JP2005300386A - Circuit board inspection device and inspection method - Google Patents

Circuit board inspection device and inspection method Download PDF

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JP2005300386A
JP2005300386A JP2004118215A JP2004118215A JP2005300386A JP 2005300386 A JP2005300386 A JP 2005300386A JP 2004118215 A JP2004118215 A JP 2004118215A JP 2004118215 A JP2004118215 A JP 2004118215A JP 2005300386 A JP2005300386 A JP 2005300386A
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circuit board
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Yorio Hidehira
頼夫 秀平
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MicroCraft KK
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board inspection device and a method capable of inspecting a circuit board at high speed by shortening the time required for inspection, concerning a device and a method for allowing a test current formed by superimposing a direct current on an alternating current to flow in order to inspect the circuit board having a plurality of circuits, and observing a secondary harmonic of the alternating current generated from a crack or a narrowed part caused by a temperature characteristic of heating and cooling of an inspection circuit by Joule heat, to thereby detect a potential defect. <P>SOLUTION: This circuit board inspection device includes the first direct-current power source 21a, the second direct-current power source 21b and an alternating-current power source 22, first probe group 23a, 24a and second probe group 23b, 24b pairing respectively in order to be connected to both ends of the inspection circuit, and a switch 40 for switching and connecting the alternating-current power source to the first probe group or the second probe group. Preheating and inspection are switched between the plurality of inspection circuits by the switch, and preheating is performed in parallel before inspection, to thereby shorten the whole inspection time. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、回路基板検査装置及び検査方法に関し、より詳細には、非破壊的に被検査回路の異常に細い個所(狭窄部やクラック)等の潜在的な欠陥を検知するために、直流電流と交流電流を重畳させた試験電流を被検査回路に流し、その際に被検査回路の異常に細い個所等で発生するジュール熱による加熱及び冷却サイクルに起因して生ずる試験電流の二次高調波を観測する回路基板検査装置及び検査方法に関する。   The present invention relates to a circuit board inspection apparatus and inspection method, and more particularly, to detect a potential defect such as an abnormally thin portion (a narrowed portion or a crack) of a circuit to be inspected in a nondestructive manner. And a test current in which AC current is superimposed on the circuit to be inspected. At that time, the second harmonic of the test current resulting from the heating and cooling cycle due to Joule heat generated in an abnormally thin part of the circuit to be inspected. Circuit board inspection apparatus and inspection method for observing

出荷前に製造された回路基板を、回路基板中の回路が設計通り電気的に正しく機能するかどうか検査する必要がある。この回路検査のためには、被検査回路が回路基板上に露呈している個所は目視又は拡大画像により断線や短絡の有無を検査することが可能である。しかし、被検査回路が回路基板中に配線されていて露呈していない個所は、被検査回路に試験電流を流して導通検査(断線検査)や絶縁検査(短絡検査)の非破壊的な検査をする必要がある。   It is necessary to inspect whether a circuit board manufactured before shipment functions electrically correctly as designed in the circuit board. For this circuit inspection, it is possible to inspect whether the circuit to be inspected is exposed on the circuit board for the presence or absence of disconnection or short circuit by visual observation or an enlarged image. However, at locations where the circuit under test is wired in the circuit board and not exposed, a non-destructive inspection such as continuity inspection (disconnection inspection) or insulation inspection (short circuit inspection) is performed by passing a test current through the circuit under inspection. There is a need to.

しかし、試験電流を流して行う導通検査では、被検査回路の異常に細い個所(狭窄部又はクラック)等がある場合でも、この異常に細い個所等が電気を通すと検知することができない。このような被検査回路の異常に細い個所等は出荷前の導通検査では断線欠陥としては検知できないけれども、出荷後のユーザにおける回路基板の使用経過につれて狭窄部が切れ又はクラックが拡大して断線する可能性がある潜在的な欠陥である。従って、出荷前にこのような被検査回路の異常に細い個所等の潜在的な欠陥も検知する必要がある。   However, in the continuity test performed by passing a test current, even if there is an abnormally thin portion (stenosis or crack) in the circuit under test, it cannot be detected if the abnormally thin portion or the like conducts electricity. Although such an abnormally thin portion of the circuit to be inspected cannot be detected as a disconnection defect in the continuity inspection before shipment, the narrowed portion is cut or the crack is enlarged as the circuit board is used by the user after shipment. This is a potential defect. Therefore, it is necessary to detect a potential defect such as an abnormally thin portion of the circuit to be inspected before shipment.

特許文献1には、回路基板中のこのような潜在的な欠陥を非破壊的に検知する装置及び方法が記載されている。この検知装置及び方法の原理は、直流電流と交流電流を重畳させた試験電流を被検査回路に流した際に発生するジュール熱による加熱及び冷却の温度サイクルに起因して生ずる試験電流の二次高調波を観測して潜在的な欠陥を検知するものである。すなわち、直流電流と交流電流を重畳させた試験電流を被検査回路に流し、被検査回路の異常に細い個所が存在するとその個所の抵抗によりジュール熱が発生する。被検査回路は熱絶縁性の高い絶縁体上又はその中にあるため交流電流の変化に関係して異常に細い個所の温度が局所的にサイクル的に変化する。抵抗値は温度の関数であるので、温度変化に従ってその個所の抵抗値が変化する。この抵抗値の変化に従い異常に細い個所を流れる電流が変化する。このように変化する抵抗値を持つ異常に細い個所を流れる電流が交流電流の偶数次高調波を含む電圧応答を発生する。この交流電流の二次高調波を観測することで、被検査回路中の異常に細い個所を検知することができる。   Patent Document 1 describes an apparatus and method for nondestructively detecting such a potential defect in a circuit board. The principle of this detection apparatus and method is that a secondary current of a test current generated due to a temperature cycle of heating and cooling by Joule heat generated when a test current in which a direct current and an alternating current are superimposed is passed through a circuit to be inspected. A potential defect is detected by observing harmonics. That is, when a test current in which a direct current and an alternating current are superimposed is passed through the circuit to be inspected, and an abnormally thin portion exists in the circuit to be inspected, Joule heat is generated by the resistance at that portion. Since the circuit to be inspected is on or in an insulator having high thermal insulation, the temperature of an abnormally thin portion locally and cyclically changes in relation to the change of the alternating current. Since the resistance value is a function of temperature, the resistance value at that location changes as the temperature changes. According to the change in the resistance value, the current flowing through the abnormally thin portion changes. A current flowing through an abnormally narrow portion having a resistance value that changes in this way generates a voltage response including even-order harmonics of an alternating current. By observing the second harmonic of the alternating current, it is possible to detect an abnormally thin portion in the circuit to be inspected.

特開昭58−191973号公報JP 58-191973

しかし、特許文献1に記載されている検査装置及び検査方法では、導電性の被検査回路パターンと絶縁性基板の温度特性を利用しているため、被検査回路パターンの定常的な加熱及び冷却のサイクル状態への予熱時間を待って二次高調波を観測する必要があり、この結果、回路基板中に複数の被検査回路パターンが存在する場合、全てを検査するのに検査時間が長くなるという欠点がある。   However, since the inspection apparatus and the inspection method described in Patent Document 1 use the temperature characteristics of the circuit pattern to be inspected and the insulating substrate, the heating and cooling of the circuit pattern to be inspected constantly. It is necessary to wait for the preheating time to the cycle state and observe the second harmonic. As a result, when there are multiple circuit patterns to be inspected in the circuit board, the inspection time becomes longer to inspect all of them. There are drawbacks.

本発明は、上記欠点を解決して高速に検査できることに加えて、さらに精度良く回路基板中の回路の潜在的な欠陥を検出することができるようにした回路基板検査装置及び検査方法を提供することを目的としている。   The present invention provides a circuit board inspection apparatus and inspection method capable of detecting a potential defect of a circuit in a circuit board with higher accuracy in addition to solving the above-described drawbacks and performing high-speed inspection. The purpose is that.

上記目的を達成するために本発明は以下の構成を有する回路基板検査装置及び検査方法を提供する。   In order to achieve the above object, the present invention provides a circuit board inspection apparatus and inspection method having the following configuration.

請求項1に記載された本発明は、複数の回路を含む回路基板を検査するため、直流電流と交流電流とを重畳した試験電流を回路基板の被検査回路に流して、試験電流のジュール熱による被検査回路の加熱及び冷却の温度特性により被検査回路のクラック又は狭窄部から発生する交流電流の二次高調波を観測して被検査回路の潜在的な欠陥を検出する装置であって、直流電流を発生するための第1及び第2直流電源と、所定の周波数の交流電流を発生するための交流電源と、被検査回路の両端に接続するためにそれぞれ対をなす第1及び第2プローブ組と、交流電源を第1プローブ組又は第2プローブ組に切替えて接続するためのスイッチと、第1又は第2プローブ組から取り出された電流に含まれる交流電源の周波数の二倍の周波数を持つ二次高調波を観測して被検査回路中の潜在的な欠陥を検出する検知回路と、を含み、スイッチが、検査前に予熱するために第1又は第2直流電源のいずれか一方からの直流電流を第1又は第2プローブ組を介して被検査回路に流し、検査時に第1又は第2の直流電源のいずれか一方からの直流電流と交流電源からの交流電流を重畳した試験電流を生成して第1又は第2プローブ組を介して被検査回路へ流し、第1プローブ組に接続された被検査回路及び第2プローブ組に接続された被検査回路との間で予熱及び検査を切替えることができる回路基板検査装置を提供する。   In order to inspect a circuit board including a plurality of circuits, the present invention described in claim 1 applies a test current obtained by superimposing a direct current and an alternating current to a circuit to be inspected on the circuit board, thereby generating a Joule heat of the test current. An apparatus for observing a second harmonic of an alternating current generated from a crack or constriction of a circuit to be inspected by a temperature characteristic of heating and cooling of the circuit to be inspected by detecting a potential defect of the circuit to be inspected, First and second DC power sources for generating a DC current, an AC power source for generating an AC current of a predetermined frequency, and a first and a second that are paired to connect to both ends of the circuit to be inspected. A probe set, a switch for switching and connecting the AC power supply to the first probe set or the second probe set, and a frequency twice the frequency of the AC power supply included in the current extracted from the first or second probe set Have two A sensing circuit for observing harmonics and detecting potential defects in the circuit under test, wherein the switch provides direct current from either the first or second DC power source for preheating prior to inspection. Is passed through the circuit to be inspected via the first or second probe set, and a test current is generated by superimposing the DC current from either the first or second DC power supply and the AC current from the AC power supply during the inspection. The preheat and the inspection are switched between the circuit to be inspected connected to the first probe set and the circuit to be inspected connected to the second probe set. Provided is a circuit board inspection apparatus capable of

請求項2に記載された本発明は、複数の回路を含む回路基板を検査するため、直流電流と交流電流とを重畳した試験電流を回路基板の被検査回路に流して、試験電流のジュール熱による被検査回路の加熱及び冷却の温度特性により被検査回路のクラック又は狭窄部から発生する交流電流の二次高調波を観測して被検査回路の潜在的な欠陥を検出する装置であって、直流電流を発生するための第1及び第2直流電源と、互いに干渉しない所定の第1及び第2周波数の交流電流を発生するための第1及び第2交流電源と、被検査回路の両端に接続するためにそれぞれ対をなす第1及び第2プローブ組と、第1又は第2直流電源からの直流電流と第1又は第2交流電源からの交流電流とを重畳した試験電流を生成して第1又は第2プローブ組へ与える手段と、第1プローブ組から取り出された電流に含まれる第1交流電源の第1周波数の二倍の周波数を持つ二次高調波を観測して被検査回路中の潜在的な欠陥を含む欠陥を検出する第1検知回路と、第2プローブ組から取り出された電流に含まれる第2交流電源の第2周波数の二倍の周波数を持つ二次高調波を観測して被検査回路中の潜在的な欠陥を検出する第2検知回路と、を含み、第1及び第2プローブ組で2つの被検査回路を同時に検査をすることができる回路基板検査装置を提供する。   In order to inspect a circuit board including a plurality of circuits, the present invention described in claim 2 applies a test current in which a direct current and an alternating current are superimposed to a circuit to be inspected on the circuit board, thereby generating a Joule heat of the test current. An apparatus for observing a second harmonic of an alternating current generated from a crack or constriction of a circuit to be inspected by a temperature characteristic of heating and cooling of the circuit to be inspected by detecting a potential defect of the circuit to be inspected, First and second DC power sources for generating a DC current, first and second AC power sources for generating AC currents of predetermined first and second frequencies that do not interfere with each other, and both ends of the circuit under test Generating a test current in which a pair of first and second probes paired for connection, a direct current from the first or second direct current power supply and an alternating current from the first or second alternating current power supply are superimposed; To the first or second probe set And a defect including a potential defect in the circuit to be inspected by observing a second harmonic having a frequency twice as high as the first frequency of the first AC power source included in the current extracted from the first probe set. And a second harmonic having a frequency twice as high as the second frequency of the second AC power source included in the current extracted from the second probe set and observing the potential in the circuit under test. A circuit board inspection apparatus capable of simultaneously inspecting two circuits to be inspected with a first and second probe set.

請求項3に記載された本発明は、被検査回路の回路(以下、「回路パターン」とも言う)の断面積の大きさを入力する回路幅入力手段と、直流電流又は交流電流の電流値の大きさを、回路幅入力手段で入力された被検査回路の回路の断面積の大きさに基づいて、検知回路で観測される二次高調波が大きくなるように調節する手段と、をさらに含む前記請求項のいずれかに記載の回路基板検査装置を提供する。   The present invention described in claim 3 is a circuit width input means for inputting the size of a cross-sectional area of a circuit of a circuit to be inspected (hereinafter also referred to as “circuit pattern”), and a current value of a direct current or an alternating current. And a means for adjusting the magnitude so that the second harmonic observed in the detection circuit becomes larger based on the size of the cross-sectional area of the circuit to be inspected inputted by the circuit width input means. A circuit board inspection apparatus according to any one of the preceding claims is provided.

請求項4に記載された本発明は、被検査回路の回路長(すなわち、回路パターン長)の大きさ及び回路基板の材料の種類を入力する回路長等入力手段と、交流電源の所定の周波数の大きさを、回路長等入力手段で入力された被検査回路の回路長の大きさ及び回路基板の材料の種類に基づいて、検知回路で観測される二次高調波が大きくなるように調節する手段と、をさらに含む前記請求項のいずれかに記載の回路基板検査装置を提供する。   According to the present invention, the circuit length input means for inputting the circuit length (ie, circuit pattern length) of the circuit to be inspected and the material type of the circuit board, and a predetermined frequency of the AC power supply Is adjusted so that the second-order harmonics observed in the detection circuit are increased based on the circuit length of the circuit under test input by the input means such as the circuit length and the type of material of the circuit board. And a circuit board inspection apparatus according to any one of the preceding claims.

請求項5に記載された本発明は、複数の回路を含む回路基板を検査するため、直流電流と交流電流を重畳した試験電流を回路基板の被検査回路に流して、試験電流のジュール熱による被検査回路の加熱及び冷却の温度特性により被検査回路のクラック又は狭窄部などから発生する交流電流の二次高調波を観測して被検査回路の潜在的な欠陥を検出する方法であって、第1及び第2直流電流を発生するステップと、所定の周波数の交流電流を発生するステップと、第1又は第2直流電流のいずれかを検査前の被検査回路に流して予熱するステップと、第1又は第2直流電流のいずれかと交流電流とが重畳された試験電流を予熱後の被検査回路に流すステップと、被検査回路から取り出された試験電流に含まれる所定の周波数の二倍の周波数を持つ二次高調波を観測して被検査回路中の潜在的な欠陥を検出するステップと、を含む回路基板検査方法を提供する。   According to the fifth aspect of the present invention, in order to inspect a circuit board including a plurality of circuits, a test current in which a direct current and an alternating current are superimposed is passed through a circuit to be inspected on the circuit board, and the test current is generated by Joule heat. A method for detecting a potential defect of a circuit under test by observing a second harmonic of an alternating current generated from a crack or constriction of the circuit under test by the temperature characteristics of heating and cooling of the circuit under test, Generating a first and second direct current, generating an alternating current having a predetermined frequency, flowing one of the first and second direct currents through a circuit to be inspected before inspection, and preheating; Passing a test current in which either the first or second DC current and the AC current are superimposed on the circuit to be inspected after preheating; and twice a predetermined frequency included in the test current taken out from the circuit to be inspected Have frequency To provide a circuit board testing method comprising the steps of detecting a potential defect in the observation to the circuit under test second harmonic.

請求項1に記載された本発明の回路基板検査装置によれば、2つの直流電源と交流電源を第1及び第2プローブ組に交互に切替えるスイッチとを備えることにより、被検査回路の予熱及び検査を切替えることができるので、予熱に要する時間と検査に要する時間を並列的に実行でき、複数の回路を有する回路基板の検査時間を短縮できる。   According to the circuit board inspection apparatus of the present invention described in claim 1, by providing two DC power supplies and a switch for alternately switching the AC power supply to the first and second probe sets, preheating of the circuit to be inspected and Since the inspection can be switched, the time required for preheating and the time required for the inspection can be executed in parallel, and the inspection time of the circuit board having a plurality of circuits can be shortened.

請求項2に記載された本発明の回路基板検査装置によれば、2つの直流電源と互いに干渉しない周波数を持つ2つの交流電源と第1及び第2プローブ組と第1及び第2検知回路とを備えることにより、第1及び第2プローブ組で2つの被検査回路を同時に検査をすることができ、複数の回路を有する回路基板の検査時間を短縮できる。   According to the circuit board inspection apparatus of the present invention described in claim 2, two AC power supplies having frequencies that do not interfere with the two DC power supplies, the first and second probe sets, the first and second detection circuits, With this, it is possible to inspect two circuits to be inspected simultaneously with the first and second probe sets, and to reduce the inspection time of a circuit board having a plurality of circuits.

請求項3に記載された本発明の回路基板検査装置によれば、入力された被検査回路の回路の断面積の大きさに基づいて、正常な被検査回路が試験電流により焼損してしまうことを防止しながら観測される二次高調波が大きくなるように電流値を調節することにより、精度の高い回路基板の検査ができる。   According to the circuit board inspection apparatus of the present invention described in claim 3, a normal circuit to be inspected is burned by a test current based on the size of the cross-sectional area of the circuit to be inspected. By adjusting the current value so as to increase the observed second harmonic while preventing the problem, it is possible to inspect the circuit board with high accuracy.

請求項4に記載された本発明の回路基板検査装置によれば、入力された被検査回路の回路長の大きさ及び回路基板の材料(回路基板の絶縁部分を構成するガラスエポオキシ、セラミック等)の種類に基づいて、観測される二次高調波が大きくなるように周波数を調節することにより、精度の高い回路基板の検査ができる。   According to the circuit board inspection apparatus of the present invention as set forth in claim 4, the circuit length of the circuit to be inspected and the material of the circuit board (glass epoxy, ceramic, etc. constituting the insulating portion of the circuit board) The circuit board can be inspected with high accuracy by adjusting the frequency so that the observed second-order harmonic becomes larger based on the type of

請求項5に記載された本発明の回路基板検査方法によれば、検査前に被検査回路を第1又は第2直流電源のいずれかからの直流電流で予熱をした後に、交流電源からの交流電流を重畳した試験電流で検査するために、検査時間を短くできる。   According to the circuit board inspection method of the present invention as set forth in claim 5, after the circuit to be inspected is preheated with a direct current from either the first or second direct current power supply before the inspection, the alternating current from the alternating current power supply is supplied. Since the inspection is performed with the test current superimposed, the inspection time can be shortened.

まず、特許文献1に記載されている従来の非破壊的に被検査回路の異常に細い個所(狭窄部やクラック)等の潜在的な欠陥を検知するため、直流電流と交流電流を重畳させた試験電流を被検査回路に流し、その際に被検査回路の異常に細い個所等で発生するジュール熱による加熱及び冷却サイクルに起因して生ずる試験電流の二次高調波を観測する回路基板検査装置及び検査方法の原理を簡単に説明する。   First, in order to detect a potential defect such as an abnormally thin portion (constriction or crack) of the conventional non-destructive circuit described in Patent Document 1, a direct current and an alternating current are superimposed. A circuit board inspection device for observing second harmonics of test current caused by heating and cooling cycles caused by Joule heat generated at abnormally thin locations in the circuit under test when a test current is passed through the circuit under test The principle of the inspection method will be briefly described.

図1に、回路基板の回路に含まれる被検査回路10のモデル化した異常に細い個所11である潜在的な欠陥を示す。この異常に細い個所11は相対的に高い抵抗値Rを持ち、直流電流と周波数f0の正弦波交流電流とを重畳した試験電流(例えば、図7に示す)を被検査回路10に流すと、上述したように異常に細い個所11で発生するジュール熱による加熱特性及び冷却特性に起因して二次高調波電圧2f0GVを発生する。この二次高調波電圧2f0GVの大きさは、異常に細い個所11の抵抗値Rの三乗に約比例することが特許文献1の4頁左下欄に示されている。このため、二次高調波電圧の大きさを測定して閾値以上であれば、潜在的な欠陥として検知する。なお、被検査回路10は異常に細い個所11には起因しない二次高調波電圧2f0CVも同時に発生するが、これは特許文献1に記載されるように異常に細い個所11に起因した二次高調波電圧2f0GVとは位相が約90度異なるために位相検出器を通すことで、取り除くことができる。 FIG. 1 shows a potential defect that is an abnormally thin portion 11 modeled of a circuit 10 to be inspected included in a circuit of a circuit board. The abnormally thin portion 11 has a relatively high resistance value R, and when a test current (for example, shown in FIG. 7) in which a direct current and a sinusoidal alternating current having a frequency f 0 are superimposed is passed through the circuit under test 10. As described above, the second harmonic voltage 2f 0 GV is generated due to the heating characteristic and the cooling characteristic due to the Joule heat generated in the abnormally thin portion 11. It is shown in the lower left column on page 4 of Patent Document 1 that the magnitude of the second harmonic voltage 2f 0 GV is approximately proportional to the cube of the resistance value R of the abnormally thin portion 11. For this reason, if the magnitude of the second harmonic voltage is measured and is equal to or greater than the threshold value, it is detected as a potential defect. Note that the circuit under test 10 also generates a second harmonic voltage 2f 0 CV that is not caused by the abnormally thin portion 11 at the same time. Since the phase differs from the second harmonic voltage 2f 0 GV by about 90 degrees, it can be removed by passing it through a phase detector.

図2に、潜在的な欠陥を検知するために特許文献1に記載されている従来の検知回路20の要部のブロック図を示す。電源1は直流電源21及び周波数f0の正弦波交流電源を持つ。直流電源21からの直流電流は交流電源22からの周波数f0を持つ正弦波交流電流と重畳されて試験電流(例えば、図7に示す)を生成し、一対のプローブ23及び24の組を介して被検査回路10に流される。プローブ23から取り出された被検査回路10からの電流は、f0除去フィルタ25で基本周波数f0成分が除去されて、二次高調波成分(2f0GV+2f0CV)を含んだ電流が線型増幅器26で増幅された後、2f0帯域フィルタ27で二次高調波成分(2f0GV+2f0CV)を含んだ電流のみが取り出され、そして、増幅器28により増幅される。 FIG. 2 shows a block diagram of a main part of a conventional detection circuit 20 described in Patent Document 1 in order to detect a potential defect. The power source 1 has a DC power source 21 and a sine wave AC power source having a frequency f 0 . The direct current from the direct current power source 21 is superimposed on a sine wave alternating current having a frequency f 0 from the alternating current power source 22 to generate a test current (for example, shown in FIG. 7). And then flow to the circuit under test 10. The current from the circuit under test 10 taken out from the probe 23 is removed from the fundamental frequency f 0 component by the f 0 removal filter 25, and the current including the second harmonic component (2f 0 GV + 2f 0 CV) is a linear amplifier. After being amplified at 26, only the current containing the second harmonic component (2f 0 GV + 2f 0 CV) is taken out by the 2f 0 band filter 27 and amplified by the amplifier 28.

一方、交流電源22により生成された周波数f0を持つ正弦波電流は周波数二倍器29で周波数が2倍にされ、2f0帯域フィルタ30で二次高調波の2f0出力のみが取り出される。検知回路20は、被検査回路10の異常に細い個所11に起因して発生する二次高調波電圧2f0GVの位相が、同時に発生する被検査回路10の異常に細い個所11に起因しない二次高調波電圧2f0CVの位相と90度ずれていることを利用して、被検査回路10の異常に細い個所11に起因して発生する二次高調波電圧2f0GVを弁別するが、その弁別を最大にするために、移相器31で二次高調波出力の位相が若干ずらされる。 On the other hand, the sine wave current having the frequency f 0 generated by the AC power supply 22 is doubled by the frequency doubler 29 and only the 2f 0 output of the second harmonic is taken out by the 2f 0 band filter 30. In the detection circuit 20, the phase of the second harmonic voltage 2f 0 GV generated due to the abnormally thin portion 11 of the circuit under test 10 is not caused by the abnormally thin portion 11 of the circuit under test 10 that is generated simultaneously. Using the fact that the phase of the second harmonic voltage 2f 0 CV is shifted by 90 degrees, the second harmonic voltage 2f 0 GV generated due to the abnormally thin portion 11 of the circuit under test 10 is discriminated. In order to maximize the discrimination, the phase of the second harmonic output is slightly shifted by the phase shifter 31.

そして、位相検出器32で、被検査回路10の異常に細い個所11に起因して発生する二次高調波電圧2f0GVのみが取り出される。この取り出された二次高調波電圧2f0GVは、対数増幅器33、しきい値検出器34を経て、故障指示器35により潜在的な欠陥である異常に細い個所11の検知を指示するのに使用される。 Then, the phase detector 32 extracts only the second harmonic voltage 2f 0 GV generated due to the abnormally thin portion 11 of the circuit under test 10. The extracted second harmonic voltage 2f 0 GV passes through a logarithmic amplifier 33 and a threshold detector 34, and instructs the failure indicator 35 to detect an abnormally thin portion 11 which is a potential defect. used.

上述したように、被検査回路10の異常に細い個所11に起因して発生する二次高調波電圧2f0GVは、異常に細い個所11に流れる試験電流のジュール熱による加熱及び冷却サイクルによるものであるので、被検査回路パターンと絶縁性基板の加熱及び冷却の温度特性を利用している。この結果、被検査回路パターンが定常的な加熱及び冷却サイクルの状態に達する予熱時間を待って二次高調波を観測しないと、被検査回路10の異常に細い個所11に起因して発生する二次高調波の正確な測定はできない。このために、試験電流を被検査回路10に予め流して検査する前に定常状態に達するように予熱をしておく必要がある。したがって、特許文献1に開示される従来の回路基板検査装置及び検査方法では、被検査回路を検査する前に試験電流による予熱の時間を別に必要とし、検査時間が長いという問題がある。特に、回路基板に含まれる被検査回路の数が多くなると検査時間が長時間になる。本発明は、被検査回路の予熱と検査を並行的に行うことができるようにして、この問題を解決している。 As described above, the second harmonic voltage 2f 0 GV generated due to the abnormally thin portion 11 of the circuit under test 10 is due to the heating and cooling cycle by the Joule heat of the test current flowing through the abnormally thin portion 11. Therefore, the temperature characteristics of heating and cooling of the circuit pattern to be inspected and the insulating substrate are used. As a result, if the second harmonic is not observed after waiting for the preheating time for the circuit pattern to be inspected to reach a steady heating and cooling cycle state, the circuit pattern to be inspected 10 is generated due to an abnormally narrow portion 11. The second harmonic cannot be measured accurately. For this reason, it is necessary to preheat so as to reach a steady state before the test current is supplied to the circuit under test 10 for inspection. Therefore, in the conventional circuit board inspection apparatus and inspection method disclosed in Patent Document 1, there is a problem that the preheating time by the test current is required separately before inspecting the circuit to be inspected, and the inspection time is long. In particular, when the number of circuits to be inspected included in the circuit board increases, the inspection time becomes long. The present invention solves this problem by enabling preheating and inspection of the circuit to be inspected in parallel.

図3に、本発明の好ましい1つの実施の形態による回路基板検査装置の要部の回路ブロック図を示す。図3においては、図2と同様な部分には同様な参照符号を付している。   FIG. 3 shows a circuit block diagram of a main part of a circuit board inspection apparatus according to a preferred embodiment of the present invention. In FIG. 3, the same parts as those in FIG.

図3の実施例においては、2つの被検査回路10a及び10bが示されている。しかし、実際は2つ以上の多数の被検査回路が図示しない回路基板中に含まれており、簡略化のために2つのみを示す。本実施例の回路基板検査装置は、2つの同じ直流電源21a及び21bと1つの交流電源22を含んだ電源1cを備えている。さらに、本実施例の回路基板検査装置は、2つの被検査回路10a及び10bの両端に同時に接続することができるように、2対のプローブ組23a、24a及び23b、24bを備えている。電源1cの各直流電源21a、21bは、2対のプローブ組23a、24a及び23b、24bの各組にそれぞれ接続している。   In the embodiment of FIG. 3, two circuits under test 10a and 10b are shown. However, in reality, two or more circuits to be inspected are included in a circuit board (not shown), and only two are shown for simplicity. The circuit board inspection apparatus according to this embodiment includes a power source 1c including two identical DC power sources 21a and 21b and one AC power source 22. Further, the circuit board inspection apparatus of this embodiment includes two pairs of probe sets 23a, 24a and 23b, 24b so that they can be simultaneously connected to both ends of the two circuits to be inspected 10a and 10b. Each DC power source 21a, 21b of the power source 1c is connected to each of two pairs of probe sets 23a, 24a and 23b, 24b.

2対のプローブ組23a、24a及び23b、24bの各組は、スイッチ40を介して交流電源22に接続している。スイッチ40は、選択的に電源1cの交流電源22を2対のプローブ組23a、24a及び23b、24bのいずれか1つの組に接続する。本実施の形態の回路基板検査装置は、図2と同じ検知回路20を含み、スイッチ40を介して交流電源22に選択的に接続された2対のプローブ組23a、24a及び23b、24bのいずれか1方の組に接続される。本実施の形態の回路基板検査装置は、制御装置41をさらに含む。制御装置41は、スイッチ40を切替えて、交流電源22及び検知回路20を2つのプローブ組23a、24a及び23b、24bのいずれか一方に接続し、そして、2つのプローブ組23a、24a及び23b、24bのいずれか他方に直流電源21a、21bのみを接続する。   Each of the two pairs of probe sets 23 a and 24 a and 23 b and 24 b is connected to the AC power supply 22 via the switch 40. The switch 40 selectively connects the AC power supply 22 of the power supply 1c to any one of the two pairs of probe sets 23a, 24a and 23b, 24b. The circuit board inspection apparatus according to the present embodiment includes any of the two pairs of probe sets 23a, 24a and 23b, 24b that include the same detection circuit 20 as in FIG. 2 and are selectively connected to the AC power supply 22 via the switch 40. Or connected to one set. The circuit board inspection apparatus according to the present embodiment further includes a control device 41. The control device 41 switches the switch 40 to connect the AC power source 22 and the detection circuit 20 to one of the two probe sets 23a, 24a and 23b, 24b, and the two probe sets 23a, 24a and 23b, Only the DC power supplies 21a and 21b are connected to either one of 24b.

本実施の形態では、制御回路41により制御されるスイッチ40は直流電源21bのみが接続されたプローブ組23b、24bに予熱するための直流電流を検査前の被検査回路10bに流す。また、制御回路41により制御されるスイッチ40は直流電源21a及び交流電源22をプローブ組23a、24aに接続して直流電流と交流電流とが重畳された試験電流を検査のために被検査回路10aに流す。検知回路20は図2において上述したように試験電流が流された被検査回路10aから二次高調波を観測して潜在的な欠陥である異常に細い個所11が存在するか否かを検出する。   In the present embodiment, the switch 40 controlled by the control circuit 41 supplies a DC current for preheating the probe sets 23b and 24b to which only the DC power supply 21b is connected to the circuit under test 10b before the inspection. Further, the switch 40 controlled by the control circuit 41 connects the DC power source 21a and the AC power source 22 to the probe sets 23a and 24a, and inspects a test current 10a for inspecting a test current in which a DC current and an AC current are superimposed. Shed. As described above with reference to FIG. 2, the detection circuit 20 observes the second harmonic from the circuit under test 10a to which the test current is passed, and detects whether or not an abnormally thin portion 11 that is a potential defect exists. .

制御回路41は検知回路20による被検査回路10aの観測が終了すると、次の検査のためにスイッチ40を切替えて交流電源22をプローブ組23b、24bに接続して、直流電源21bにより予熱済みの被検査回路10bに直流電流と交流電流とが重畳された試験電流を流す。検知回路20aは予熱済みの被検査回路10bから直ちに二次高調波を観測して潜在的な欠陥である異常に細い個所11が存在するか否かを検出することができる。   When the observation of the circuit under test 10a by the detection circuit 20 is completed, the control circuit 41 switches the switch 40 for the next inspection, connects the AC power source 22 to the probe sets 23b and 24b, and has been preheated by the DC power source 21b. A test current in which a direct current and an alternating current are superimposed is passed through the circuit under test 10b. The detection circuit 20a can immediately observe the second harmonic from the preheated circuit to be inspected 10b to detect whether or not an abnormally thin portion 11 that is a potential defect exists.

一方、制御回路41は検知回路20による被検査回路10aの観測が終了すると、プローブ組23a、24aを検査済みの被検査回路10aから移動して、次の次に検査を受ける図示しない被検査回路の両端に接続して直流電源21aから直流電流により予熱する。   On the other hand, when the control circuit 41 finishes observing the circuit under test 10a by the detection circuit 20, the control circuit 41 moves the probe sets 23a and 24a from the circuit under test 10a that has been inspected, and the circuit under test (not shown) that receives the next inspection And is preheated by a direct current from a direct current power source 21a.

図8(A)に、従来の一対のプローブ組を持つ回路基板検査装置による検査工程のタイムチャートを示す。この図8(A)に示されるように、1対のプローブ組23、24の移動及び被検査回路10の両端への接続する工程81、検査前に被検査回路10を直流電流により予熱する工程82、被検査回路10に直流電流及び交流電流を重畳した試験電流を流して潜在的な欠陥を検査する工程83が、単線的、直列的に行われる。すなわち、検査工程83は、移動工程81と予熱工程82とを含む1サイクル中に1回しか行うことができない。
図8(B)に、図3に示す本発明の実施例の二対のプローブ組を持つ回路基板検査装置による検査工程を対比して示す。この図8(B)に示されるように、2対のプローブ組23a、23b、24a、24bの移動及び被検査回路10a、10bの両端への接続する工程81a、81b、検査前に被検査回路10a、10bを直流電流により予熱する工程82a、82b、被検査回路10a、10bに直流電流及び交流電流を重畳した試験電流を流して潜在的な欠陥を検査する工程83a、83bが、同じ工程が時間的に重ならないように互いにずらして、複線的、並列的に行われる。図8(B)に示される工程では、図中の左から2番目の破線の縦線に相当する時点でスイッチ40(図3)が切替わり、交流電源22(図3)がプローブ組23b、24bからプローブ組23a、24aに交流電流を切替えて、被検査回路10bの検査工程83bから予熱済みの被検査回路10aの検査工程83aへ直ちに移る。このようにして、プローブ組の移動工程と被検査回路の予熱工程と検査工程とが並列的に実行でき、検知回路20が一方のプローブ組の移動や予熱のための工程の時間中においても他方のプローブ組により被検査回路の検査を実行できる。この結果、多数の被検査回路を含んだ回路基板の検査を高速に実行できる。
FIG. 8A shows a time chart of an inspection process by a circuit board inspection apparatus having a pair of conventional probes. As shown in FIG. 8A, a step 81 of moving the pair of probe sets 23 and 24 and connecting them to both ends of the circuit under test 10 and a step of preheating the circuit under test 10 using a direct current before the inspection. 82. A step 83 of inspecting a potential defect by supplying a test current in which a direct current and an alternating current are superimposed on the circuit to be inspected 10 is performed in a single line and in series. That is, the inspection process 83 can be performed only once in one cycle including the moving process 81 and the preheating process 82.
FIG. 8B shows a comparison of the inspection process by the circuit board inspection apparatus having two pairs of probe sets according to the embodiment of the present invention shown in FIG. As shown in FIG. 8B, two pairs of probe sets 23a, 23b, 24a, 24b are moved and connected to both ends of the circuits to be inspected 10a, 10b 81a, 81b. Steps 82a and 82b for preheating 10a and 10b with direct current, and steps 83a and 83b for inspecting for potential defects by supplying a test current superimposed with direct current and alternating current to the circuits under test 10a and 10b are the same steps. They are shifted from each other so as not to overlap in time, and are performed in a double track or in parallel. In the step shown in FIG. 8B, the switch 40 (FIG. 3) is switched at a time corresponding to the second dashed vertical line from the left in the figure, and the AC power source 22 (FIG. 3) is connected to the probe set 23b. The AC current is switched from 24b to the probe sets 23a and 24a, and the process immediately proceeds from the inspection process 83b of the circuit under test 10b to the inspection process 83a of the preheated circuit 10a. In this way, the movement process of the probe set, the preheating process of the circuit to be inspected, and the inspection process can be performed in parallel, and the detection circuit 20 can perform the other during the process of moving or preheating one probe set. Inspection of the circuit to be inspected can be executed by the probe set. As a result, inspection of a circuit board including a large number of circuits to be inspected can be executed at high speed.

図4に、本発明の別の実施の形態による回路基板検査装置の要部の回路ブロック図を示す。図4においては、図3と同様な部分には同様な参照符号を付している。   FIG. 4 shows a circuit block diagram of a main part of a circuit board inspection apparatus according to another embodiment of the present invention. 4, parts similar to those in FIG. 3 are denoted by the same reference numerals.

図4に示す実施の形態では、干渉しないように互いに異なる周波数f1、f2を持った正弦波交流電流を発生する交流電源及び直流電流を発生する直流電源をそれぞれ備えた2組の電源1a、1bを有する。電源1a、1bは、異なる周波数f1、f2を持つ正弦波交流電流を直流電流に重畳して生成した試験電流を、2対のプローブ組23a、24a及び23b、24bにそれぞれ接続している。2対のプローブ組23a、24a及び23b、24bは、それぞれ被検査回路10a、10bに接続して試験電流を流す。図2の検知回路20と同様な2つの検知回路20a、20bがそれぞれプローブ23a、24aに接続されていて、被検査回路10a、10bからのそれぞれの試験電流に重畳されている交流電流の周波数f1、f2の二次高調波を同時的、並列的に観測する。そして、検知回路20a、20bは観測されたそれぞれの周波数f1、f2の二次高調波の大きさから被検査回路10a、10bに含まれる潜在的な欠陥となる異常に細い個所11の存在の有無を検知する。   In the embodiment shown in FIG. 4, two sets of power supplies 1a and 1b each provided with an AC power source that generates sinusoidal AC currents having different frequencies f1 and f2 and a DC power source that generates DC currents so as not to interfere with each other. Have The power sources 1a and 1b connect test currents generated by superimposing sine wave alternating currents having different frequencies f1 and f2 on direct currents to two pairs of probe sets 23a and 24a and 23b and 24b, respectively. The two pairs of probe sets 23a, 24a and 23b, 24b are connected to the circuits under test 10a, 10b, respectively, to pass a test current. Two detection circuits 20a and 20b similar to the detection circuit 20 in FIG. 2 are connected to the probes 23a and 24a, respectively, and the frequency f1 of the alternating current superimposed on the respective test currents from the circuits under test 10a and 10b. , F2 second harmonics are observed simultaneously and in parallel. Then, the detection circuits 20a and 20b determine whether or not the abnormally thin portion 11 is present as a potential defect included in the circuits to be inspected 10a and 10b based on the observed second harmonics of the frequencies f1 and f2. Is detected.

制御回路42は、2対のプローブ組23a、24a及び23b、24bを2つの被検査回路10a、10bにそれぞれ同時に接続して、2つの検知回路20a、20bによりそれぞれの試験電流に重畳されている交流電流の周波数の二次高調波を同時的、並列的に観測する操作を行う。各電源1a、1bに含まれる交流電源は、互いに干渉しないように異なる周波数f1、f2を持つため同時的、並列的な検査が2つの検知回路20a、20bで可能である。   The control circuit 42 simultaneously connects two pairs of probe sets 23a, 24a and 23b, 24b to the two circuits 10a, 10b, respectively, and is superimposed on the respective test currents by the two detection circuits 20a, 20b. Operation to observe the second harmonic of the frequency of the alternating current simultaneously and in parallel. Since the AC power supplies included in the respective power supplies 1a and 1b have different frequencies f1 and f2 so as not to interfere with each other, simultaneous and parallel inspection is possible with the two detection circuits 20a and 20b.

このため、2つの被検査回路を同時に検査でき、1対のプローブ組と1つの電源を使用する図2の従来の検査装置に比べて、回路基板の検査時間を約半分程度に減らすことができる。   Therefore, two inspected circuits can be inspected at the same time, and the circuit board inspection time can be reduced to about half compared to the conventional inspection apparatus of FIG. 2 using a pair of probes and a single power source. .

図5は、本発明のさらに別の実施の形態による回路基板検査装置の検査方法の要部のフローチャートを示す。本実施の形態の検査方法に使用される回路基板検査装置は、回路基板の被検査回路10の回路パターンの回路断面積の大きさ及び一対のプローブ組が接触するその被検査回路10の両端の位置情報を入力する図示しない入力手段を備えている。この入力手段は、回路基板の製造データ(設計データからの被検査回路パターンの回路幅及び回路パターンの厚みを含んだもの)、及び両端位置等の設計情報のデジタル化情報を入力することができるコンピュータ及びそれに接続された記憶手段であってよい。回路の断面積は、回路パターン(番号)毎に入力された設計データから得られる回路幅と回路パターンの厚み(回路パターン層厚)との積演算により求めてもよい。さらに、直流電源21と交流電源22を含む電源1から出力される直流電流と交流電流の重畳された試験電流の大きさを、その試験電流が流される各被検査回路パターンの回路の断面積の大きさに基づいて、正常な被検査回路パターンを焼損することなく、被検査回路パターン中の異常に細い個所等の潜在的な欠陥により発生される二次高調波を最大にする値に設定するためのコンピュータ等の手段を備えている。   FIG. 5 shows a flowchart of a main part of an inspection method of a circuit board inspection apparatus according to still another embodiment of the present invention. The circuit board inspection apparatus used in the inspection method of the present embodiment has a circuit cross-sectional area size of the circuit pattern of the circuit under test 10 on the circuit board and both ends of the circuit under test 10 in contact with the pair of probe sets. Input means (not shown) for inputting position information is provided. This input means can input circuit board manufacturing data (including the circuit width and circuit pattern thickness of the circuit pattern to be inspected from the design data) and digitized information of design information such as the positions of both ends. It may be a computer and storage means connected thereto. The cross-sectional area of the circuit may be obtained by a product operation of the circuit width obtained from the design data input for each circuit pattern (number) and the thickness of the circuit pattern (circuit pattern layer thickness). Further, the magnitude of the test current in which the direct current and the alternating current output from the power source 1 including the direct current power source 21 and the alternating current power source 22 are superimposed is determined by the cross sectional area of each circuit pattern to be inspected. Based on the size, set the value to maximize the second harmonic generated by potential defects such as abnormally thin parts in the circuit pattern to be inspected without burning out the normal circuit pattern to be inspected. Means such as a computer is provided.

特許文献1の4頁の左下欄には二次高調波の大きさが交流電流の大きさの二乗に比例し、直流電流の大きさの一乗に比例し、異常に細い個所の抵抗値Rの三乗に比例することが開示されている。したがって、試験電流の大きさが大きいと二次高調波の大きさが大きくなる。一方、試験電流が流れる際に被検査回路パターンが発生するジュール熱の大きさが、試験電流の大きさの二乗及び被検査回路の全体の抵抗値の大きさの一乗に比例して増大するために、試験電流が大きく且つ被検査回路パターンの回路の断面積が小さいと被検査回路パターンが焼損するおそれがある。このために、各被検査回路パターンの回路の断面積の大きさに基づいて、正常な被検査回路パターンを焼損することなく、被検査回路パターン中の異常に細い個所等の潜在的な欠陥により発生される二次高調波を最大にする値に試験電流値を設定する。   In the lower left column on page 4 of Patent Document 1, the magnitude of the second harmonic is proportional to the square of the magnitude of the alternating current, proportional to the square of the magnitude of the direct current, and the resistance value R of the abnormally thin portion is measured. It is disclosed that it is proportional to the cube. Therefore, when the magnitude of the test current is large, the magnitude of the second harmonic becomes large. On the other hand, the magnitude of Joule heat generated by the circuit pattern to be inspected when the test current flows increases in proportion to the square of the magnitude of the test current and the power of the entire resistance value of the circuit under test. In addition, if the test current is large and the cross-sectional area of the circuit pattern to be inspected is small, the circuit pattern to be inspected may be burned out. For this reason, based on the size of the circuit cross-sectional area of each circuit pattern to be inspected, the normal circuit pattern to be inspected may not be burned out and may be caused by a potential defect such as an abnormally thin portion in the circuit pattern to be inspected Set the test current value to the value that maximizes the generated second harmonic.

図5に示される本発明の実施の形態の検査方法では、検査開始(ステップ50)の後に、図示しないコンピュータに入力されている製造情報、設計情報等から被検査回路パターンの回路幅や回路厚やプローブの接触する回路両端位置等の情報を読み取り(ステップ51)、被検査回路パターンをその回路の断面積が設定値1、2、3より小さいか又は大きいかに応じていくつかのグループに分類する(ステップ52)。   In the inspection method according to the embodiment of the present invention shown in FIG. 5, after the start of inspection (step 50), the circuit width and circuit thickness of the circuit pattern to be inspected from manufacturing information, design information, etc. input to a computer (not shown). And the information such as the positions of both ends of the circuit in contact with the probe are read (step 51), and the circuit pattern to be inspected is divided into several groups depending on whether the cross-sectional area of the circuit is smaller or larger than the set values 1, 2, 3 Classify (step 52).

ステップ52で設定値1以下の回路の断面積を持つ被検査回路10には、最小の出力電流1を選択する(ステップ53)。設定値1よりも大きくて設定値2以下の回路の断面積を持つ被検査回路10には、出力電流1よりも大きい出力電流2を選択する(ステップ54)。設定値2よりも大きくて設定値3以下の回路の断面積を持つ被検査回路10には、出力電流2よりも大きい出力電流3を選択する(ステップ55)。このようにして、回路の断面積に基づいて出力電流の大きさが選択される。次に、この選択された出力電流の大きさの直流電流と交流電流とが重畳された試験電流を電源1から一対のプローブ組を介してその被検査回路10の両端に印加するため、一対のプローブ組を移動する(ステップ56)。そして、選択された出力電流の大きさの試験電流を被検査回路10の両端間に流して、二次高調波を観測し(ステップ57)、この二次高調波を観測した結果、被検査回路10中の潜在的な欠陥11の有無を示すデータを記憶する(ステップ58)。回路基板中の全被検査回路パターンの検査が終了したかを判定して(ステップ59)、全検査が終了したならば終了し、終了していなければ次の被検査回路パターンを検査するためにステップ51に戻る。   In step 52, the minimum output current 1 is selected for the circuit under test 10 having the circuit cross-sectional area of the setting value 1 or less (step 53). An output current 2 greater than the output current 1 is selected for the circuit under test 10 having a circuit cross-sectional area greater than the set value 1 and less than or equal to the set value 2 (step 54). An output current 3 greater than the output current 2 is selected for the circuit under test 10 having a circuit cross-sectional area greater than the set value 2 and less than or equal to the set value 3 (step 55). In this way, the magnitude of the output current is selected based on the cross-sectional area of the circuit. Next, in order to apply a test current in which a direct current and an alternating current having a magnitude of the selected output current are superimposed from the power source 1 to both ends of the circuit under test 10 through a pair of probes, The probe set is moved (step 56). Then, a test current having the selected output current is passed between both ends of the circuit under test 10 to observe the second harmonic (step 57). As a result of observing the second harmonic, the circuit under test is observed. Data indicating the presence or absence of a potential defect 11 in 10 is stored (step 58). It is determined whether the inspection of all the circuit patterns to be inspected in the circuit board has been completed (step 59). If all the inspections have been completed, the inspection is completed. If not, the next circuit pattern to be inspected is inspected. Return to step 51.

本実施の形態の方法により、被検査回路の回路の断面積の大きさに基づいて、直流電流に交流電流が重畳された試験電流の大きさを、正常な被検査回路を焼損することなく、異常に細い個所等の潜在的な欠陥により発生する二次高調波が大きくなるように選択している。このため、潜在的な欠陥の検出の精度を高めることができる。   According to the method of the present embodiment, based on the size of the cross-sectional area of the circuit to be inspected, the magnitude of the test current in which the alternating current is superimposed on the direct current without burning the normal circuit to be inspected. The second harmonic generated by a potential defect such as an abnormally thin part is selected to be large. For this reason, the precision of detection of a potential defect can be improved.

図6は、本発明のさらに別の実施の形態による回路基板検査装置の検査方法の要部のフローチャートを示す。本実施の形態の検査方法に使用される回路基板検査装置は、回路基板の被検査回路10の回路パターンの回路長の大きさ、回路基板の絶縁部分を構成する材料の種類、及び一対のプローブ組が接触するその被検査回路10の両端の位置情報を入力する図示しない入力手段を備えている。この入力手段は、回路基板の製造データ、設計データから被検査回路パターンの回路長、回路基板の絶縁部分を構成する材料の種類(例えば、ガラスエポオキシ又はセラミック)、及び両端位置等の設計情報のデジタル化情報を入力することができるコンピュータ及びそれに接続された記憶手段であってよい。さらに、直流電流と交流電流の重畳された試験電流を生成する電源1の交流電源の周波数を、その試験電流が流される各被検査回路パターンの回路長の大きさ及び回路基板の絶縁部分を構成する材料の種類に基づいて、被検査回路パターン中の異常に細い個所等の潜在的な欠陥により発生される二次高調波を最大にするような値に設定するためのコンピュータ等の手段を備えている。   FIG. 6 shows a flowchart of a main part of an inspection method of a circuit board inspection apparatus according to still another embodiment of the present invention. The circuit board inspection apparatus used in the inspection method of the present embodiment includes the circuit length of the circuit pattern of the circuit 10 to be inspected on the circuit board, the type of material constituting the insulating portion of the circuit board, and a pair of probes. An input means (not shown) for inputting position information of both ends of the circuit 10 to be inspected that the set contacts is provided. This input means includes design information such as circuit board manufacturing data, design data, circuit length of the circuit pattern to be inspected, type of material constituting the insulating portion of the circuit board (for example, glass epoxy or ceramic), and both end positions. A computer capable of inputting the digitized information and a storage means connected thereto. Further, the frequency of the AC power source of the power source 1 that generates the test current in which the DC current and the AC current are superimposed, the size of the circuit length of each circuit pattern to be tested and the insulating portion of the circuit board are configured. Based on the type of material to be equipped, there is a computer or other means for setting the value to maximize the second harmonic generated by a potential defect such as an abnormally thin part in the circuit pattern to be inspected. ing.

図6に示される本発明の実施の形態の検査方法では、検査開始(ステップ60)の後に、図示しないコンピュータに入力されている製造情報、設計情報等から被検査回路パターンの回路長や、回路基板の絶縁部分を構成する材料の種類や、プローブの接触する回路両端位置等の情報を読み取る(ステップ61)。そして、被検査回路パターンをその回路長の大きさ及びその回路基板の絶縁材料の種類に基づいて潜在的な欠陥検出に最適な交流電源の周波数の大きさが予め設定されて、最適な周波数が設定値1、2、3より小さいか又は大きいかに対応していくつかのグループに分類する(ステップ62)。   In the inspection method according to the embodiment of the present invention shown in FIG. 6, after the start of inspection (step 60), the circuit length of the circuit pattern to be inspected and the circuit from the manufacturing information and design information input to a computer (not shown) Information such as the type of material constituting the insulating portion of the substrate and the positions of both ends of the circuit in contact with the probe is read (step 61). The circuit pattern to be inspected is preset in advance with the optimum frequency frequency of the AC power source for potential defect detection based on the size of the circuit length and the type of insulating material of the circuit board. Depending on whether it is smaller or larger than the set values 1, 2, 3, it is classified into several groups (step 62).

ステップ62で設定値1以下の最適な周波数の回路長及び基板絶縁材料を持つ被検査回路10には、所定の周波数1を選択する(ステップ63)。設定値1よりも大きくて設定値2以下の最適な周波数の回路長及び基板絶縁材料を持つ被検査回路10には、所定の周波数2を選択する(ステップ64)。設定値2よりも大きくて設定値3以下の最適な周波数の回路長及び基板絶縁材料を持つ被検査回路10には、所定の周波数3を選択する(ステップ65)。このようにして、回路長の大きさ及び基板絶縁材料に基づいて潜在的な結果の検出を最適にする交流電源の周波数の大きさが選択される。次に、この選択された周波数を持つ交流電流と直流電流とが重畳された試験電流を電源1から一対のプローブ組を介してその被検査回路10の両端に印加するため、一対のプローブ組を移動する(ステップ66)。そして、選択された周波数の交流電流が直流電流に重畳された試験電流を被検査回路10の両端間に流して、選択された周波数の二次高調波を観測し(ステップ67)、この二次高調波を観測した結果、被検査回路10中の潜在的な欠陥11の有無を示すデータを記憶する(ステップ68)。回路基板中の全被検査回路パターンの検査が終了したかを判定して(ステップ69)、全検査が終了したならば終了し、終了していなければ次の被検査回路パターンを検査するためにステップ61に戻る。   In step 62, the predetermined frequency 1 is selected for the circuit under test 10 having the circuit length and the substrate insulating material having the optimum frequency equal to or less than the set value 1 (step 63). The predetermined frequency 2 is selected for the circuit 10 to be inspected having the circuit length and the substrate insulating material having the optimum frequency larger than the set value 1 and less than or equal to the set value 2 (step 64). The predetermined frequency 3 is selected for the circuit 10 to be inspected having the circuit length and the substrate insulating material having the optimum frequency larger than the set value 2 and not more than the set value 3 (step 65). In this way, the frequency magnitude of the AC power source is selected that optimizes detection of potential results based on the circuit length magnitude and the substrate insulation material. Next, in order to apply a test current in which an alternating current having a selected frequency and a direct current are superimposed from the power source 1 to both ends of the circuit under test 10 through the pair of probes, the pair of probes is Move (step 66). Then, a test current in which an alternating current of the selected frequency is superimposed on the direct current is passed between both ends of the circuit 10 to be inspected, and a second harmonic of the selected frequency is observed (step 67). As a result of observing the harmonics, data indicating the presence or absence of a potential defect 11 in the circuit under test 10 is stored (step 68). It is determined whether the inspection of all the circuit patterns to be inspected in the circuit board has been completed (step 69). If all the inspections have been completed, the inspection is completed. If not, the next circuit pattern to be inspected is inspected. Return to step 61.

本実施の形態の方法により、被検査回路の回路長の大きさ及び基板絶縁材料の種類に基づいて、直流電流に重畳される交流電流の周波数の大きさを、異常に細い個所等の潜在的な欠陥により発生する二次高調波が大きくなるように選択している。このため、潜在的な欠陥の検出の精度を高めることができる。   According to the method of the present embodiment, based on the circuit length of the circuit to be inspected and the type of the substrate insulating material, the frequency of the alternating current superimposed on the direct current is set to a potential such as an abnormally thin portion. The second harmonic generated by a simple defect is selected to be large. For this reason, the precision of detection of a potential defect can be improved.

本発明は、回路基板の検査に利用することができる。   The present invention can be used for inspection of circuit boards.

モデル化された被検査回路の異常に細い個所の潜在的な欠陥を示す図。The figure which shows the potential defect of the abnormally thin part of the to-be-inspected circuit modeled. 従来の直流電流と交流電流を重畳させた試験電流を被検査回路に流して二次高調波を観測して潜在的な欠陥を検出する回路基板検査装置の回路ブロック図。The circuit block diagram of the circuit board inspection apparatus which detects the potential defect by flowing the test current which superimposed the conventional direct current and the alternating current through the circuit to be inspected, and observing the second harmonic. 本発明の1つの実施の形態による回路基板検査装置のブロック図。1 is a block diagram of a circuit board inspection apparatus according to one embodiment of the present invention. 本発明の別の実施の形態による回路基板検査装置のブロック図。The block diagram of the circuit board inspection apparatus by another embodiment of this invention. 本発明のさらに別の実施の形態による回路基板検査装置の操作の流れを示すフローチャート図。The flowchart figure which shows the flow of operation of the circuit board inspection apparatus by another embodiment of this invention. 本発明のさらに別の実施の形態による回路基板検査装置の操作の流れを示すフローチャート図。The flowchart figure which shows the flow of operation of the circuit board inspection apparatus by another embodiment of this invention. 縦軸に直流電流及び交流電流を重畳させた試験電流を、横軸に時間をとって示す図。The figure which shows the test electric current which superimposed the direct current and alternating current on the vertical axis | shaft, and took time on the horizontal axis. 従来の一対のプローブ組を持つ回路基板検査装置による検査工程(A)と、図3に示す本発明の実施例による二対のプローブ組を持つ回路基板検査装置による検査工程(B)とを対比して示す概略的なタイムチャート図。Comparison between the inspection process (A) by the conventional circuit board inspection apparatus having a pair of probe sets and the inspection process (B) by the circuit board inspection apparatus having two pairs of probe sets according to the embodiment of the present invention shown in FIG. FIG.

符号の説明Explanation of symbols

1、1a、1b、1c 電源
10、10a、10b 被検査回路
11 異常に細い個所(潜在的な欠陥)
20、20a、20b 検知回路
21、21a、21b 直流電源
22 交流電源
23、24、23a、24a、23b、24b プローブ組
40 スイッチ
41、42 制御回路
1, 1a, 1b, 1c Power supply 10, 10a, 10b Circuit under test 11 Abnormally narrow part (potential defect)
20, 20a, 20b Detection circuit 21, 21a, 21b DC power supply 22 AC power supply 23, 24, 23a, 24a, 23b, 24b Probe set 40 Switch 41, 42 Control circuit

Claims (5)

複数の回路を含む回路基板を検査するため、直流電流と交流電流とを重畳した試験電流を回路基板の被検査回路に流して、試験電流のジュール熱による被検査回路の加熱及び冷却の温度特性により被検査回路のクラック又は狭窄部から発生する交流電流の二次高調波を観測して被検査回路の潜在的な欠陥を検出する装置であって、
直流電流を発生するための第1及び第2直流電源と、
所定の周波数の交流電流を発生するための交流電源と、
被検査回路の両端に接続するためにそれぞれ対をなす第1及び第2プローブ組と、
前記交流電源を前記第1プローブ組又は前記第2プローブ組に切替えて接続するためのスイッチと、
前記第1又は第2プローブ組から取り出された電流に含まれる前記交流電源の前記周波数の二倍の周波数を持つ二次高調波を観測して被検査回路中の潜在的な欠陥を検出する検知回路と、を含み、
前記スイッチが、検査前に予熱するために前記第1又は第2直流電源のいずれか一方からの直流電流を前記第1又は第2プローブ組を介して被検査回路に流し、検査時に前記第1又は第2の直流電源のいずれか一方からの直流電流と前記交流電源からの交流電流を重畳した試験電流を生成して前記第1又は第2プローブ組を介して被検査回路へ流し、前記第1プローブ組に接続された被検査回路及び前記第2プローブ組に接続された被検査回路との間で予熱及び検査を切替えることができる回路基板検査装置。
In order to inspect a circuit board including a plurality of circuits, a test current in which a direct current and an alternating current are superimposed is applied to the circuit under test of the circuit board, and the temperature characteristics of heating and cooling of the circuit under test by Joule heat of the test current A device for observing a second harmonic of an alternating current generated from a crack or constriction of a circuit to be inspected to detect a potential defect of the circuit to be inspected,
First and second DC power supplies for generating a DC current;
An AC power source for generating an AC current of a predetermined frequency;
A pair of first and second probes each paired to connect to both ends of the circuit under test;
A switch for switching and connecting the AC power source to the first probe set or the second probe set;
Detection for detecting a potential defect in the circuit to be inspected by observing a second harmonic having a frequency twice the frequency of the AC power source included in the current extracted from the first or second probe set. A circuit,
The switch causes a DC current from either the first or second DC power supply to flow through the circuit to be inspected via the first or second probe set in order to preheat before the inspection, and the first current is supplied during the inspection. Alternatively, a test current in which a direct current from either one of the second direct current power supplies and an alternating current from the alternating current power supply are superimposed is generated and passed to the circuit under test via the first or second probe set, and the first A circuit board inspection apparatus capable of switching preheating and inspection between a circuit to be inspected connected to one probe set and a circuit to be inspected connected to the second probe set.
複数の回路を含む回路基板を検査するため、直流電流と交流電流とを重畳した試験電流を回路基板の被検査回路に流して、試験電流のジュール熱による被検査回路の加熱及び冷却の温度特性により被検査回路のクラック又は狭窄部から発生する交流電流の二次高調波を観測して被検査回路の潜在的な欠陥を検出する装置であって、
直流電流を発生するための第1及び第2直流電源と、
互いに干渉しない所定の第1及び第2周波数の交流電流を発生するための第1及び第2交流電源と、
被検査回路の両端に接続するためにそれぞれ対をなす第1及び第2プローブ組と、
前記第1又は第2直流電源からの直流電流と前記第1又は第2交流電源からの交流電流とを重畳した試験電流を生成して前記第1又は第2プローブ組へ与える手段と、
前記第1プローブ組から取り出された電流に含まれる前記第1交流電源の前記第1周波数の二倍の周波数を持つ二次高調波を観測して被検査回路中の潜在的な欠陥を検出する第1検知回路と、
前記第2プローブ組から取り出された電流に含まれる前記第2交流電源の前記第2周波数の二倍の周波数を持つ二次高調波を観測して被検査回路中の潜在的な欠陥を検出する第2検知回路と、
を含み、前記第1及び第2プローブ組で2つの被検査回路を同時に検査をすることができる回路基板検査装置。
In order to inspect a circuit board including a plurality of circuits, a test current in which a direct current and an alternating current are superimposed is passed through the circuit under test on the circuit board, and the temperature characteristics of heating and cooling of the circuit under test by Joule heat of the test current A device for observing a second harmonic of an alternating current generated from a crack or constriction of a circuit to be inspected to detect a potential defect of the circuit to be inspected,
First and second DC power supplies for generating a DC current;
First and second AC power sources for generating AC currents of predetermined first and second frequencies that do not interfere with each other;
A pair of first and second probes each paired to connect to both ends of the circuit under test;
Means for generating a test current in which a direct current from the first or second direct current power supply and an alternating current from the first or second alternating current power supply are superimposed and supplying the test current to the first or second probe set;
A potential defect in the circuit to be inspected is detected by observing a second harmonic having a frequency twice the first frequency of the first AC power source included in the current taken out from the first probe set. A first detection circuit;
A potential defect in the circuit to be inspected is detected by observing a second harmonic having a frequency twice the second frequency of the second AC power source contained in the current taken out from the second probe set. A second detection circuit;
A circuit board inspection apparatus capable of simultaneously inspecting two circuits to be inspected with the first and second probe sets.
前記被検査回路の回路の断面積の大きさを入力する回路幅入力手段と、
前記直流電流又は交流電流の電流値の大きさを、前記回路幅入力手段で入力された前記被検査回路の前記回路の断面積の大きさに基づいて、前記検知回路で観測される二次高調波が大きくなるように調節する手段と、
をさらに含む前記請求項のいずれかに記載の回路基板検査装置。
Circuit width input means for inputting the size of the cross-sectional area of the circuit of the circuit under test;
The magnitude of the current value of the direct current or alternating current is determined based on the size of the cross-sectional area of the circuit to be inspected inputted by the circuit width input means, and the second harmonic observed by the detection circuit. A means of adjusting the waves to be large,
The circuit board inspection apparatus according to claim 1, further comprising:
前記被検査回路の回路線長の大きさ及び回路基板の材料の種類を入力する回路長等入力手段と、
前記交流電源の前記所定の周波数の大きさを、前記回路長等入力手段で入力された前記被検査回路の前記回路長の大きさ及び回路基板の材料の種類に基づいて、前記検知回路で観測される二次高調波が大きくなるように調節する手段と、
をさらに含む前記請求項のいずれかに記載の回路基板検査装置。
An input means such as a circuit length for inputting the size of the circuit line length of the circuit to be inspected and the type of material of the circuit board;
The magnitude of the predetermined frequency of the AC power source is observed by the detection circuit based on the magnitude of the circuit length of the circuit to be inspected and the type of material of the circuit board inputted by the input means such as the circuit length. Means for adjusting the second harmonic to be increased,
The circuit board inspection apparatus according to claim 1, further comprising:
複数の回路を含む回路基板を検査するため、直流電流と交流電流を重畳した試験電流を回路基板の被検査回路に流して、試験電流のジュール熱による被検査回路の加熱及び冷却の温度特性により被検査回路のクラック又は狭窄部などから発生する交流電流の二次高調波を観測して被検査回路の潜在的な欠陥を検出する方法であって、
第1及び第2直流電流を発生するステップと、
所定の周波数の交流電流を発生するステップと、
前記第1又は第2直流電流のいずれかを検査前の被検査回路に流して予熱するステップと、
前記第1又は第2直流電流のいずれかと前記交流電流とが重畳された試験電流を予熱後の被検査回路に流すステップと、
被検査回路から取り出された前記試験電流に含まれる前記所定の周波数の二倍の周波数を持つ二次高調波を観測して被検査回路中の潜在的な欠陥を検出するステップと、
を含む回路基板検査方法。
In order to inspect a circuit board including a plurality of circuits, a test current in which a direct current and an alternating current are superimposed is passed through the circuit under test of the circuit board, and the temperature characteristics of heating and cooling of the circuit under test by Joule heat of the test current A method for observing a second harmonic of an alternating current generated from a crack or constriction of a circuit to be inspected and detecting a potential defect of the circuit to be inspected,
Generating first and second DC currents;
Generating an alternating current of a predetermined frequency;
Preheating by flowing either the first or second direct current through the circuit under test before testing;
Passing a test current in which either the first or second direct current and the alternating current are superimposed on a circuit to be inspected after preheating;
Observing a second harmonic having a frequency twice the predetermined frequency included in the test current taken from the circuit under test to detect a potential defect in the circuit under test;
A circuit board inspection method including:
JP2004118215A 2004-04-13 2004-04-13 Circuit board inspection device and inspection method Pending JP2005300386A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007198758A (en) * 2006-01-24 2007-08-09 Hioki Ee Corp Apparatus and method for inspection
JP2008281406A (en) * 2007-05-09 2008-11-20 Nidec-Read Corp Board inspection device and board inspection method
JP2010249666A (en) * 2009-04-16 2010-11-04 Hioki Ee Corp Inspection device and inspection method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007198758A (en) * 2006-01-24 2007-08-09 Hioki Ee Corp Apparatus and method for inspection
JP2008281406A (en) * 2007-05-09 2008-11-20 Nidec-Read Corp Board inspection device and board inspection method
JP2010249666A (en) * 2009-04-16 2010-11-04 Hioki Ee Corp Inspection device and inspection method

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