JPS61260147A - Device for inspecting surface defect - Google Patents

Device for inspecting surface defect

Info

Publication number
JPS61260147A
JPS61260147A JP10288585A JP10288585A JPS61260147A JP S61260147 A JPS61260147 A JP S61260147A JP 10288585 A JP10288585 A JP 10288585A JP 10288585 A JP10288585 A JP 10288585A JP S61260147 A JPS61260147 A JP S61260147A
Authority
JP
Japan
Prior art keywords
signal
inspected
reflected light
defect
reflected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10288585A
Other languages
Japanese (ja)
Inventor
Tomoyuki Kanda
智幸 神田
Hitoshi Tanaka
均 田中
Noriyuki Kosaka
宣之 小坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10288585A priority Critical patent/JPS61260147A/en
Publication of JPS61260147A publication Critical patent/JPS61260147A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/89Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/8901Optical details; Scanning details

Landscapes

  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

PURPOSE:To detect precisely defects by receiving reflected and transmitted light beams from a subject to be inspected and separating the penetrating part and existing part of the subject to be inspected. CONSTITUTION:The laser beam of a laser spot beam scanning part 1 is reflected by a semi-transparent mirror 2, and scans the surface of the subject to be inspected 5. The laser beam 1b reflected on the surface passes through the mirror 2 and makes incident on a reflected light receiving part 3. On the other hand a laser beam 1c passing through the penetrating part of the subject to be inspected 5 makes incident on a transmitted light receiving part 4. The transmitted light beam 1c and the reflected light beam 1b are converted into electrical signals by photoelectrical converting parts 8 and 6. A synchronizing signal 7a takes synchronization in a separation processing part 9, and a reflected light signal 6a and a transmitted light signal 8a are added to output a signal 9a available from separating the penetrating part. Then the signals 7a, 8a and 9a are inputted to an edge removing part 10 to output a defect signal 10a. In a deciding circuit 11 the signal 10a is inputted and compared with a comparison reference signal, which detects a part becoming a low level as a defect. Accordingly even when the subject to be inspected has a penetrating part, defects can be detected.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明はレーザ走査方式による被検査体の表面欠陥検
査装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a surface defect inspection device for an object to be inspected using a laser scanning method.

〔従来の技術〕[Conventional technology]

第2図は従来の表面欠陥装置を示す構成図である。図中
、1はレーザスポット光走査部、2は半透鏡、5は被検
査体であシ、3はレーザスポット光走査部1からのレー
ザ光1aが半透鏡2により反射され、更に被検査体5で
反射されて再び半透鏡2を通過したレーザ光1bを受光
する反射光受光部である。また6は反射光受光部3によ
り受光されたレーデ光を電気信号に変換する光電変換部
、12はこの光電変換部6で変換された電気信号より被
検査体50表面欠陥を検出する欠陥検出部である。
FIG. 2 is a block diagram showing a conventional surface defect device. In the figure, 1 is a laser spot light scanning unit, 2 is a semi-transparent mirror, 5 is an object to be inspected, 3 is a laser beam 1a from the laser spot light scanning unit 1 is reflected by the semi-transparent mirror 2, and 3 is an object to be inspected. This is a reflected light receiving section that receives the laser beam 1b that has been reflected by the semi-transparent mirror 2 and passed through the semi-transparent mirror 2 again. Further, 6 is a photoelectric conversion unit that converts the Raded light received by the reflected light receiving unit 3 into an electrical signal, and 12 is a defect detection unit that detects defects on the surface of the object to be inspected 50 from the electrical signal converted by the photoelectric conversion unit 6. It is.

次に動作について説明する。レーザスポット光走査部1
からのレーザ光1aは半透鏡2で反射して被検査体5の
表面を一定スポット径で走査し、その反射光が半透鏡2
を通して反射光受光部3に入射する。入射された反射光
は光電変換部6で電気信号に変換されて欠陥検出部12
1C入力する。
Next, the operation will be explained. Laser spot light scanning section 1
The laser beam 1a from is reflected by the semi-transparent mirror 2 and scans the surface of the object to be inspected 5 with a constant spot diameter, and the reflected light is reflected by the semi-transparent mirror 2.
The reflected light enters the reflected light receiving section 3 through the reflected light. The incident reflected light is converted into an electrical signal by the photoelectric conversion unit 6 and sent to the defect detection unit 12.
Input 1C.

ここで被検査体5の表面に欠陥が存在しなければ、表面
は平担であるから、その反射光は殆んど反射光受光部3
に入射され、第3図に示す5aから5b間を走査したと
きの光電変換部6からの出力は5Cで示すような信号が
現われる。また、表面に傷、異物付着の欠陥13があっ
た場合、光電変換部6からの出力は5fで示す信号とな
って欠陥13部分の信号レベルが低下することになる。
Here, if there is no defect on the surface of the object to be inspected 5, the surface is flat, and most of the reflected light will be transmitted to the reflected light receiver 3.
When the photoelectric conversion unit 6 is scanned between 5a and 5b shown in FIG. 3, the output from the photoelectric conversion unit 6 is a signal shown as 5C. Furthermore, if there is a defect 13 such as a scratch or a foreign matter adhering to the surface, the output from the photoelectric converter 6 becomes a signal indicated by 5f, and the signal level at the defect 13 portion decreases.

このような走査信号5c、5fは欠陥検出部12に入力
され、欠陥検出部12ではこれをレーザスポット光走査
毎に比較基準値信号5jに基づいて比較し、この比較基
準値信号5jよりも低いレベルとなる部分を欠陥として
検出する。
Such scanning signals 5c and 5f are input to the defect detection section 12, and the defect detection section 12 compares them based on the comparison reference value signal 5j every time the laser spot beam is scanned. Detect the level part as a defect.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従来の表面欠陥検査装置は以上のように構成され、正常
な面での走査信号5Cのレベルから比較基準信号5jよ
りも低下した部分を欠陥として検出しているので、第3
図に示す5gから5h間のように、打ちぬきなどの貫通
部分14を有する被検査体5においては、その走査信号
が51のようになる。従って貫通部分14と欠陥13と
の判別が不可能とな凱この、ような貫通部分14を有す
る被検査体5については検査が行えない問題点があった
The conventional surface defect inspection device is configured as described above, and detects as a defect a portion where the level of the scanning signal 5C on a normal surface is lower than the comparison reference signal 5j.
As shown in the figure between 5g and 5h, the scanning signal is as shown in 51 for the object 5 to be inspected which has a piercing portion 14 such as a punched portion. Therefore, there is a problem in that it is impossible to distinguish between the penetrating portion 14 and the defect 13, and that it is impossible to inspect the object 5 to be inspected having such a penetrating portion 14.

仁の発明は上記の問題点を解決するためになされたもの
で、貫通部分などを有する被検査体であっても欠陥の検
出を正確に行うことのできる表面欠陥検査装置を得るこ
とを目的とする。
Jin's invention was made in order to solve the above problems, and the purpose is to obtain a surface defect inspection device that can accurately detect defects even in objects to be inspected that have penetration parts. do.

〔問題点を解決するだめの手段〕[Failure to solve the problem]

この発明に係る表面欠陥検査装置は、被検査体からの反
射光を受光する反射光受光部と、通過するレーデスポッ
ト光を受光する透過光受光部と、これらの出力信号に基
づいて被検査体の貫通部分と存在部分とを判別する分離
処理部と、被検査体のエツジ部分の信号を除去し欠陥信
号を出力するエツジ除去部と、欠陥信号に基づいて被検
査体表面上の欠陥を検出する欠陥判定部とを備えたもの
である。
The surface defect inspection device according to the present invention includes a reflected light receiving section that receives reflected light from an object to be inspected, a transmitted light receiving section that receives passing radar spot light, and a surface defect inspection device that detects an object to be inspected based on output signals thereof. a separation processing unit that distinguishes between a penetrating part and an existing part of the object; an edge removal unit that removes a signal from an edge part of the object to be inspected and outputs a defect signal; The defect determining unit is also equipped with a defect determination unit for detecting defects.

〔作 用〕[For production]

この発明の表面欠陥検査装置においては、被検査体から
の反射光と透過光とを受光し、分離処理部でこれらの信
号に基づいて被検査体の貫通部分と存在部分とを分離し
、更にエツジ除去部でそのエツジ部分を除去して存在部
分上の欠陥信号のみを検出する。
In the surface defect inspection apparatus of the present invention, reflected light and transmitted light from the object to be inspected are received, the separation processing section separates the penetrated part and the existing part of the object to be inspected based on these signals, and further The edge removal section removes the edge portion and detects only the defect signal on the existing portion.

〔実施例〕〔Example〕

第1図はこの発明の一実施例による表面欠陥検査装置の
構成を示す図である。図中、1は従来装置と同様のレー
ザスポット光走査部、そして同様に1aはレーザ光、2
は半透鏡、3は配列ファイバ(または光学レンズ〕で構
成した反射光受光部である。また4は反射光受光部3と
同様に構成した透過光受光部、5は被検査体、6,7.
8は各々、反射光受光部3からの信号、同期のための参
照光の信号および透過光受光部4からの信号を電気信号
に変換するための光電変換部で、6a、7a8aは各々
の光電変換部6,7,8から出力される反射光信号、同
期信号および透過光信号である。
FIG. 1 is a diagram showing the configuration of a surface defect inspection apparatus according to an embodiment of the present invention. In the figure, 1 is a laser spot light scanning unit similar to the conventional device, 1a is a laser beam, and 2
3 is a semi-transparent mirror, 3 is a reflected light receiver configured with an array fiber (or optical lens), 4 is a transmitted light receiver configured in the same manner as the reflected light receiver 3, 5 is an object to be inspected, 6, 7 ..
8 are photoelectric converters for converting the signal from the reflected light receiver 3, the reference light signal for synchronization, and the signal from the transmitted light receiver 4 into electrical signals, and 6a and 7a8a are photoelectric converters, respectively. These are a reflected light signal, a synchronization signal, and a transmitted light signal output from the converters 6, 7, and 8.

更に、9は透過光信号8aに基づいて反射光信号6aか
ら被検査体5の貫通部分14ft判別、分離するための
分離処理部、10は、第4図に示す被検査体5の貫通部
分14と存在部分15との境界であるエツジ部分で欠陥
13と同様に光が散乱してしまうために、透過光信号8
aに基づいてそのエツジ部分を除去するエツジ除去部、
11はこれらの処理を行った後の信号から欠陥を判定す
る欠陥判定部である。
Furthermore, 9 is a separation processing unit for determining and separating the penetration portion 14ft of the object to be inspected 5 from the reflected light signal 6a based on the transmitted light signal 8a, and 10 is the penetration portion 14 of the object to be inspected 5 shown in FIG. Since light is scattered at the edge portion which is the boundary between
an edge removal unit that removes the edge portion based on a;
Reference numeral 11 denotes a defect determination unit that determines defects from the signals after these processes.

次kかかる構成の表面欠陥検査装置の動作について説明
する。レーザスポット光走査部1よ多発せられたレーザ
光1aは半透鏡2で反射されて被検査体5の表面を走査
し、この表面で反射したレーザ光1bは半透鏡2を透過
して反射光受光部3に入射される。一方、被検査体5の
貫通部分14を通過したレーザ光1cは透過光受光部4
に入射し、この透過光1cおよび反射光1bは光電変換
部8,6により亀気信号tic変換される。また分離処
理部9で使用する1走査毎の同期信号を得るために、半
透鏡2を直接通過したレーザ光1aを光電変換部7で電
気信号に変換する。
Next, the operation of the surface defect inspection apparatus having the above configuration will be explained. The laser beam 1a emitted multiple times by the laser spot light scanning unit 1 is reflected by a semi-transparent mirror 2 and scans the surface of the object to be inspected 5, and the laser beam 1b reflected from this surface is transmitted through the semi-transparent mirror 2 and becomes reflected light. The light is incident on the light receiving section 3. On the other hand, the laser beam 1c that has passed through the penetrating portion 14 of the object to be inspected 5 is transmitted to the transmitted light receiving section 4.
The transmitted light 1c and the reflected light 1b are converted into a tortoise signal tic by the photoelectric converters 8 and 6. Further, in order to obtain a synchronizing signal for each scan used in the separation processing section 9, the laser beam 1a that directly passes through the semi-transparent mirror 2 is converted into an electric signal by the photoelectric conversion section 7.

ここで第4図に示すように、被検査体5が貫通部分14
と欠陥13とを有する場合、分離処理部9に入力される
反射光信号6aおよび透過信号8aは図示したようにな
る。そしてこの分離処理部9では同期信号7aに基づい
て同期をとり、反射光信号6aと透過光信号8&を加え
るととKより貫通部分1.4′?:分離した信号9aを
出力する。エツソ除去部10は、分離処理部9より出力
された信号9aと同期信号7aと透過光信号8aとを入
力し、信号処理により透過光信号8aを拡大して信号8
bを生成してこれと信号9aとを加えることにより欠陥
信号10aを出力する。更に欠陥判定部11では、上記
欠陥信号10aを入力し比較基準値信号(第3図(5j
) )に基づいて比較し、この比較基準信号5jよりも
低いレベルとなる部分を欠陥として検出する。
Here, as shown in FIG.
and defect 13, the reflected light signal 6a and transmitted signal 8a input to the separation processing section 9 are as shown in the figure. Then, this separation processing section 9 synchronizes based on the synchronization signal 7a, and when the reflected light signal 6a and the transmitted light signal 8& are added, the penetration portion 1.4'? : Output the separated signal 9a. The ethos removal unit 10 inputs the signal 9a, the synchronization signal 7a, and the transmitted light signal 8a output from the separation processing unit 9, and enlarges the transmitted light signal 8a by signal processing to generate a signal 8a.
By generating signal b and adding it to signal 9a, defect signal 10a is output. Further, the defect determination section 11 inputs the defect signal 10a and generates a comparison reference value signal (Fig. 3 (5j
)), and a portion whose level is lower than this comparison reference signal 5j is detected as a defect.

なお上記一実施例では半透鏡2’a−用いて正反射光を
受光しているが、この半透鏡2を全反射鏡に置き換え斜
方からレーザ光を照射して正反射光を受光する方式ある
いは欠陥部分による散乱光を受光する方式でも同様の効
果を得ることができる。
In the above embodiment, the semi-transparent mirror 2'a- is used to receive specularly reflected light, but this semi-transparent mirror 2'a- is replaced with a total reflective mirror, and a laser beam is irradiated from an oblique direction to receive specularly reflected light. Alternatively, a similar effect can be obtained by a method of receiving scattered light from a defective portion.

〔発明の効果〕〔Effect of the invention〕

以上のようにこの発明の表面欠陥検査装置によれば、被
検査体からの反射光と通過光を検出してその貫通部分と
存在部分とを分離するよう構成したので、被検査体が貫
通部分を有する場合であっても貫通部分を有しなh場合
と同様に欠陥の検出を行うことができ、従来では検査不
可能であった被検査体に対しても検査を行うことが可能
となる。
As described above, according to the surface defect inspection device of the present invention, the reflected light and the passing light from the object to be inspected are detected and the penetrating portion and existing portion thereof are separated. Even in cases where there are no through parts, defects can be detected in the same way as in cases where there are no through parts, making it possible to inspect objects to be inspected that were previously impossible to inspect. .

これは、例えばICリードフレーム検査等に多大な効果
を与えるものである。
This has a great effect on, for example, IC lead frame inspection.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の一実施例による表面欠陥検査装置の
構成を示す図、第2図は従来の表面欠陥検査装置の構成
を示す図、第3図は従来の表面欠陥検査装置における被
検査体の走査とその出力信号の波形を示す図、第4図は
この発明の一実施例による表面欠陥検査装置における被
検査体の走査とその出力信号の波形を示す図である。 1・・・レーザスポット光走査部、3・・・反射光受光
部、4・・・透過光受光部、5・・・被検査体、5j・
・・比較基準値信号、6a・・・反射光信号、8a・・
・透過光信号、9・・・分離処理部、10・・・エツソ
除去部、10a・・・欠陥信号、11・・・欠陥判定部
。 なお、図中、同一符号は同一または相当部分を示す。
FIG. 1 is a diagram showing the configuration of a surface defect inspection device according to an embodiment of the present invention, FIG. 2 is a diagram showing the configuration of a conventional surface defect inspection device, and FIG. 3 is a diagram showing the structure of a conventional surface defect inspection device. FIG. 4 is a diagram showing scanning of an object to be inspected and the waveform of its output signal in a surface defect inspection apparatus according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Laser spot light scanning part, 3... Reflected light receiving part, 4... Transmitted light receiving part, 5... Inspection object, 5j.
...Comparison reference value signal, 6a...Reflected light signal, 8a...
- Transmitted light signal, 9... Separation processing section, 10... Esso removal section, 10a... Defect signal, 11... Defect determination section. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【特許請求の範囲】[Claims] 被検査体の表面にレーザスポット光走査部よりレーザス
ポット光を照射しこれを走査させ、被検査体の正常面と
欠陥面との反射光量の差を利用して表面欠陥を検出する
表面欠陥検査装置において、前記被検査体からの反射光
を受光する反射光受光部と、前記被検査体を通過するレ
ーザスポット光を受光する透過光受光部と、これら反射
光受光部および透過光受光部からの出力に対応した反射
光信号および透過光信号に基づいて、前記被検査体の有
する貫通部分と存在部分とを判別する分離処理部と、こ
の分離処理部からの出力信号および前記透過光信号に基
づいて前記被検査体の貫通部分と存在部分との境界であ
るエッジ部分を除去し欠陥信号を出力するエッジ除去部
と、この欠陥信号と比較基準値信号とを比較して欠陥部
分を検出する欠陥判定部とを備えたことを特徴とする表
面欠陥検査装置。
Surface defect inspection that irradiates the surface of the object to be inspected with a laser spot light from a laser spot light scanning unit and scans it, detecting surface defects by using the difference in the amount of reflected light between the normal surface and defective surface of the object to be inspected. In the apparatus, a reflected light receiving section that receives reflected light from the object to be inspected, a transmitted light receiving section that receives the laser spot light that passes through the object to be inspected, and from these reflected light receiving section and transmitted light receiving section. a separation processing unit that discriminates between a penetrating portion and an existing portion of the object to be inspected based on a reflected light signal and a transmitted light signal corresponding to the output of the separation processing unit; an edge removal unit that removes an edge portion that is a boundary between a penetrating portion and an existing portion of the object to be inspected based on the inspection object and outputs a defect signal, and detects a defective portion by comparing this defect signal with a comparison reference value signal. A surface defect inspection device comprising: a defect determination section.
JP10288585A 1985-05-15 1985-05-15 Device for inspecting surface defect Pending JPS61260147A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10288585A JPS61260147A (en) 1985-05-15 1985-05-15 Device for inspecting surface defect

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10288585A JPS61260147A (en) 1985-05-15 1985-05-15 Device for inspecting surface defect

Publications (1)

Publication Number Publication Date
JPS61260147A true JPS61260147A (en) 1986-11-18

Family

ID=14339320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10288585A Pending JPS61260147A (en) 1985-05-15 1985-05-15 Device for inspecting surface defect

Country Status (1)

Country Link
JP (1) JPS61260147A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01311256A (en) * 1988-06-08 1989-12-15 Dainippon Printing Co Ltd Shape inspecting device
EP0902274A2 (en) * 1997-09-12 1999-03-17 Engberts mess-, Steuer,- und Regelsysteme GmbH Apparatus for the inspection of elongated objects
JP2008096296A (en) * 2006-10-12 2008-04-24 Lasertec Corp Foreign matter inspection method and foreign matter inspecting system using the same
WO2012066990A1 (en) * 2010-11-16 2012-05-24 東洋鋼鈑株式会社 Sheet-material inspection method and sheet-material inspection device
WO2012067054A1 (en) * 2010-11-16 2012-05-24 東洋鋼鈑株式会社 Method for inspecting porous plate surface and apparatus for inspecting porous plate surface

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01311256A (en) * 1988-06-08 1989-12-15 Dainippon Printing Co Ltd Shape inspecting device
EP0902274A2 (en) * 1997-09-12 1999-03-17 Engberts mess-, Steuer,- und Regelsysteme GmbH Apparatus for the inspection of elongated objects
EP0902274A3 (en) * 1997-09-12 1999-05-19 Engberts mess-, Steuer,- und Regelsysteme GmbH Apparatus for the inspection of elongated objects
JP2008096296A (en) * 2006-10-12 2008-04-24 Lasertec Corp Foreign matter inspection method and foreign matter inspecting system using the same
WO2012066990A1 (en) * 2010-11-16 2012-05-24 東洋鋼鈑株式会社 Sheet-material inspection method and sheet-material inspection device
WO2012067054A1 (en) * 2010-11-16 2012-05-24 東洋鋼鈑株式会社 Method for inspecting porous plate surface and apparatus for inspecting porous plate surface
CN103119424A (en) * 2010-11-16 2013-05-22 东洋钢钣株式会社 Method for inspecting porous plate surface and apparatus for inspecting porous plate surface

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