JPS6219075B2 - - Google Patents

Info

Publication number
JPS6219075B2
JPS6219075B2 JP56184165A JP18416581A JPS6219075B2 JP S6219075 B2 JPS6219075 B2 JP S6219075B2 JP 56184165 A JP56184165 A JP 56184165A JP 18416581 A JP18416581 A JP 18416581A JP S6219075 B2 JPS6219075 B2 JP S6219075B2
Authority
JP
Japan
Prior art keywords
wick
case
communication hole
hollow chamber
filling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56184165A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5885555A (ja
Inventor
Migiwa Ando
Yukiaki Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP56184165A priority Critical patent/JPS5885555A/ja
Publication of JPS5885555A publication Critical patent/JPS5885555A/ja
Publication of JPS6219075B2 publication Critical patent/JPS6219075B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56184165A 1981-11-17 1981-11-17 セラミツクヒ−トシンク Granted JPS5885555A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56184165A JPS5885555A (ja) 1981-11-17 1981-11-17 セラミツクヒ−トシンク

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56184165A JPS5885555A (ja) 1981-11-17 1981-11-17 セラミツクヒ−トシンク

Publications (2)

Publication Number Publication Date
JPS5885555A JPS5885555A (ja) 1983-05-21
JPS6219075B2 true JPS6219075B2 (cs) 1987-04-25

Family

ID=16148495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56184165A Granted JPS5885555A (ja) 1981-11-17 1981-11-17 セラミツクヒ−トシンク

Country Status (1)

Country Link
JP (1) JPS5885555A (cs)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3891621B2 (ja) * 1996-12-19 2007-03-14 株式会社トクヤマ 窒化アルミニウム部材
US20240230240A9 (en) * 2021-02-26 2024-07-11 Kyocera Corporation Thermal device
US20250354759A1 (en) * 2022-05-31 2025-11-20 Kyocera Corporation Thermal device
CN119604736A (zh) * 2022-07-22 2025-03-11 京瓷株式会社 散热基板及均热板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5810370Y2 (ja) * 1977-08-26 1983-02-25 日本特殊陶業株式会社 電子回路装置塔載用セラミック基板

Also Published As

Publication number Publication date
JPS5885555A (ja) 1983-05-21

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