JPS62186590A - Plating process of terminal parts of printed circuit board - Google Patents
Plating process of terminal parts of printed circuit boardInfo
- Publication number
- JPS62186590A JPS62186590A JP2966386A JP2966386A JPS62186590A JP S62186590 A JPS62186590 A JP S62186590A JP 2966386 A JP2966386 A JP 2966386A JP 2966386 A JP2966386 A JP 2966386A JP S62186590 A JPS62186590 A JP S62186590A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- plating
- solder
- nickel
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims description 44
- 238000000034 method Methods 0.000 title claims description 30
- 229910000679 solder Inorganic materials 0.000 claims description 31
- 239000002253 acid Substances 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 38
- 229910052737 gold Inorganic materials 0.000 description 20
- 239000010931 gold Substances 0.000 description 20
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 19
- 229910052759 nickel Inorganic materials 0.000 description 19
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 238000004140 cleaning Methods 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 239000000243 solution Substances 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 229910001868 water Inorganic materials 0.000 description 11
- 239000007921 spray Substances 0.000 description 10
- 238000005406 washing Methods 0.000 description 10
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 238000005498 polishing Methods 0.000 description 7
- 238000007517 polishing process Methods 0.000 description 5
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 241000406668 Loxodonta cyclotis Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概要〕
プリント板端子部のめっき加工方法であって、プリント
板回路の半田めっきと同時にめっきされたプリント板端
子部の半田めっきを剥離して端子部の鋼部にニッケル、
金めつきを施すに際し、半田めっきの剥離後にホウフッ
化水素酸液を噴射して洗浄するホウフッ化水素酸スクラ
バ工程を設けた構成とし、端子部の半田や汚れを完全に
除去して活性化するとともに端子部の銅面を滑らかに仕
上げ、鋼部上にめっきされるニッケル、金めつきの密着
性および光沢をよくすることを可能とする。[Detailed Description of the Invention] [Summary] A method for plating printed board terminals, which involves peeling off the solder plating on the printed board terminals that has been plated at the same time as the solder plating of the printed board circuits, and applying the solder plating to the steel parts of the terminals. nickel,
When gold plating is applied, a borofluoric acid scrubber process is installed to spray and clean a fluoroboric acid solution after the solder plating is removed, completely removing solder and dirt from the terminal area and activating it. At the same time, it is possible to finish the copper surface of the terminal portion smoothly and to improve the adhesion and gloss of the nickel and gold plating plated on the steel portion.
本発明はプリント板端子部のめっき加工方法に関し、特
にプリント板端子部にめっきされるニッケル、金めつき
の密着性および光沢をよ（するように改良されたプリン
ト板端子部のめっき加工方法に関するものである。The present invention relates to a method for plating printed board terminals, and more particularly to a method for plating printed board terminals that is improved to improve the adhesion and gloss of nickel and gold plating on printed board terminals. It is.
プリント板の配線回路を外部に取出す端子部は、外部接
栓との経年変化による接触抵抗の劣化等が発生しないよ
うにニッケル、金めつきが施こされる。The terminal portion of the printed board for connecting the wiring circuit to the outside is plated with nickel or gold to prevent deterioration of contact resistance due to aging with external plugs.
この端子部にニッケル、金めつきを施すに際し、端子部
の銅表面に半田残滓や汚れがあるとニッケル、金めつき
がなじまず密着性がわるくなり、経年使用による接触抵
抗の劣化等を招くとともに、その表面が粗いとめっき仕
上がりに光沢がなくなり、外観品質を低下せしめる。When applying nickel or gold plating to this terminal part, if there is any solder residue or dirt on the copper surface of the terminal part, the nickel or gold plating will not blend in properly, resulting in poor adhesion and deterioration of contact resistance over time. At the same time, if the surface is rough, the plating finish loses its luster and the appearance quality deteriorates.
そこで、半田剥離後の端子部の銅表面に半田残滓や汚れ
をなくして滑らかにし、ニッケル１金めつきの密着性と
光沢を得ることができるプリント板端子部のめっき加工
方法が要望されていた。Therefore, there has been a need for a plating method for printed board terminals that can eliminate solder residue and dirt from the copper surface of the terminal after solder has been removed, smooth it, and provide the adhesion and gloss of nickel-1-gold plating.
第３図は従来のプリント板端子部のめっき加工方式のブ
ロック図を示す。FIG. 3 shows a block diagram of a conventional plating method for printed board terminals.
第３図において、従来のめっき加工方式は、プリント板
端子部の半田を剥離する半田剥離工程１と、半田が剥離
された端子部の銅面を研磨する研磨工程２と、研磨面を
水洗いする水洗工程３と、水洗いされた研磨面を塩酸液
（１０％液）で洗浄する塩酸洗浄工程４と、塩酸洗浄さ
れた端子面を水洗いする水洗工程５と、水洗い後、端子
面にニッケル、金めつきを行なうニッケル、金めつき工
程６とより構成されている。In Figure 3, the conventional plating process consists of a solder stripping process 1 in which the solder from the printed board terminals is stripped off, a polishing process 2 in which the copper surface of the terminals from which the solder has been stripped is polished, and the polished surface is washed with water. Water washing step 3, Hydrochloric acid washing step 4 in which the washed polished surface is washed with hydrochloric acid solution (10% solution), Water washing step 5 in which the terminal surface washed with hydrochloric acid is washed with water, and after washing with water, nickel and gold are applied to the terminal surface. It consists of a nickel plating step 6 and a gold plating step 6 for plating.
半田剥離工程】において、プリント板回路の半田めっき
と同時にめっきされたプリント板端子部の半田を剥離剤
を用いて剥離する。In the solder stripping process, simultaneously with the solder plating of the printed circuit board, the solder on the plated terminals of the printed circuit board is stripped off using a stripping agent.
次に、研磨工程２において、界面活性剤を用いた手ブラ
シで端子面を研磨し、半田剥離工程１で残った残滓を除
去する。Next, in the polishing step 2, the terminal surface is polished with a hand brush using a surfactant to remove the residue left in the solder stripping step 1.
研磨工程後、水洗工程３と塩酸洗浄工程４において、水
洗いと、１０％塩酸液で約５分間洗浄して表面を洗浄し
、さらに細かい残滓や汚れを除去して水洗工程５で塩酸
液を洗い流した後、ニッケル。After the polishing process, the surface is washed with water and a 10% hydrochloric acid solution for about 5 minutes in a water washing process 3 and a hydrochloric acid washing process 4, and fine residues and dirt are removed, and the hydrochloric acid solution is washed away in a water washing process 5. After that, nickel.
金めつき工程６において端子部面にニッケル、金めつき
を行なう。In the gold plating step 6, nickel and gold plating is applied to the terminal surface.
上記のめつき加工方式において、端子部面の半田を除去
する方法は、界面活性剤を有する洗浄剤を用いて手ブラ
シにより端子面の研磨を行なう研磨工程２が主流となる
。In the above-mentioned plating process, the main method for removing solder from the terminal surface is polishing step 2 in which the terminal surface is polished with a hand brush using a cleaning agent containing a surfactant.
手ブラシによる端子面の研磨は、端子部の銅表面を粗く
するとともに、半田残滓や汚れを完全に除去できない。Polishing the terminal surface with a hand brush roughens the copper surface of the terminal portion and cannot completely remove solder residue and dirt.
それがために、粗くなった端子部の銅面にニッケル、金
めつきを施した場合、ニッケル、金めつきに光沢がでに
くくなって端子部の外観品質を低下せしめるとともに、
端子部の半田残滓や汚れによってニッケル、金めつきの
密着性がわるくなり、経年使用による接触抵抗の劣化等
を招いて信頼性を損なうといった問題がある。For this reason, when nickel or gold plating is applied to the roughened copper surface of the terminal, the nickel or gold plating becomes difficult to shine, reducing the appearance quality of the terminal.
Solder residue and dirt on the terminal portion deteriorate the adhesion of nickel and gold plating, leading to deterioration of contact resistance due to long-term use, which impairs reliability.
本発明はこのような点に鑑みて創作されたもので、プリ
ント板端子部のニッケル、金めつきの密着性と、光沢を
よくすることができるプリント板端子部のめっき加工方
法を提供することを目的としている。The present invention was created in view of these points, and aims to provide a plating method for printed board terminals that can improve the adhesion and gloss of nickel and gold plating on printed board terminals. The purpose is
第１図は本発明のプリント板端子部のめっき加工方式の
ブロック図であり、従来の研磨工程２に代わって、ホウ
フッ化水素酸液を噴射して洗浄するホウフッ化水素酸ス
クラバ工程７を設けた構成としている。FIG. 1 is a block diagram of the plating process for printed board terminals according to the present invention.In place of the conventional polishing step 2, a borofluoric acid scrubber step 7 is provided in which cleaning is performed by spraying a fluoroboric acid solution. The structure is as follows.
ホウフッ化水素酸スクラバ工程７において、ホウフッ化
水素酸液を端子部面に相当な圧力で当てて洗浄するスプ
レー洗浄と、ホウフッ化水素酸液を端子部面に相当な圧
力で当てるとともに、パフにより端子部面を研磨するパ
フ研磨洗浄、さらにホウフッ化水素酸液を端子部面に相
当な圧力で当て洗浄するスプレー洗浄とを一連化したラ
ンイで行ない、端子部面を付着する剥離半田の残滓を完
全に除去するとともに、剥離工程１の半田剥離で粗くな
った端子部の銅表面の凹凸をなくして清らかにする。In the borohydrofluoric acid scrubber step 7, spray cleaning is performed by applying a borofluoric acid solution to the terminal surface with considerable pressure, and cleaning is performed by applying a borofluoric acid solution to the terminal surface with a considerable pressure and then using a puff. We perform a series of puff polishing cleaning to polish the terminal surface, and spray cleaning by applying a fluoroboric acid solution to the terminal surface under considerable pressure to remove any residue of peeled solder that adheres to the terminal surface. In addition to completely removing the copper surface, the unevenness of the copper surface of the terminal portion, which has become rough due to the solder peeling in the peeling process 1, is removed and cleaned.
本発明では、ホウフッ化水素酸スクラバにより、半田剥
離後の残滓半田や汚れが完全に除去されるとともに、端
子部の銅面が滑らかとなり、密着性がよく、かつ光沢の
あるニッケル、金めつきを可能としている。In the present invention, the borohydrofluoric acid scrubber completely removes residual solder and dirt after solder stripping, and the copper surface of the terminal part is smooth, with good adhesion and shiny nickel and gold plating. is possible.
第１図は本発明のプリント板端子部のめっき方式のブロ
ック図、第２図（ａｌ〜ｆｃｌは−・実施例のホウフッ
化水素酸工程の模式図を示す。FIG. 1 is a block diagram of the plating method for printed board terminals of the present invention, and FIG. 2 (al to fcl are -) is a schematic diagram of the fluoroboric acid process of the embodiment.
第１図に示すように、一実施例のプリント板端子部のめ
っき方式は、半田剥離工程１で端子部の半田を剥離した
後、第２図ｆａｌに示すように、ホウフッ化水素酸液を
端子部面に相当な圧力で当てて洗浄するスプレー洗浄工
程と、ホウフッ化水素酸液を端子部面に相当な圧力で当
てるとともに、パフにより端子部面を研磨するパフ研磨
洗浄工程と、さらにホウフッ化水素酸液を端子部面に相
当な圧力で当て洗浄するスプレー洗浄工程とを一連化し
たランイで構成している。As shown in FIG. 1, the plating method for the printed board terminals in one embodiment is to remove the solder from the terminals in the solder stripping process 1, and then apply a borohydrofluoric acid solution as shown in FIG. There is a spray cleaning process in which a considerable amount of pressure is applied to the terminal surface to clean it, a puff polishing cleaning process in which a fluoroboric acid solution is applied to the terminal surface with a considerable pressure and the terminal surface is polished with a puff, and a blow polishing process in which the terminal surface is polished with a puff. It consists of a series of spray cleaning processes in which a hydrohydric acid solution is applied to the terminal surface under considerable pressure to clean it.
第２図（ａｌのスプレー洗浄工程において、５〜１０Ｖ
ＯＩ！％の濃度のホウフッ化水素酸を端子部８の上。Figure 2 (5-10V in the al spray cleaning process)
OI! % concentration of fluoroboric acid on the terminal part 8.
下方向より噴射機９より４ＫＧ／ＣＩＪの圧力を持って
スプレーして端子部面を洗浄し、端子部８面の半田残滓
や汚れを除去する。The sprayer 9 sprays from below with a pressure of 4 KG/CIJ to clean the terminal surface and remove solder residue and dirt from the terminal surface 8.
次に、第２図（ｂｌのパフ研磨工程において、前記濃度
のホウフッ化水素酸を端子部８の」―、下方向より噴射
機９より３ ＫＧ／−の圧力を持ってスプレーするとと
もにパフ１０を回転さゼて端子部面を軟らかく研磨しつ
つ洗浄を行ない、細かい１４月１１残滓や端子部銅面の
凹凸を平滑化する。Next, in the puff polishing process shown in FIG. Rotate the surface of the terminal to soften and polish it while cleaning, smoothing out fine 14/11 residue and unevenness on the copper surface of the terminal.
さらに第２図（Ｃ１に示すように、前記濃度のボウフッ
化水素酸を端子部８の１．下方向より噴射機９より４
ＫＧ／−の圧力を持ってスプレーして端子部面の洗浄を
行ない、半Ｈ１残滓や汚れを完全に除去する。Furthermore, as shown in FIG.
Clean the terminal surface by spraying with a pressure of KG/- to completely remove semi-H1 residue and dirt.
このように、半田剥離後の粗い端子部銅面をスプレー、
パフ研磨スプレー、スプレーのホウフッ化水素酸の洗浄
プロセスを各工程において２〜３分間実施することによ
り、端子部の銅表面を清らかにするとともに、活性化を
行なう。In this way, spray the rough copper surface of the terminal after the solder has been removed.
A puff polishing spray and spray fluoroboric acid cleaning process is carried out for 2 to 3 minutes at each step to clean and activate the copper surface of the terminal.
ホウフッ化水素酸スクラバ工程７において滑らかで活性
化された端子部は、水洗工程３．塩酸洗浄工程４．水洗
工程５を経てニッケル、金めつき工程６においてニッケ
ル、金めっきされる。The smooth and activated terminals in the borofluoric acid scrubber step 7 are removed in the water washing step 3. Hydrochloric acid cleaning step 4. After a water washing step 5, nickel and gold plating is performed in a nickel and gold plating step 6.
以上説明したように本発明によれば、プリント板端子部
のめっき加工工程にホウフッ化水素酸スクラバ工程を設
けたことにより、半田側１１１１ｆｆｌの端子部銅面の
半田残滓や汚れを完全に除去して活性化を行なうととも
に、その表面を滑らかにし、粘着性がよく、且つ光沢の
あるニッケル、金めつきを得ることができる。As explained above, according to the present invention, by providing a borofluoric acid scrubber process in the plating process of the printed board terminal part, solder residue and dirt on the copper surface of the terminal part on the solder side 1111ffl can be completely removed. In addition to activating the material, the surface can be smoothed, and a highly adhesive and shiny nickel or gold plating can be obtained.
第１図は本発明のプリント板端子部のめっき加工方式の
ブロック図、
第２図ｉａｌ〜（ｃｌは一実施例のホウフッ化水素酸ス
クラバ工程の模式図、
第３図は従来のプリント板端子部のめっき加工方式のブ
ロック図である。
図において、１は半田剥離工程、２は研磨工程、３．５
は水洗工程、４は塩酸洗浄工程、６はニッケル、金めつ
き工程、７はホウフッ化水素酸スクラバ工程、８は端子
部、９は噴射機、１０はパフをを示す。
イ象７ｏｑ二り販ｊ安シ了部ｉフ３−〃Ｄ第３図
［うＲｘり）・Ｏ−／７瓜グFigure 1 is a block diagram of the plating process for printed board terminals according to the present invention, Figure 2 is a schematic diagram of the borohydrofluoric acid scrubber process of one embodiment, and Figure 3 is a schematic diagram of a conventional printed board terminal. Fig. 3 is a block diagram of the plating processing method of the part. In the figure, 1 is the solder stripping process, 2 is the polishing process, and 3.5
4 is a water washing process, 4 is a hydrochloric acid cleaning process, 6 is a nickel and gold plating process, 7 is a fluoroboric acid scrubber process, 8 is a terminal, 9 is an injection machine, and 10 is a puff. i elephant 7 oq second sale j cheap part i fu 3-〃DFig.
Claims (1)
て前記端子部に金属めっきを施すに際し、前記半田剥離
後に、前記端子部にホウフッ化水素酸液を噴射して洗浄
するホウフッ化水素酸スクラバ工程（７）を設け、前記
スクラバ工程（７）後に前記端子部（８）に金属めっき
を施すようにしたことを特徴とするプリント板端子部の
めっき加工方法。When peeling off the solder plated on the printed board terminal part (8) and applying metal plating to the terminal part, after the solder is removed, a borofluoric acid solution is sprayed onto the terminal part to clean it. A method for plating a terminal portion of a printed board, characterized in that a scrubber step (7) is provided, and metal plating is applied to the terminal portion (8) after the scrubber step (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2966386A JPH0732303B2 (en) | 1986-02-12 | 1986-02-12 | Printed board terminal processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2966386A JPH0732303B2 (en) | 1986-02-12 | 1986-02-12 | Printed board terminal processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62186590A true JPS62186590A (en) | 1987-08-14 |
| JPH0732303B2 JPH0732303B2 (en) | 1995-04-10 |
Family
ID=12282354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2966386A Expired - Lifetime JPH0732303B2 (en) | 1986-02-12 | 1986-02-12 | Printed board terminal processing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0732303B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5452360A (en) * | 1990-03-02 | 1995-09-19 | Yamaha Corporation | Sound field control device and method for controlling a sound field |
| JP2009200236A (en) * | 2008-02-21 | 2009-09-03 | Daisho Denshi Co Ltd | Board with contact terminal, ic memory card, and manufacturing method of board with contact terminal |
-
1986
- 1986-02-12 JP JP2966386A patent/JPH0732303B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5452360A (en) * | 1990-03-02 | 1995-09-19 | Yamaha Corporation | Sound field control device and method for controlling a sound field |
| JP2009200236A (en) * | 2008-02-21 | 2009-09-03 | Daisho Denshi Co Ltd | Board with contact terminal, ic memory card, and manufacturing method of board with contact terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0732303B2 (en) | 1995-04-10 |
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