JPH074559Y2 - Surface defect inspection device - Google Patents

Surface defect inspection device

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Publication number
JPH074559Y2
JPH074559Y2 JP4596589U JP4596589U JPH074559Y2 JP H074559 Y2 JPH074559 Y2 JP H074559Y2 JP 4596589 U JP4596589 U JP 4596589U JP 4596589 U JP4596589 U JP 4596589U JP H074559 Y2 JPH074559 Y2 JP H074559Y2
Authority
JP
Japan
Prior art keywords
heating
circuit
amplifier
delay
infrared
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP4596589U
Other languages
Japanese (ja)
Other versions
JPH02135851U (en
Inventor
哲夫 三好
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP4596589U priority Critical patent/JPH074559Y2/en
Publication of JPH02135851U publication Critical patent/JPH02135851U/ja
Application granted granted Critical
Publication of JPH074559Y2 publication Critical patent/JPH074559Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【考案の詳細な説明】 〔産業上の利用分野〕 この考案は,表面欠陥検査装置に関するものであり,被
検査材表面の健全部と欠陥部の赤外線放射量の特徴の相
違から被検査材の健全部と欠陥部を確実に弁別する装置
を提供するものである。
[Detailed Description of the Invention] [Industrial field of application] The present invention relates to a surface defect inspection apparatus, which is characterized by the difference in the infrared radiation amount between the sound part and the defect part of the surface of the material to be inspected. An apparatus for surely discriminating a sound part and a defective part.

被検査材に割れ等の表面欠陥が存在する場合,被検査材
表面を加熱すると表面欠陥部は健全部に比べて,その温
度上昇率が異なることは公知の事実であり,例えば金属
等の導電体に対し,誘導加熱装置によって加熱すればエ
ッジ効果により割れ等の表面欠陥部が健全部よりも大き
い温度上昇を示し,温度上昇に比例して赤外線放射量が
増加することを利用した表面欠陥検査装置などが実用化
されている。逆に,ヘゲ等の被検査材の一部が母材から
浮き上がったような表面欠陥は表面積が大きく,熱放射
が大きいため,加熱停止後の自然冷却が早いため健全部
に比べて低い温度を示し,この温度差に起因する赤外線
放射量の差を利用して表面欠陥を検出することも可能で
ある。
It is a well-known fact that when a surface defect such as a crack exists in the material to be inspected, the surface defect portion has a different temperature rising rate as compared with a sound portion when the surface of the material to be inspected is heated. Surface defect inspection using the fact that when heated by an induction heating device, surface defects such as cracks show a larger temperature rise than healthy parts due to the edge effect and the infrared radiation amount increases in proportion to the temperature rise. The device has been put to practical use. On the other hand, surface defects such as a part of the material to be inspected, such as a hair drop, lifted up from the base material have a large surface area and large heat radiation, so natural cooling is fast after the heating is stopped, so the temperature is lower than that in a sound area. It is also possible to detect surface defects by utilizing the difference in infrared radiation amount due to this temperature difference.

〔従来の技術〕[Conventional technology]

第2図は,従来のこの種の表面欠陥検査装置を示す図で
ある。第2図において(1)は被検査材,(2)は被検
査材搬送装置,(3)は加熱装置,(4)は赤外線検出
器,(5)は走査装置,(6)は増幅器,(7)は信号
分離回路,(8)は同期回路,(9)は遅延回路,(1
0)は減算回路,(11)は判定回路,(12)は表示器で
ある。
FIG. 2 is a diagram showing a conventional surface defect inspection apparatus of this type. In FIG. 2, (1) is an inspected material, (2) is an inspected material conveying device, (3) is a heating device, (4) is an infrared detector, (5) is a scanning device, (6) is an amplifier, (7) is a signal separation circuit, (8) is a synchronization circuit, (9) is a delay circuit, (1
0) is a subtraction circuit, (11) is a judgment circuit, and (12) is an indicator.

従来のこの種の表面欠陥検査装置において被検査材搬送
装置(2)により所定方向に搬送された被検査材(1)
の表面は,所定位置にて加熱装置(3)によって加熱さ
れ,加熱前の未加熱領域の放射する赤外線及び加熱後の
加熱領域の放射する赤外線は共に走査装置(5)によっ
て前記未加熱領域と加熱領域を所定の順序で走査される
赤外線検出器(4)によって検出される。検出された赤
外線信号は通常増幅器(6)によって増幅されたあと走
査装置(5)の走査に同期して同期回路(8)が発生す
る同期信号をもとに信号分離回路(7)によって未加熱
領域の赤外線信号と加熱領域の赤外線信号とに分離され
る。未加熱領域の赤外線信号は遅延回路(9)によっ
て,所定量遅延され,加熱領域の赤外線信号と遅延され
た未加熱領域の赤外線信号は減算回路(10)によって減
算される。遅延回路の遅延量としては通常被検査材が未
加熱領域から加熱領域まで搬送される時間が使用され
る。次に前記減算値が所定の判定値を越えたとき判定回
路(11)において欠陥有りと判定され,表示器(12)に
て欠陥の有無が表示される。従来のこの種の表面欠陥検
査装置では,減算回路(10)の代わりに除算回路が使用
されることもあり,又,減算あるいは除算の前処理とし
て赤外線信号を対数変換する等の改良も加えられてい
る。
In the conventional surface defect inspection apparatus of this type, the inspected material (1) conveyed in a predetermined direction by the inspected material conveying apparatus (2)
The surface of is heated by a heating device (3) at a predetermined position, and the infrared light emitted from the unheated region before heating and the infrared light emitted from the heated region after heating are both transferred to the unheated region by the scanning device (5). The heating area is detected by an infrared detector (4) which is scanned in a predetermined sequence. The detected infrared signal is usually amplified by the amplifier (6) and then unheated by the signal separation circuit (7) based on the synchronization signal generated by the synchronization circuit (8) in synchronization with the scanning of the scanning device (5). The infrared signal of the area and the infrared signal of the heating area are separated. The infrared signal in the unheated area is delayed by a predetermined amount by the delay circuit (9), and the infrared signal in the heated area and the delayed infrared signal in the unheated area are subtracted by the subtraction circuit (10). As the delay amount of the delay circuit, the time during which the material to be inspected is conveyed from the unheated area to the heated area is usually used. Next, when the subtracted value exceeds a predetermined judgment value, the judgment circuit (11) judges that there is a defect, and the display (12) displays the presence or absence of the defect. In this type of conventional surface defect inspection apparatus, a division circuit may be used instead of the subtraction circuit (10), and improvements such as logarithmic conversion of an infrared signal as preprocessing for subtraction or division are also added. ing.

〔考案が解決しようとする課題〕[Problems to be solved by the device]

従来の表面欠陥検査装置では次のような問題点があっ
た。
The conventional surface defect inspection apparatus has the following problems.

すなわち健全部の中でも加熱による温度上昇が大きい部
分あるいは加熱後の冷却の早い部分があるため,これら
の部分が誤って欠陥と見なされることがあるという問題
点である。例えば角柱状の被検査材を誘導加熱装置で加
熱した場合,角柱の各コーナー部がエッジ効果によって
大きな温度上昇を示すため単純に温度上昇に伴う赤外線
放射量の増加量の差を検出しても割れ等の表面欠陥と健
全部のコーナ部との区別をつけることできない この考案は上記のような課題を解決するためになされた
ものである。
In other words, there is a problem that some parts of the sound part have a large temperature rise due to heating or parts that cool quickly after heating, and these parts may be mistakenly regarded as defects. For example, when a rectangular column-shaped material to be inspected is heated by an induction heating device, each corner of the column exhibits a large temperature rise due to the edge effect, so even if the difference in the amount of infrared radiation increase due to the temperature rise is simply detected. It is not possible to distinguish between surface defects such as cracks and the corners of sound areas. This invention was made to solve the above problems.

〔課題を解決するための手段〕[Means for Solving the Problems]

この考案に係る表面欠陥検査装置は,加熱後の時間経過
によって生じる被検査材表面の赤外線放射量の変化の差
を検出する目的で複数の加熱領域を走査し,個々の加熱
領域の赤外線放射量が示す未加熱領域の赤外線放射量と
の変化の相違を検出するための複数の遅延回路と複数の
演算回路を設けたものである。
The surface defect inspection apparatus according to the present invention scans a plurality of heating areas for the purpose of detecting a difference in change in the infrared radiation amount on the surface of the material to be inspected caused by the lapse of time after heating, and the infrared radiation amount of each heating area is detected. Is provided with a plurality of delay circuits and a plurality of arithmetic circuits for detecting a difference in change from the infrared radiation amount in the unheated area.

〔作用〕[Action]

この考案においては,遅延回路によって遅延された赤外
線信号同志の演算値が加熱後の時間経過によって生じる
被検査材表面の赤外線放射量の変化の相違を検出するよ
うになっているため,加熱後の時間経過によって生じる
被検査材表面の赤外線放射量の変化の差から健全部と欠
陥部の弁別を可能とする。
In this invention, since the calculated values of the infrared signals delayed by the delay circuit detect the difference in the infrared radiation amount on the surface of the material to be inspected caused by the lapse of time after heating, It is possible to discriminate between a sound portion and a defective portion based on the difference in the change in the infrared radiation amount on the surface of the material to be inspected over time.

〔実施例〕〔Example〕

第1図はこの考案の一実施例を示す図であり,(1)〜
(8),(11)〜(12)は前記従来装置とまったく同一
のものである。(9)は第一の遅延回路、(13)は第二
の遅延回路,(10)は第一の減算回路、(14)は第二の
減算回路である。
FIG. 1 is a diagram showing an embodiment of the present invention.
(8), (11) to (12) are exactly the same as the conventional device. (9) is a first delay circuit, (13) is a second delay circuit, (10) is a first subtraction circuit, and (14) is a second subtraction circuit.

動作について説明する。被検査材搬送装置(2)により
所定方向に搬送された被検査材(1)の表面は,所定位
置にて加熱装置(3)によって加熱され,加熱前の未加
熱領域の放射する赤外線及び加熱後の加熱領域の放射す
る赤外線は共に走査装置(5)によって前記未加熱領域
と加熱領域を所定の順序で走査される赤外線検出器
(4)によって検出される。
The operation will be described. The surface of the material to be inspected (1) conveyed in a predetermined direction by the material to be inspected conveyance device (2) is heated by a heating device (3) at a predetermined position, and infrared rays and heating emitted from an unheated region before heating. The infrared rays radiated by the subsequent heating area are both detected by the infrared detector (4) which scans the unheated area and the heating area in a predetermined order by the scanning device (5).

この際加熱領域については被検査材搬送方向に沿って異
なる二つの領域を走査される。本実施例では、第一の加
熱領域は加熱直後の領域、第二の加熱領域は加熱後所定
時間、例えば5秒前後経過した領域となるように設定し
ている。検出された赤外線信号は増幅器(6)によって
増幅されたあと走査装置(5)の走査に同期して同期回
路(8)が発生する同期信号をもとに信号分離回路
(7)によって未加熱領域の第一の赤外線信号と第一の
加熱領域の第二の赤外線信号と第二の加熱領域の第三の
赤外線信号とに分離される。
At this time, the heating area is scanned in two different areas along the conveyance direction of the material to be inspected. In this embodiment, the first heating region is set to be a region immediately after heating, and the second heating region is set to be a region after a predetermined time, for example, about 5 seconds has elapsed after heating. The detected infrared signal is amplified by the amplifier (6) and then the signal separation circuit (7) generates an unheated area based on the synchronization signal generated by the synchronization circuit (8) in synchronization with the scanning of the scanning device (5). Of the first infrared signal, the second infrared signal of the first heating area, and the third infrared signal of the second heating area.

未加熱領域の第一の赤外線信号は,第一の遅延回路
(9)により,又第一の加熱領域の第二の赤外線信号は
第二の遅延回路(13)によって各々異なる所定量遅延さ
れ第二の加熱領域の第三の赤外線信号と第一の遅延回路
(9)によって遅延された未加熱領域の第一の赤外線信
号は,第一の減算回路(10)によって減算される。一方
同じく第二の加熱領域の第三の赤外線信号と第二の遅延
回路(13)によって遅延された第一の加熱領域の第二の
赤外線信号は,第二の減算回路(14)によって減算され
る。遅延回路の遅延量としては通常被検査材が未加熱領
域から第一の加熱領域及び第二の加熱領域まで搬送され
る時間が使用される。本実施例では被検査材が第一の加
熱領域から第二の加熱領域まで搬送されるまでに例えば
5秒前後かかるため、第一の遅延回路の遅延量は第二の
遅延回路の遅延量にたいして5秒多く設定されている。
例えばヘゲ等の表面欠陥は熱容量が小さく、加熱される
時間も早いが、冷却する時間も早いため例えば5秒程度
の時間の経過によりほとんど加熱前の温度に復帰するた
め、第一の減算回路(10)の減算値出力が大きく,第二
の減算回路(14)の減算値出力が小さくなるのに対し,
角柱状の被検査材の各コーナ部ではその熱容量が大きく
例えば5秒程度の時間経過ではほとんど温度差が発生し
ないため、第一の減算回路(10)の減算値出力と第二の
減算回路(14)の減算値出力に大きな差がないため,判
定回路(11)の判定基準として,第一の減算回路の減算
値出力が所定量以上,かつ,第二の減算回路の減算値出
力が所定量以下のときのみ欠陥有りとすればヘゲ等の被
検査材の一部が母材から浮き上がったような表面欠陥と
角柱状被検査材のコーナ健全部との弁別が可能となる。
The first infrared signal in the unheated area is delayed by the first delay circuit (9), and the second infrared signal in the first heated area is delayed by the second delay circuit (13) by different predetermined amounts. The third infrared signal of the second heating region and the first infrared signal of the unheated region delayed by the first delay circuit (9) are subtracted by the first subtraction circuit (10). On the other hand, the third infrared signal of the second heating area and the second infrared signal of the first heating area delayed by the second delay circuit (13) are also subtracted by the second subtraction circuit (14). It As the delay amount of the delay circuit, the time during which the material to be inspected is conveyed from the unheated area to the first heated area and the second heated area is usually used. In this embodiment, it takes, for example, about 5 seconds before the material to be inspected is conveyed from the first heating area to the second heating area. Therefore, the delay amount of the first delay circuit is larger than the delay amount of the second delay circuit. It is set 5 seconds more.
For example, a surface defect such as a hair drop has a small heat capacity, and the heating time is short, but the cooling time is short, so that the temperature almost returns to that before heating, for example, after about 5 seconds, so the first subtraction circuit While the subtraction value output of (10) is large and the subtraction value output of the second subtraction circuit (14) is small,
The heat capacity of each corner portion of the prismatic inspection material is large and a temperature difference hardly occurs after a lapse of time of, for example, about 5 seconds. Therefore, the subtraction value output of the first subtraction circuit (10) and the second subtraction circuit ( Since there is no large difference in the subtraction value output of 14), the subtraction value output of the first subtraction circuit is a predetermined amount or more and the subtraction value output of the second subtraction circuit is the criterion as the judgment criterion of the judgment circuit (11). If the defect is present only when the amount is less than a certain amount, it becomes possible to discriminate between a surface defect such as a part of the inspected material floating up from the base material and a sound corner of the prismatic inspected material.

〔考案の効果〕[Effect of device]

以上のようにこの考案によれば,被検査材のコーナ健全
部を欠陥部と誤認識せずにヘゲ等の表面欠陥を検出でき
るという効果がある。本考案の実施例では角柱状の被検
査材を誘導加熱装置を用いて加熱した場合に角柱状被検
査材のコーナ健全部とヘゲ等の表面欠陥とを弁別する場
合を示したが,加熱装置として誘導加熱装置を用いなく
ても良く,又検出対象欠陥がヘゲ等の表面欠陥でなくと
も加熱時に大きい温度上昇を示し,加熱後に急速に冷却
する欠陥があればどんな欠陥であっても同様の効果を示
すことは言うまでもない。又従来のこの種の装置と同
様,減算回路の代わりに除算回路を用いても良く,減算
または除算の前処理として赤外線信号を対数変換する等
加熱前後の赤外線信号の変化を検出するためのいかなる
演算回路を用いても本考案の効果はいささかも損なわれ
ることはない。
As described above, according to this invention, it is possible to detect a surface defect such as a hair drop without erroneously recognizing a sound corner portion of the inspection object as a defective portion. In the embodiment of the present invention, the case where the corner healthy part of the prismatic test material and the surface defect such as a heddle are discriminated when the test material having the prismatic shape is heated by the induction heating device has been described. It is not necessary to use an induction heating device as a device, and even if the defect to be detected is not a surface defect such as a baldness, it shows a large temperature rise at the time of heating, and if there is a defect that cools rapidly after heating, it can be any defect. It goes without saying that the same effect is exhibited. Also, like the conventional device of this kind, a division circuit may be used instead of the subtraction circuit, and any method for detecting a change in the infrared signal before and after heating, such as logarithmic conversion of the infrared signal as a preprocessing of the subtraction or division, may be performed. Even if an arithmetic circuit is used, the effect of the present invention will not be impaired.

さらに赤外線検出器として近年二次元配列のものが実用
化されており,この場合,走査装置が行う走査処理,同
期回路が行う同期処理,信号分離回路が行う信号分離処
理,及び遅延回路が行う遅延処理はハードウェア,ソフ
トウェアあるいはその両方を用いた画像処理によって行
うことが多いがこの場合も本考案は全く同様の効果を発
揮する 同期回路(8)及び信号分離回路(7)は未加熱領域の
赤外線信号と第一の加熱領域の赤外線信号と第二の加熱
領域の信号を分離する目的で設けられたものであり,未
加熱領域,第一の加熱領域,第二の加熱領域個別に走査
装置(5),赤外線検出器,(4)増幅器(6)を設け
れば同期回路(8)及び信号分離回路(7)を省くこと
ができ,必ずしも必須のものではないが,この場合でも
本考案が全く同様の効果を示すことは言うまでもないこ
とである。
Further, in recent years, a two-dimensional array detector has been put into practical use as an infrared detector. In this case, a scanning process performed by a scanning device, a synchronization process performed by a synchronization circuit, a signal separation process performed by a signal separation circuit, and a delay performed by a delay circuit. The processing is often performed by image processing using hardware, software, or both. In this case, the present invention also exerts the same effect. The synchronization circuit (8) and the signal separation circuit (7) are in the unheated area. The scanning device is provided for the purpose of separating the infrared signal, the infrared signal of the first heating region, and the signal of the second heating region, and an unheated region, a first heating region, and a second heating region individually. If the (5), the infrared detector, and (4) the amplifier (6) are provided, the synchronizing circuit (8) and the signal separating circuit (7) can be omitted. Is all It goes without saying that the same effect is exhibited.

【図面の簡単な説明】[Brief description of drawings]

第1図は表面欠陥検査装置を示す図,第2図は従来の表
面欠陥検査装置を示す図である。 図において,(1)は被検査材,(2)は被検査材搬送
装置,(3)は加熱装置,(4)は赤外線検出器,
(5)は走査装置,(6)は増幅器,(7)は信号分離
回路,(8)は同期回路,(9)は遅延回路,(10)は
減算回路,(11)は判定回路,(12)は表示器,(13)
は第二の遅延回路,(14)は第二の減算回路である。 なお,図中同一符号は,同一又は相当部分を示す。
FIG. 1 is a diagram showing a surface defect inspection device, and FIG. 2 is a diagram showing a conventional surface defect inspection device. In the figure, (1) is an inspected material, (2) is an inspected material conveying device, (3) is a heating device, (4) is an infrared detector,
(5) is a scanning device, (6) is an amplifier, (7) is a signal separation circuit, (8) is a synchronization circuit, (9) is a delay circuit, (10) is a subtraction circuit, (11) is a determination circuit, ( 12) is an indicator, (13)
Is a second delay circuit, and (14) is a second subtraction circuit. The same reference numerals in the drawings indicate the same or corresponding parts.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】被検査材を所定方向に搬送する被検査材搬
送装置と、前記被検査材の表面を所定位置にて加熱する
加熱装置と、加熱前の未加熱領域と前記加熱装置により
加熱された、加熱後の時間経過の異なる第一、第二の加
熱領域を所定の順序で走査する走査装置と、前記走査装
置により走査された領域が放出する赤外線を検出する赤
外線検出器と、前記赤外線検出器の出力を増幅する増幅
器と、前記増幅器で増幅された前記未加熱領域からの第
一の赤外線信号を所定時間遅延させて出力する第一の遅
延回路と、前記増幅器で増幅された前記第一、第二の加
熱領域のうち一方からの第二の赤外線信号を前記第一の
遅延回路の遅延時間とは異なる時間遅延させて出力する
第二の遅延回路と、前記増幅器で増幅された前記第一、
第二の加熱領域のうち他方からの第三の赤外線信号と前
記第一の遅延回路の出力信号とを減算又は除算する第一
の演算回路と、前記第三の赤外線信号と前記第二の遅延
回路の出力信号とを減算又は除算する第二の演算回路
と、前記第一の演算回路の出力値と前記第二の演算回路
の出力値とを比較し、その大小関係により被検査材の表
面欠陥の有無を判定する判定回路とを具備した表面欠陥
検査装置。
1. An inspecting material conveying device for conveying an inspecting material in a predetermined direction, a heating device for heating the surface of the inspecting material at a predetermined position, an unheated region before heating and heating by the heating device. The first and second heating regions having different time lapses after heating are scanned in a predetermined order, and an infrared detector for detecting infrared rays emitted by the region scanned by the scanning device, and An amplifier for amplifying the output of the infrared detector, a first delay circuit for delaying and outputting a first infrared signal from the unheated region amplified by the amplifier for a predetermined time, and the amplifier amplified by the amplifier. A second delay circuit for delaying and outputting a second infrared signal from one of the first and second heating regions by a time different from the delay time of the first delay circuit, and amplified by the amplifier. The first,
A first arithmetic circuit for subtracting or dividing the third infrared signal from the other of the second heating regions and the output signal of the first delay circuit, the third infrared signal and the second delay A second arithmetic circuit that subtracts or divides the output signal of the circuit, the output value of the first arithmetic circuit and the output value of the second arithmetic circuit are compared, and the surface of the material to be inspected according to the magnitude relationship. A surface defect inspection apparatus comprising a determination circuit for determining the presence or absence of a defect.
【請求項2】被検査材を所定方向に搬送する被検査材搬
送装置と、前記被検査材の表面を所定位置にて加熱する
加熱装置と、加熱前の未加熱領域と前記加熱装置により
加熱された、加熱後の時間経過の異なる第一、第二の加
熱領域を所定の順序で走査する走査装置と、前記走査装
置により走査された領域が放出する赤外線を検出する赤
外線検出器と、前記赤外線検出器の出力を増幅する増幅
器と、前記増幅器で増幅された前記未加熱領域からの第
一の赤外線信号を所定時間遅延させて出力する第一の遅
延回路と、前記増幅器で増幅された前記第一、第二の加
熱領域のうち一方からの第二の赤外線信号を前記第一の
遅延回路の遅延時間とは異なる時間遅延させて出力する
第二の遅延回路と、前記増幅器で増幅された前記第一、
第二の加熱領域のうち他方からの第三の赤外線信号と前
記第一の遅延回路の出力信号とを減算又は除算する第一
の演算回路と、前記第三の赤外線信号と前記第二の遅延
回路の出力信号とを減算又は除算する第二の演算回路
と、前記第一の演算回路の出力値と前記第二の演算回路
の出力値をそれぞれ所定の判定値と比較し、それぞれの
比較結果により被検査材の表面欠陥の有無を判定する判
定回路とを具備した表面欠陥検査装置。
2. An inspected material conveying device for conveying the inspected material in a predetermined direction, a heating device for heating the surface of the inspected material at a predetermined position, an unheated region before heating and heating by the heating device. The first and second heating regions having different time lapses after heating are scanned in a predetermined order, and an infrared detector for detecting infrared rays emitted by the region scanned by the scanning device, and An amplifier for amplifying the output of the infrared detector, a first delay circuit for delaying and outputting a first infrared signal from the unheated region amplified by the amplifier for a predetermined time, and the amplifier amplified by the amplifier. A second delay circuit for delaying and outputting a second infrared signal from one of the first and second heating regions by a time different from the delay time of the first delay circuit, and amplified by the amplifier. The first,
A first arithmetic circuit for subtracting or dividing the third infrared signal from the other of the second heating regions and the output signal of the first delay circuit, the third infrared signal and the second delay A second arithmetic circuit that subtracts or divides the output signal of the circuit, compares the output value of the first arithmetic circuit and the output value of the second arithmetic circuit with a predetermined determination value, respectively, and compares the results. A surface defect inspection apparatus having a determination circuit for determining whether or not there is a surface defect in the material to be inspected.
JP4596589U 1989-04-19 1989-04-19 Surface defect inspection device Expired - Lifetime JPH074559Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4596589U JPH074559Y2 (en) 1989-04-19 1989-04-19 Surface defect inspection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4596589U JPH074559Y2 (en) 1989-04-19 1989-04-19 Surface defect inspection device

Publications (2)

Publication Number Publication Date
JPH02135851U JPH02135851U (en) 1990-11-13
JPH074559Y2 true JPH074559Y2 (en) 1995-02-01

Family

ID=31560619

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4596589U Expired - Lifetime JPH074559Y2 (en) 1989-04-19 1989-04-19 Surface defect inspection device

Country Status (1)

Country Link
JP (1) JPH074559Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013524229A (en) * 2010-04-08 2013-06-17 インスティトゥート ドクトル フェルスター ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディトゲゼルシャフト Thermograph test method and test apparatus for carrying out this test method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013524229A (en) * 2010-04-08 2013-06-17 インスティトゥート ドクトル フェルスター ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディトゲゼルシャフト Thermograph test method and test apparatus for carrying out this test method
US9194831B2 (en) 2010-04-08 2015-11-24 Institut Dr. Foerster Gmbh & Co. Kg Thermographic test method and testing device for carrying out the test method
JP2016128842A (en) * 2010-04-08 2016-07-14 インスティトゥート ドクトル フェルスター ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディトゲゼルシャフト Thermographic test method and test device for carrying out the same

Also Published As

Publication number Publication date
JPH02135851U (en) 1990-11-13

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