frequency power source. Synchronous circuit (
6) synchronizes the frequency of the high frequency power supply and the sampling frequency of the sample hold circuit, that is, the noise removal circuit (5).
図において、(f)は同期回路(6)の出力する同期信
号。In the figure, (f) is a synchronization signal output from the synchronization circuit (6).
(glは同期信号に基づいて作られた高周波電源電流。(gl is the high frequency power supply current generated based on the synchronization signal.
(hlは赤外線検出器(3)の出力信号、(i)はノイ
ズ除去回路(5)の出力信号である。前述のようにノイ
ズ除去回路(5)はサンプルホールド回路となっており
。(hl is the output signal of the infrared detector (3), and (i) is the output signal of the noise removal circuit (5). As mentioned above, the noise removal circuit (5) is a sample and hold circuit.
そのタイミングは電源電流波形に起因するノイズの発生
タイミングなnhて行なわれるため、サンプルホールド
された結果、ノイズ除去回路(5)から出力される信号
(ilは、ノイズの影響を全く受けない波形となってい
る。本実施例では同期回路(61の作る同期信号(f)
に基づいて高周波電源周波数が決められているが、逆に
高周波電源周波数から同期信号を作成し、これに同期し
てサンプルホールドを行っても良く、要は、高周波電源
周波数に同期し、ノイズ発生タイミングを避けてサンプ
ルホールドするための同期回路(6:と、ノイズ除去回
路(5)がありさえすれは本発明の目的とする効果を得
ることができる。Since the timing is the timing when noise occurs due to the power supply current waveform, the signal (il) output from the noise removal circuit (5) as a result of being sampled and held is a waveform that is not affected by noise at all. In this embodiment, the synchronous signal (f) generated by the synchronous circuit (61)
The high frequency power supply frequency is determined based on As long as there is a synchronization circuit (6) for sample-holding while avoiding timing and a noise removal circuit (5), the desired effect of the present invention can be obtained.
以上、第1図に示す構成の表面欠陥探傷装置の実施例を
2例示したが、これらの例にとどまらず例えはノイズ除
去回路(51及び信号処理器(6)の全部又は一部をデ
ジタル回路にしても良く、ノイズ除去回路(51のノイ
ズ除去手段としてはゲート回路やサンプルホールド回路
以外にも例a類もが考えられ、これらのノイズ除去回路
(5)と表面加熱器(2)との間の同期をとるだめの同
期回路を設けることにより本発明の効果か発揮されるこ
とは言うまでもないことである。Two embodiments of the surface defect detection apparatus having the configuration shown in FIG. 1 have been described above, but the examples are not limited to these examples. In addition to gate circuits and sample-hold circuits, example type a can also be considered as the noise removing means of the noise removing circuit (51), and the combination of these noise removing circuits (5) and the surface heater (2) It goes without saying that the effects of the present invention can be brought out by providing a synchronization circuit for synchronizing the two.
又、第1図に示す実施例ではスラブ等の版状被検材を対
象としているが、偉状の被検材でも良く。Furthermore, although the embodiment shown in FIG. 1 deals with plate-shaped specimens such as slabs, it is also possible to use plate-shaped specimens.
対象被検材の形状にかかわらず9本発明が有効であるこ
とは論を待たない。It goes without saying that the present invention is effective regardless of the shape of the target material to be tested.
第1図はこの発明の実施例による表面欠陥探傷装置を示
す図、第2図、第3図及び第4図は信号の関係を示す図
、第5図は従来の表面欠陥探傷装置を示す図である。
図において、(1)は被検拐’、 +21は表面加熱器
、(3)は赤外線検出器、(4)は信号処理器、(5)
はノイズ除去回路、(6)は同期回路である。
なお9図中、同一符号は同一、又は相当部分を示す。FIG. 1 is a diagram showing a surface defect detection device according to an embodiment of the present invention, FIGS. 2, 3, and 4 are diagrams showing signal relationships, and FIG. 5 is a diagram showing a conventional surface defect detection device. It is. In the figure, (1) is the test sample, +21 is the surface heater, (3) is the infrared detector, (4) is the signal processor, and (5) is the infrared detector.
is a noise removal circuit, and (6) is a synchronous circuit. In addition, in FIG. 9, the same reference numerals indicate the same or equivalent parts.
Claims (1)
で加熱された被検材表面が発する赤外線を検出する赤外
線検出器と、前記赤外線検出器の出力信号を信号処理し
て、欠陥検出を行う信号処理器とを有する表面欠陥探傷
装置において、前記赤外線検出器と前記信号処理器との
間にノイズ除去回路を設けるとともに前記ノイズ除去回
路のノイズ除去処理のタイミングと、前記表面加熱器の
入力商用電源及び出力高周波電源の両方又はいずれか一
方の電源周波数との同期をとるための同期回路を設けた
ことを特徴とする表面欠陥探傷装置。A surface heater that heats the surface of the material to be inspected; an infrared detector that detects infrared rays emitted from the surface of the material to be inspected heated by the surface heater; and a signal processed by the output signal of the infrared detector to detect defects. In a surface defect detection apparatus having a signal processor that performs detection, a noise removal circuit is provided between the infrared detector and the signal processor, and the timing of noise removal processing of the noise removal circuit and the surface heater 1. A surface defect detection device comprising a synchronization circuit for synchronizing the power frequency of both or either of an input commercial power source and an output high-frequency power source.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3318686A JPS62191745A (en) | 1986-02-18 | 1986-02-18 | Apparatus for detecting surface flaw |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3318686A JPS62191745A (en) | 1986-02-18 | 1986-02-18 | Apparatus for detecting surface flaw |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62191745A true JPS62191745A (en) | 1987-08-22 |
Family
ID=12379459
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3318686A Pending JPS62191745A (en) | 1986-02-18 | 1986-02-18 | Apparatus for detecting surface flaw |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62191745A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5472095A (en) * | 1977-11-21 | 1979-06-09 | Kawasaki Steel Corp | Surface flaw detecting method of hot rolled steel |
JPS6039365A (en) * | 1983-08-11 | 1985-03-01 | Nippon Atom Ind Group Co Ltd | Periodic pulse noise removing deive |
-
1986
- 1986-02-18 JP JP3318686A patent/JPS62191745A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5472095A (en) * | 1977-11-21 | 1979-06-09 | Kawasaki Steel Corp | Surface flaw detecting method of hot rolled steel |
JPS6039365A (en) * | 1983-08-11 | 1985-03-01 | Nippon Atom Ind Group Co Ltd | Periodic pulse noise removing deive |
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