JP2009200236A - Board with contact terminal, ic memory card, and manufacturing method of board with contact terminal - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technology capable of inexpensively and easily achieving evenness of gloss of a contact terminal, in a board with contact terminals for an IC memory card. <P>SOLUTION: This manufacturing method of a board with contact terminals is characterized by providing a hard gold-plated terminal 11 by subjecting a surface of hard electric gold plating 15b applied to a contact terminal 14 to a satin finished surface treatment. This board with contact terminals, and this IC memory card equipped with the board with contact terminals are also provided. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a substrate with a contact terminal for an IC memory card, an IC memory card comprising the substrate with a contact terminal, and a method for producing a substrate with a contact terminal comprising a contact terminal.

The IC memory card is a low power consumption type storage medium because it does not require a drive device for writing and reading. In addition, since it is lightweight, thin, and small, it is widely used in portable electronic devices such as digital cameras, portable music players, electronic dictionaries, mobile phones, and portable information terminals. It is also widespread to provide a connector portion for connecting an IC memory card to a device such as a personal computer or a printer.
There are various names of IC memory cards, but all use semiconductor memory as a storage medium. These IC memory cards are provided with a plurality of contact-type terminals for connection with electronic devices (for example, the aforementioned portable electronic devices, personal computers, printers, etc.).
For example, Patent Document 1 discloses an example of a contact terminal of a memory card. The surface of the contact terminal is provided with a gold plating film which is a metal with low contact resistance and little change in contact resistance. An IC memory card is used by being inserted into a connector portion of an electronic device. The memory card is removably inserted into a slot provided in the connector portion. When the memory card is inserted into the slot, the contact terminal of the memory card is brought into contact with the elastic piece terminal provided in the slot. Thereby, electrical conduction between the electronic circuit in the electronic device and the wiring on the IC memory card side is ensured.
In general, the terminal is provided on the IC memory card in an exposed form so as to be in contact with the eyes of the user.
JP 2002-26478 A

As described above, the surface of the contact terminal of the IC memory card is plated with gold. This gold plating is generally applied to the contact terminal surface by bright electrogold plating using a plating bath containing a brightener. Gold plating is one of the factors that have a strong influence on the product quality image. Even if there is no problem in the function as a contact point, a non-uniform appearance is eliminated as a defective product. Since it becomes a defective product after expensive gold plating, the influence on the manufacturing cost is great.
The cause of the non-uniform appearance of the gold plating is that the fine polishing streaks formed by the buffing process on the contact terminal surface before plating affects the surface condition of the gold plating. However, it is not easy to eliminate the influence of abrasive lines. For this reason, an effective measure that can be realized at low cost has been demanded.

  In view of the above-described problems, the present invention provides a substrate with a contact terminal for an IC memory card that can stably ensure the uniformity of the appearance of the terminal surface at low cost, an IC memory card comprising the substrate with a contact terminal, It aims at providing the manufacturing method of the board | substrate with a contact terminal which comprises a contact terminal.

The present invention provides the following means in order to solve the above problems.
1st invention is a board | substrate with a contact terminal for IC memory cards, Comprising: The contact terminal provided in the wiring board is coat | covered with the plating film which makes hard electrogold plating a surface layer, The surface of the said hard electrogold plating is Provided is a substrate with a contact terminal which is characterized by a satin finish.
According to a second aspect of the present invention, the hard electrogold plating surface receives reflected light of incident light irradiated onto the hard electrogold plating surface at an incident angle of 45 degrees with a light receiver, and a reflection angle of 45 ± 25 with respect to the incident light. When the reflected light intensity distribution is analyzed for an angular range of degrees, the total received light amount A in the range of the reflection angle 45 ± 25 degrees and the total received light quantity B in the range of the reflection angle 45 ± 3 degrees are B / A ≦ 0 The substrate with contact terminals according to the first aspect of the present invention is provided with a satin surface satisfying .4.
According to a third aspect of the present invention, the hard electrogold plating having a satin-like surface is obtained by making the surface of a hard electrogold plating film obtained by gloss electroplating into a satin-like state by a jet scrub treatment or a liquid honing treatment. A substrate with a contact terminal according to the first or second invention is provided.
4th invention is that the said plating film is a multilayer plating film which comprises the nickel plating formed in the surface of the said contact terminal, and the said hard electrogold plating formed so that this nickel plating might be covered A substrate with a contact terminal according to any one of the first to third aspects of the invention is provided.
According to a fifth aspect of the present invention, the wiring board includes a reinforcing layer in which a reinforcing material formed in a mesh shape with reinforcing fibers is embedded in a resin on a surface of an insulating resin plate, and the pad-shaped contact terminal includes the pad-shaped contact terminal. Provided is a substrate with a contact terminal according to any one of the first to fourth aspects, wherein the substrate is formed on a reinforcing layer.
A sixth invention provides an IC memory card comprising the substrate with contact terminals of any one of the first to fifth inventions.
7th invention is a manufacturing method of the board | substrate with a contact terminal which comprises the contact terminal coat | covered with the plating film which makes hard electrogold plating a surface layer, Comprising: A hard electrical gold is provided in the contact terminal provided in the wiring board. With a contact terminal, comprising: a plating step for forming a plating film having plating as a surface layer; and a satin finish treatment step in which the surface of the hard electrogold plating is made into a satin finish by jet scrub treatment or liquid honing treatment A method for manufacturing a substrate is provided.
In an eighth aspect of the invention, the plating step includes a nickel plating step in which the contact terminals are electronicked by gloss electroplating using a plating bath containing a brightener, and the electronickel plating obtained in the nickel plating step. A method of manufacturing a substrate with a contact terminal according to a seventh aspect of the present invention, comprising: a hard electrogold plating step of applying the hard electrogold plating by gloss electroplating using a plating bath containing a brightener on the surface. To do.
In a ninth aspect of the present invention, in the matte treatment step, reflected light of incident light irradiated on the surface of the hard electrogold plating at an incident angle of 45 degrees is received by the light receiver on the hard electrogold plating, and the incident light When the reflected light intensity distribution is analyzed with respect to the angle range of 45 ± 25 degrees with respect to the angle, the total received light amount A in the range of the reflection angle 45 ± 25 degrees and the total received light quantity B in the range of the reflection angle 45 ± 3 degrees The present invention provides a method for manufacturing a substrate with a contact terminal according to the seventh or eighth invention, wherein a satin finish surface satisfying B / A ≦ 0.4 is formed.
A tenth aspect of the invention provides the method for manufacturing a substrate with a contact terminal according to any one of the seventh to ninth aspects, wherein the plating step is performed after performing a polishing step of buffing the contact terminal.

  The hard electrogold plating includes a trace amount of one or more selected from cobalt, iron, nickel, and indium as different metals other than gold. The content of the different metal contained in the hard electrogold plating (hard electrogold plating film) is in the range of 0.05% to 1% (% by weight).

In the present invention, the surface of the hard gold plating applied to the contact terminals is subjected to a matte treatment (for example, a jet scrub treatment or a liquid honing treatment) to obtain a hard electrogold plating film having a matte surface.
The hard electrogold plating surface has a high light reflectance before the satin treatment, but the scattering rate of irradiation light is increased by the satin treatment. By the matte finish, a matte finish satin surface with uniform fine irregularities is obtained. As a result, a semi-gloss state is obtained.
By providing the matte finish on the surface of the hard electroplated gold, it is possible to provide a substrate with a contact terminal and an IC memory card having terminals (contact terminals with hard gold plating) with uniform luster on the appearance and gloss unevenness.
In the present specification, “uniform gloss” refers to a state in which little or no gloss unevenness can be confirmed by visual observation from any direction.

ADVANTAGE OF THE INVENTION According to this invention, the board | substrate with a contact terminal and IC memory card which have a terminal (contact terminal with hard gold plating) with uniform appearance gloss can be provided. In production, it is possible to reduce the number of processing of defective products only due to non-uniform gloss of appearance, thereby realizing reduction in manufacturing cost. Terminals with uniform appearance (contact terminals with hard gold plating) contribute effectively to ensuring the quality image of IC memory cards.
In addition, contact terminals (contact terminals with hard gold plating) coated with a plating film with hard electro gold plating as the surface layer are hard to be visually noticeable, so that the terminal surface is protected during product transportation. There is also an advantage that can be simplified.
In addition, according to the present invention, the configuration for making the appearance gloss uniform by the matte surface of the hard electrogold plating can easily realize the gloss uniformity at a low cost. Compared to the case where semi-gloss plating is obtained using a plating bath that is complex and difficult to handle, such as semi-gloss electroplating, if the structure is intended to make the gloss uniform by matte treatment of the hard electrogold plating surface. Thus, uniform gloss can be easily achieved. Moreover, cost reduction can be easily realized. Gloss uniformity can be achieved while reducing labor and cost without requiring any special device or adjustment in the plating process.

  Hereinafter, a method for manufacturing a substrate with contact terminals, an IC memory card, and a substrate with contact terminals according to the present invention will be described with reference to the drawings.

FIG. 1 is a view showing an example of an IC memory card 3 in which a substrate 1 with a contact terminal is incorporated in an exterior case 2, and FIG. 2 is a contact terminal 11 with hard gold plating (hereinafter referred to as a contact terminal 11) provided on the substrate 1 with a contact terminal. FIG. 3A and FIG. 3B are enlarged sectional views showing the structure near the hard gold plating terminal 11, and FIG. 4A. (B) is sectional drawing which shows the structure of the hard plating terminal of another aspect, FIG. 5: is an expanded sectional view which shows the structure of the hard plating terminal 11. FIG.
In this specification, in FIGS. 2 to 5, the upper side is described as the upper side and the lower side is set as the lower side. However, this is simply described as “upper” for the sake of simplicity. ”And“ below ”are defined, and do not limit the direction during production or use when the present invention is carried out.

  As shown in FIGS. 1 and 2, the substrate 1 with a contact terminal is a wiring substrate including a hard gold plating terminal 11 and a wiring 12. In the figure, reference numeral 13 denotes an electrically insulating insulating resin plate, and the hard gold plating terminal 11 and the wiring 12 are provided on the main surface of the insulating resin plate 13.

In the IC memory card 3, the hard gold-plated terminal 11 of the substrate 1 with contact terminal is visible from the outside of the outer case 2 through a window 21 formed in the outer case 2.
The hard gold plating terminal 11 is brought into contact with an elastic piece terminal provided in the slot when the memory card 3 is inserted into the slot of the connector portion of the electronic device. The elastic piece terminal contacts the hard gold plating terminal 11 through the window 21 of the outer case 2. Further, the hard gold plated terminal 11 comes in contact with and separates from the elastic piece terminal by the insertion / extraction operation with respect to the slot of the memory card 3.

  The hard gold-plated terminal 11 of the substrate 1 with a contact terminal includes a wiring 12 on the insulating resin plate 13 and a pad-shaped (land-shaped) contact terminal 14 formed continuously with the wiring 12 (FIG. 3A, ( b) See also, hereinafter, the contact terminals 14 of a wiring board (hereinafter also referred to as a terminal board with a terminal part) having a hard electro-gold plating (in FIGS. 3A and 3B), A plating film (reference numeral 15 in FIGS. 3 (a) and 3 (b)) is formed with the reference numeral 15b) as a surface layer, and the surface of the hard electrogold plating has a satin finish.

The wiring board with terminal portions can be manufactured by applying a well-known manufacturing method applied to the manufacture of a printed wiring board.
In the wiring board with a terminal part, copper is used for the wiring part including the terminal part (contact terminal 14). This wiring part (consisting of the wiring 12 and the contact terminal 14) can be obtained, for example, by pattern etching of a copper foil on the surface layer of a copper clad laminate, or pattern plating of a circuit pattern on an insulating resin plate.

The hard gold plating terminal 11 buffs the surface of the contact terminal 14 of the wiring board with the terminal portion (polishing process), and then the contact terminal 14 is hard electroplated 15b (hereinafter also referred to as a hard electrogold plating film). Is formed as a surface layer (hereinafter also referred to as a plating step), and then the surface of the hard electrogold plating 15b is made into a satin finish by a jet scrub process or a liquid honing process (a satin process. Also called a process).
The details of the plating film 15 and the plating process for forming the plating film 15 will be described later.

The plating process will be described with reference to FIGS. 3 (a), 3 (b) and FIG.
Here, the case where the plating film 15 which makes the surface layer the hard electrogold plating 15b which has the glossy surface (surface before a satin processing) of a high light reflectance in a plating process is demonstrated.
In this plating step, the contact terminals 14 whose surfaces have been polished in the polishing step are subjected to electro nickel plating 15a (nickel plating; hereinafter also referred to as gloss electro nickel plating) by gloss electroplating in a plating bath containing a brightener. (Nickel plating process). Next, the surface of the electro nickel plating 15a is subjected to hard electro gold plating 15b (hereinafter also referred to as luster hard electro gold plating) by gloss electro plating in a plating bath containing a brightener (hard gold plating step).

As the plating bath and brightening agent used in the nickel plating step and the hard gold plating step, known ones used in electroplating (bright electroplating) can be employed. In the nickel plating process, for example, a Watt bath is preferably employed.
By this plating step, a multilayer plating film 15 is formed which includes an electric nickel plating 15a applied to the contact terminal 14 and a hard electric gold plating 15b applied so as to cover the electric nickel plating 15a. Hereinafter, the plating film 15 is also referred to as a multilayer plating film.
In addition, it is preferable that the film thickness of the electro nickel plating 15a is 1 to 25 μm, and the film thickness of the hard electro gold plating is 0.2 to 1.5 μm.

  3A and 3B, a configuration in which the entire surface including the terminal surface 14a (surface opposite to the insulating resin plate 13; upper surface) of the pad-like contact terminal 14 is formed (covered with the plating film 15). The hard gold plating terminal 11 is illustrated. The hard gold plated terminal 11 has a memory card 3 as an electron by a hard electro gold plating 15b covering the terminal surface 14a of the contact terminal 14 (a portion of the hard electro gold plating 15b covering the terminal surface 14a of the contact terminal 14). A flat contact terminal surface 15c is formed, which is brought into contact with an elastic piece terminal provided in the slot when inserted into the slot of the connector portion of the device.

However, in the present invention, as shown in FIGS. 4A and 4B, the plating film 15 is formed only on the terminal surface 14 a (surface opposite to the insulating resin plate 13, upper surface) of the pad-like contact terminal 14. It is also possible to form a hard gold plated terminal 11 (covered with a plating film 15) (indicated by reference numeral 11A for distinction). The plating film 15 is not formed on the outer peripheral end face of the contact terminal 14.
In addition, the structure which formed the plating film 15 only in the terminal surface 14a of the contact terminal 14 is easily obtained by use of a plating resist etc., for example.

As shown in FIGS. 3 (a), 3 (b), 4 (a), and 4 (b), the hard gold plated terminal 11 is formed in an external pad shape and has a flat contact terminal surface 15c. In the IC memory card 3 configured using the hard gold plated terminal 11, the uniformity of the gloss of the contact terminal surface 15c of the hard gold plated terminal 11 has a great influence on the quality image of the user visually.
For this reason, as shown in FIGS. 3A and 3B, even when the plating film 15 covering the entire surface including the end face of the outer periphery of the contact terminal 14 is formed, the contact terminal 14 of the hard electrogold plating 15b is formed. It is important to ensure the uniformity of gloss on the surface (contact terminal surface 15c) of the portion formed so as to be laminated (covering the terminal surface 14a) on the terminal surface 14a. The matte surface treatment for obtaining the matte surface on the hard electrogold plating 15b obtained in the plating step is required to include the contact terminal surface 15c in the region to be treated, and is performed to make the gloss of the contact terminal surface 15c uniform. To do.

  In the satin treatment process, as described above, the jet scrub process or the liquid honing process is adopted. In the jet scrub process and liquid honing process, a liquid in which abrasive grains such as aluminum oxide and silicon carbide are dispersed in water is sprayed onto the surface of the object to be processed to clean the foreign matter adhering to the surface of the object to be processed and the object to be processed This is a method of giving a fine uneven surface to the surface.

  If it is a jet scrub process and a liquid honing process, the uniform satin process of the whole surface (specifically contact terminal surface 15c) of the hard electrogold plating 15b is easily realizable. That is, since extremely fine irregularities are formed on the surface of the hard electrogold plating 15b by the collision of abrasive grains with the surface of the hard electrogold plating 15b, the outer peripheral portion of the contact terminal surface 15c is the same as the inner portion of the outer peripheral portion. Can be performed (formation of irregularities).

  For example, polishing streaks having directionality in one direction are generated in the buffol polishing, but unevenness without directionality can be formed in the jet scrub process and the liquid honing process. Moreover, in the case of buffling, it is inevitable that the contact pressure of the bafrol is higher in the outer peripheral portion of the contact terminal surface 15c than in the central portion of the contact terminal surface 15c. It is difficult to realize. On the other hand, in the case of the jet scrub process and the liquid honing process, the same processing (formation of irregularities) as the inner portion of the outer peripheral portion can be performed on the outer peripheral portion of the contact terminal surface 15c. The entire satin finish can be easily realized.

By this matte treatment process, the matte surface of the hard electrogold plating 15b on the surface layer of the hard gold plating terminal 11 is obtained.
Jet scrub and liquid honing can be processed while the substrate 1 with contact terminals is stationary, but a method of processing while conveying the substrate 1 with contact terminals is preferable because of high productivity.

Next, the light reflection characteristics (hereinafter also simply referred to as reflection characteristics) of the surface of the hard gold plating terminal 11 (specifically, the contact terminal surface 15c) will be described.
FIG. 6 shows an apparatus for measuring reflection characteristics (reflection characteristic measuring apparatus 4).
In FIG. 6, reference numeral 41 denotes a light irradiator, 42 denotes a light receiver, and 43 denotes a support base.
The support base 43 is provided with a holder (not shown) for detachably holding a specimen (here, the substrate 1 with connection terminals).

FIG. 6 shows a state in which the substrate 1 with connection terminals is set on the support base 43.
However, the reflection characteristic measuring apparatus 4 is configured such that, for example, a contact board surface of a glossy hard gold-plated terminal is set on the support base 43 by setting a wiring board having a glossy hard gold-plated terminal of Comparative Examples 1 and 2 described later. It can also be used to measure the reflection characteristics.

  The reflection characteristic measurement for examining the reflection characteristic of the surface of the hard gold plating terminal 11 (the surface of the hard electric gold plating 15b) using the reflection characteristic measuring device 4 is performed from the light irradiator 41 to the contact terminal surface 15c (specifically, the contact terminal surface 15c). The terminal surface 15c) is irradiated with incident light 44 having an incident angle of 45 degrees, the reflected light 45 reflected by the surface of the hard electroplated gold 15b is received by the light receiver 42, and the reflected light intensity distribution is analyzed.

The incident angle of the incident light 44 with respect to the contact terminal surface 15c is fixed at 45 degrees. Incident light 44 is output in the form of a thin beam from the light irradiator 41 and irradiated onto the surface of the hard electrogold plating 15b.
In FIG. 6, reference numeral 46 denotes an irradiation point of the incident light 44 on the surface of the hard electric gold plating 15b. Specifically, the intersection of the optical axis of the incident light 44 and the surface of the hard electric gold plating 15b (contact terminal surface 15c). It is.
In the figure, reference numeral 47 is a virtual vertical line passing through the irradiation point 46 and perpendicular to the contact terminal surface 15c. The incident light 44 having an incident angle of 45 degrees has an inclination angle α (incident angle) with respect to the virtual vertical line 47 of 45 degrees.
The light receiver 42 is moved on the circumference around the irradiation point 46 by a moving device (not shown). The circumference along which the light receiver 42 moves is in a virtual plane that overlaps the virtual vertical line 47 and the optical axis of the incident light 44.

  In the reflection characteristic measurement of the surface of the hard electroplating 15b of the substrate 1 with a contact terminal 1 using the reflection characteristic measuring device 4 described above, the incident light 44 is irradiated to the contact terminal surface 15c at an incident angle of 45 degrees, By moving on the circumference centered on the irradiation point 46, the received light data (reflected light intensity, received light intensity) is obtained in increments of 1 degree with respect to the virtual vertical line 47, and the reflection angle is within a range of 45 ± 25 degrees. Analyze the reflected light intensity distribution.

Here, the reflection angle refers to an angle with respect to the virtual vertical line 47 on the side opposite to the incident light 44 through the virtual vertical line 47 (an angle with respect to the virtual vertical line 47 with the irradiation point 46 as the center). Specifically, the angle is an angle with respect to the virtual vertical line 47 in the virtual plane overlapping the virtual vertical line 47 and the optical axis of the incident light 44. The reflection angle is set to 0 degree with respect to the irradiation point 46 and overlapping with the virtual vertical line 47, and from the side opposite to the incident light 44 via the virtual vertical line 47, that is, from the virtual vertical line 47 in FIG. Say right angle. In FIG. 6, the angle γ indicates a reflection angle of 45 degrees. Further, in FIG. 6, the reflection angle 90 degrees is on the right side of the virtual vertical line 47 of the virtual surface 15S passing through the irradiation point 46 and perpendicular to the virtual vertical line 47.
In other words, the reflection angle is 45 degrees, that is, the inclination angle with respect to the incident light 44 (specifically, its optical axis) with an incident angle of 45 degrees is 90 degrees (an angle centered on the irradiation point 46), and the reflection angle is 45 ± 25 degrees. In other words, the angle range means an angle range of 90 ± 25 degrees with respect to the incident light 44 (an angle range around the irradiation point 46).

In the reflection characteristic measurement, the reflected light distribution in the range of the reflection angle 45 ± 25 degrees is analyzed from the received light data in the range of the reflection angle 45 ± 25 degrees acquired by the light receiver.
In the reflection characteristic measurement using the reflection characteristic measurement device 4 described above, the reflected light 45 reflected by the contact terminal surface 15c is received by the light receiver 42 that moves on the circumference centered on the irradiation point 46. The reflected light intensity distribution is analyzed for the angle range of 45 ± 25 degrees with respect to the virtual vertical line 47 from the received light reception data. Acquisition of light reception data by the light receiver 42 is performed for an angle range including a reflection angle of 45 ± 25 degrees.

The matte-treated contact terminal surface 15c of the hard gold-plated terminal 11 of the substrate 1 with a contact terminal according to the present invention is reflected when the above-mentioned variable reflection characteristic measurement (hereinafter also referred to as variable reflection characteristic measurement) is performed. The total surface received light amount A in the angle range of 45 ± 25 degrees and the total light received amount B in the angle range of the reflection angle 45 ± 3 degrees are the satin surface satisfying B / A ≦ 0.4.
Note that the total received light amounts A and B are total values of the received light amounts acquired by the light receiver 42 in such an angle range, for example, by the light receiver 42 moved on the circumference around the irradiation point 46. When the received light data is acquired in 1 degree increments, the total received light amount A is the total value of the acquired data in 1 degree increments in the angle range of the reflection angle 45 ± 25 degrees, and the total received light amount B is the reflection angle 45 ±. It is the total value of the acquired data in increments of 1 degree by the light receiver 42 in the angle range of 3 degrees.

The acquisition of the received light data by moving the light receiver 42 on the circumference around the irradiation point 46 is not limited to 1 degree, for example, 0.5 degree, 0.2 degree, etc. May be.
The analysis of the reflected light intensity distribution in the angle range of 45 ± 25 degrees with respect to the virtual vertical line 47 (90 ± 25 degrees with respect to the incident light 44) (however, the angle range in the virtual plane) It is not limited to the acquisition of the light reception data by the light receiver 42 that moves on the circumference centering on 46. For example, a part or all of the received light data in the angle range of the reflection angle of 45 ± 25 degrees may be obtained by a light receiver installed at a fixed position with respect to the light irradiator 41 or the virtual vertical line 47.

  If B / A is 0.4 or less (B / A ≦ 0.4), gloss unevenness caused by polishing streaks formed on the surface of the contact terminal 14 by buffing in the polishing step is made inconspicuous by light scattering. The effect is sufficiently obtained, and it contributes effectively to securing the quality image by making the gloss uniform.

  In the case of jet scrubbing or liquid honing, for example, it is formed on the surface of the hard gold plating 15b by selecting the grain size of the abrasive grains, adjusting the supply amount of the abrasive grains, adjusting the collision speed against the surface of the hard electrogold plating 15b, etc. The size and density of the unevenness to be adjusted can be easily adjusted. For this reason, the satin finish surface of the hard electrogold plating 15b having a reflection characteristic of B / A ≦ 0.4 can be easily obtained.

The structure in which the surface of the hard electroplating 15b of the hard gold plating terminal 11 is a matte surface obtained by performing a matte process such as a jet scrub process or a liquid honing process is effective for uniforming the gloss of the appearance of the contact terminal surface 15c. Contribute.
For example, after the gold plating is applied to the contact terminal, when the matte treatment is not performed (the above-described conventional technology), the fine polishing streaks formed on the contact terminal by the buff polishing process before plating covers the contact terminal. The surface of the gold plating formed in this manner is affected, and this causes uneven gloss on the gold plating surface.

  On the other hand, in the present invention, the surface having high light reflectance of the hard electrogold plating 15b (glossy hard electrogold plating) applied to the contact terminal 14 in the hard gold plating process is satin-finished to increase the light scattering rate. In other words, a semi-glossy state is assumed. The matte surface has a matte finish with uniform fine irregularities. For this reason, the unevenness of gloss caused by the polishing streaks formed on the surface of the contact terminal 14 (specifically, the terminal surface 14a) in the polishing process is made inconspicuous by scattering of the irradiation light, or it is difficult to visually check. Can be resolved. As a result, the gloss of the contact terminal surface 15c can be made uniform.

In the polishing step, the surface of the terminal portion is polished to ensure adhesion between the terminal portion (contact terminal 14; the same applies to the following) of the wiring board with terminal portion and the plating film 15 and to remove contaminants on the surface of the terminal portion. Apply. For this polishing, a polishing apparatus having a disk-shaped buff or a roll-type buff (buffol) is used. Therefore, polishing streaks are formed on the surface of the terminal portion along the buff rotation direction of the polishing apparatus.
Even if nickel plating (electro nickel plating) is applied to the surface of the terminal portion on which the polishing streaks are formed, and then hard electro gold plating is performed, a case in which the polishing streaks remain on the hard electro gold plating surface is likely to occur. When the polishing streaks remain on the hard electroplating surface, the gloss of the hard electrogold plating surface before the matte finish becomes different between the polishing streak direction and the direction perpendicular to the polishing streak, and the gloss is not uniform.

However, in the present invention, the matte treatment performed on the surface of the hard electrogold plating 15b (glossy hard electrogold plating) applied to the contact terminal 14 in the hard gold plating step is uneven with no directionality by jet scrub treatment or liquid honing treatment. It is possible to form, and by performing this matte treatment, it is possible to almost eliminate the influence of polishing streaks existing in the hard electrogold plating before the matte treatment. Therefore, as a result of the satin treatment, it is possible to make the uneven gloss caused by the polishing streak inconspicuous or to the extent that visual confirmation is difficult regardless of the direction of the polishing streak.
As a result, the gloss unevenness that can be easily visually recognized can be eliminated in both the polishing streak direction and the direction perpendicular to the polishing streak, and the surface gloss of the hard electrogold plating 15b can be made uniform.

Interposing the bright nickel electroplating 15a between the contact terminal 14 and the hard electrogold plating 15b means that the surface of the hard electrogold plating 15b (gloss hard electrogold plating) applied to the contact terminal 14 in the hard gold plating process. It effectively contributes to securing the gloss and light reflectance of the (surface before the satin treatment).
Further, the electro nickel plating 15a functions to enhance the adhesion of the hard electro gold plating film 15b to the contact terminal 14 and make it difficult to peel off.

  The bright electronickel plating 15a generally provides a hard plating film by the action of a brightener. For this reason, when the hard electrogold plating film 15b obtained in the hard gold plating process is subjected to a matte treatment such as a jet scrub process or a liquid honing process, the hard electrogold plating film 15b is unnecessarily large and unexpectedly deformed. Inconvenience such as end can be prevented. As a result, it becomes possible to accurately adjust the reflection characteristics of the surface of the hard electroplated gold film 15b by setting the processing conditions of the matte treatment such as the abrasive grain supply amount, and the satin having a reflection characteristic of B / A ≦ 0.4. Surface formation can be easily obtained.

Since the hard nickel plating 15a (bright electric nickel plating) effectively contributes to preventing deformation of the hard electric gold plating 15b, for example, the elastic piece terminal of the connector portion of the electronic device is in elastic contact with the hard gold plating terminal 11. It is also possible to obtain the effect of suppressing the generation of contact marks due to
As described above, the hard electrogold plating 15b on the surface layer of the hard gold plating terminal 11 includes a different metal such as cobalt, iron, nickel, and indium in the range of 0.05% to 1% (weight%). Compared with so-called pure gold plating (electrogold plating with a gold purity of 99.9% or more, but not including the above-mentioned dissimilar metals), it has a much higher hardness. The hard gold-plated terminal 11 has the surface layer of the hard electro-gold plating 15b, and in addition to the deformation of the hard electro-gold plating 15b by adopting the multilayer plating film 15 provided with the hard electro-nickel plating 15a (nickel plating). Scratches are less likely to occur and long-term aesthetic maintenance is possible.

  For example, if the surface of the hard electrogold plating 15b (specifically, the contact terminal surface 15c) is made uniform by the matte treatment of the surface of the hard electrogold plating 15b formed by electroplating, for example, the contact terminals are half-finished. Compared with the case where the bright electroplating is performed (particularly, when the semi-gloss electroplating is applied as the surface layer of the plating film formed on the contact terminal), it is possible to easily realize the uniform gloss on the surface of the plating film at a low cost.

Semi-bright electroplating requires a plating bath that is more complex than bright electroplating. Adjustment of plating conditions such as current density is also complicated and requires more labor and cost than bright electroplating.
On the other hand, the plating film 15 formed on the contact terminal 14 has a structure in which the gloss of the surface of the hard gold plating terminal 11 is made uniform by the matte treatment of the surface of the hard electroplating 15b applied to the contact terminal 14. Configuration constraints are small. Even when the plating film 15 obtained by gloss electroplating is employed as in the multilayer plating film 15 described above, the surface of the hard gold plating terminal 11 can be made uniform in gloss.

For example, a watt bath for bright electro-nickel plating is generally obtained by adding a brightener to a watt bath for ordinary electro-nickel plating. Adjustment of plating conditions such as current density is not complicated.
Generally, brighteners for bright electroplating are designed so that even when added to a plating bath for normal electroplating, the plating conditions such as current density other than the plating bath configuration are not greatly affected. However, in semi-gloss electroplating, since it is difficult to adjust the brightener and the plating bath also requires a special configuration, it is general that a plating bath for normal electroplating cannot be used.
For this reason, if it is the structure which makes uniform the glossiness of the contact terminal surface 15c by the matte treatment of the surface of hard electroplating 15b, compared with the case where semi-gloss electroplating is performed, the glossiness of the contact terminal surface 15c is made uniform. Can be easily realized at low cost.

Next, using Example 1 and Comparative Examples 1 and 2, the reflection characteristics before and after the matte treatment on the surface of the hard electrogold plating 15b are compared, and the effect of uniforming the gloss by the satin treatment is verified.
First, Comparative Examples 1 and 2 will be described, and then Example 1 will be described.

(Comparative Example 1)
A copper-clad laminate (trade name: E-67) having a resin layer thickness of 0.2 mm and a copper foil thickness of 18 μm manufactured by Hitachi Chemical Co., Ltd. was prepared. A through hole was machined at a desired location using an NC drilling machine, and electrolytic copper plating with a thickness of 15 μm was performed. Next, the surface of the electrolytic copper plating was buffed and acid-washed, then a dry film type etching resist was laminated, the various patterns were exposed to ultraviolet light, and further developed to form an etching resist pattern. Next, a copper wiring pattern was formed by contacting with an iron chloride-hydrochloric acid-based copper etching solution to dissolve and remove the copper foil not covered with the etching resist. Thereby, the wiring board with a terminal part which comprises a wiring and the pad-shaped contact terminal continuous with this wiring was obtained.

Next, a solder resist film was formed. However, the solder resist film was formed so as to avoid the contact terminal and not cover the terminal surface 14a of the contact terminal.
Next, the surface of the contact terminal not covered with the solder resist was buffed, and then the contact terminal was subjected to electronickel plating with a thickness of 5 μm, followed by hard electrogold plating with a thickness of 0.5 μm. However, for the electro nickel plating and the hard electro gold plating, the gloss electro nickel plating and the gloss hard electro gold plating were performed by adopting a gloss electroplating method using a plating bath containing a brightener (organic compound brightener). Hereinafter, the obtained terminal with plating will be referred to as a glossy hard gold plating terminal. This glossy hard gold plating terminal has a glossy surface by glossy hard electrogold plating on the surface layer. Moreover, this luster hard gold plating terminal is the appearance pad shape which has a flat contact terminal surface.

The wiring board provided with the glossy hard gold-plated terminal was set in a reflection characteristic measuring apparatus, and the above-mentioned variable reflection characteristic measurement was performed on the contact terminal surface of the glossy hard gold-plated terminal. As a measuring device (reflection characteristic measuring device), a 3D variable angle photometer GP-200 manufactured by Murakami Color Research Laboratory Co., Ltd. was used. As the light source, a laser light source having a small irradiation area of φ0.9 mm (a diameter of a laser beam as incident light) was used. The incident angle is fixed at 45 degrees (angle α in FIG. 6), and the amount of light received (the received light intensity, in other words, the reflected light intensity) in the angle range of the reflection angle 45 ± 25 degrees is measured by the light receiver 42 in increments of 1 degree. did. Incident light was irradiated by selecting a portion of uneven glossiness on the contact terminal surface of the glossy hard gold plated terminal.
This measurement was performed for the polishing direction (direction along the polishing streak) of the terminal surface 14a of the contact terminal (for example, see FIGS. 3A and 3B) and the direction perpendicular to the polishing direction. The measurement of the polishing direction is performed by measuring the incident light in a direction that is perpendicular to the terminal surface 14a and parallel to the virtual vertical plane along the polishing line (virtual vertical line 47 (see FIG. 6)) and the virtual plane that overlaps the optical axis of the incident light 44. The terminal surface 14a is irradiated with the orientation aligned with the polishing streaks to measure the variable reflection characteristics. Measurement in a direction perpendicular to the polishing direction is performed by irradiating the terminal surface 14a with incident light so that a virtual plane 47 (see FIG. 6) and a virtual plane overlapping the optical axis of the incident light 44 are perpendicular to the polishing streak. A variable reflection characteristic is measured.

From the measured data, the ratio B / A of the total received light amount A in the angle range with a reflection angle of 45 ± 25 degrees in the total received light amount A in the angle range with a reflection angle of 45 ± 25 degrees was obtained. 7 and 8 show the reflected light intensity distribution in the angle range of the reflection angle of 45 ± 25 degrees. FIG. 7 shows the measurement result in the polishing direction, and FIG. 8 shows the measurement result in the direction perpendicular to the polishing direction.
The angle range of the reflection angle 45 ± 25 degrees is an inclination angle (hereinafter also referred to as a light receiving angle) with respect to the reference surface when the contact terminal surface of the glossy hard gold-plated terminal is used as a reference surface (see the virtual surface 15S in FIG. 6). ) Is an angle range of 20 to 70 degrees. 7 and 8, the horizontal axis represents the angle of the light receiving angle, and the vertical axis represents the reflected light intensity.
9 to 11, the horizontal axis represents the angle of the light receiving angle, and the vertical axis represents the reflected light intensity.

  In addition, Table 1 shows the measurement results of the variable angle reflection characteristic measurement and the visual confirmation results of the gloss of the glossy hard gold plated terminal. In Table 1, the measurement results of the variable reflection characteristics of the contact terminal surfaces of the terminals of Comparative Example 2 and Example 1 which will be described later, and the visual confirmation result of the gloss are also described.

  As is apparent from Table 1, FIG. 7 and FIG. 8, in Comparative Example 1, the ratio of the total received light amount B in the angle range of the light receiving angle of 20 to 70 degrees to the total received light amount A in the angle range of the received light angle of 20 to 70 degrees. B / A was high, and it was confirmed that the surface was glossy. In both the polishing direction and the direction perpendicular to the polishing direction, a reflected light intensity distribution having a peak near 45 ° (see angle γ in FIG. 6) is obtained. However, the measurement result in the direction perpendicular to the polishing direction has a considerably larger B / A value than the measurement result in the polishing direction, and the measurement result in the direction perpendicular to the polishing direction and the measurement result in the direction perpendicular to the polishing direction. There was a large difference in reflection characteristics. Also, the reflection characteristics did not satisfy B / A ≦ 0.4 in both the polishing direction and the direction perpendicular to the polishing direction.

(Comparative Example 2)
For the surface of the gloss-plated terminal (contact terminal surface) produced in Comparative Example 1, a portion of uneven gloss (a portion of uneven gloss. A portion where the intensity of light reflection looks different depending on the viewing direction) and a portion other than the uneven gloss portion A part (a part where gloss unevenness was not visually recognized; hereinafter, a normal part) was selected, and the reflection characteristics were measured by the same method as in Comparative Example 1. For the uneven gloss portion and the normal portion, the difference (ΔH) between the reflected light intensity in the direction perpendicular to the polishing direction and the reflected light intensity in the polishing direction was calculated. FIG. 9 shows a distribution of this reflected light intensity difference (ΔH) in an angle range of a light receiving angle of 20 to 70 degrees. In the gloss unevenness portion and the normal portion, both of the measurement result in the polishing direction and the measurement result in the direction perpendicular to the polishing direction, one has a reflected light intensity value over the entire angle range with a light receiving angle of 20 to 70 degrees than the other. It was getting bigger.
As is clear from Table 1 and FIG. 9, the location of gloss unevenness (“gloss unevenness” graph in FIG. 9) has a significantly larger reflected light intensity difference (ΔH) than the normal portion, and the normal portion. A large difference was observed in the reflection characteristics as compared with. It was found that the difference in reflection characteristics at the surface of the glossy hard gold plated terminal surface was the cause of uneven glossiness of the appearance.
In the measurement data of the gloss unevenness portion and the normal part, the above-described B / A is larger than 0.4 and satisfies B / A ≦ 0.4 in both the polishing direction and the direction perpendicular to the polishing direction. There wasn't.

Example 1
The surface of the glossy hard gold-plated terminal including the same gloss unevenness as in Comparative Example 2 was subjected to jet scrub treatment to obtain a hard gold-plated terminal having a satin surface. A jet scrub apparatus manufactured by Ishii Notation Co., Ltd. was used. As the abrasive grains, trade name Sac Random # 220 having a particle size range of 104 μm to 50 μm was used. The treatment was performed under conditions of a spray pressure of 0.2 MPa and a conveyance speed of 2.5 m / min.
The reflection characteristics were measured under the same conditions as in Comparative Example 1. The graphs of the obtained reflected light intensity distribution are shown in FIGS. FIG. 10 shows the measurement result in the polishing direction, and FIG. 11 shows the measurement result in the direction perpendicular to the polishing direction.

It was confirmed that reflection characteristics satisfying B / A ≦ 0.4 were obtained in both the polishing direction and the direction perpendicular to the polishing direction.
Further, from the results of Table 1, FIG. 10, and FIG. 11, by performing the jet scrub process, the reflected light intensity in the angle range of the light receiving angle of 45 degrees ± 3 degrees is relatively lowered as compared with Comparative Examples 1 and 2. It was found that the reflected light intensity at other angles was relatively increased. There was almost no difference in reflection characteristics between the portion where uneven gloss was visually observed before the jet scrub treatment and the other portions. In both the polishing direction and the direction perpendicular to the polishing direction, the gloss unevenness on the contact terminal surface was almost unnoticeable by visual observation, and the gloss of the appearance was uniform from any direction.

  As described above, according to the present invention, the contact terminal surface of the hard gold-plated terminal is made into a satin surface having a reflection characteristic satisfying B / A ≦ 0.4 by the satin treatment, so that the gloss of the contact terminal surface is obtained. Can be made uniform. As a result, a high quality image can be secured.

12 includes a reinforcing layer 53 in which a reinforcing material 52 formed in a mesh shape with reinforcing fibers 51 is embedded in a resin on the surface of the insulating resin plate 13, and the pad-like contact is formed on the reinforcing layer 53. The board | substrate with a contact terminal of the structure in which the terminal 14 and the hard gold plating terminal 11 are formed is shown. The reinforcing layer 53 prevents local deformation of the substrate and the hard gold plating terminal 11 due to repeated insertion and extraction, and is provided at the position where the contact terminal 14 is formed on the surface of the insulating resin plate 13. It is not necessary to provide the wiring 12 at the position where it is formed.
In this case, the presence of the reinforcing fiber 51 of the reinforcing layer 53 affects the surface state of the hard electrogold plating 15b applied to the contact terminal 14 before the matte treatment, and corresponds to the reinforcing fiber 51 on the contact terminal surface 15c. There are cases where streaky uneven gloss is observed. However, in the present invention, the gloss of the contact terminal surface 15c can be made uniform by the satin treatment on the surface of the hard electrogold plating 15b. For this reason, even if the reinforcing layer 53 is provided, the aesthetic appearance of the contact terminal surface 15c can be easily ensured.

The hard gold-plated terminal is not necessarily limited to one having a flat contact terminal surface, for example, as shown in FIG. 13 (a), a hard gold-plated terminal 11 (indicated by reference numeral 11B in the figure). A contact terminal surface having a curved surface can also be used.
For example, when the plating film 15 is formed on the terminal portion 14 of the wiring board with the terminal portion by a semi-additive method, depending on the plating conditions, the terminal portion 14 is formed near the pattern plating resist 16 formed around the terminal portion 14. The tendency for plating to be less likely to deposit compared to the central portion of the terminal surface 14a becomes prominent, and the plating film 15 having the convex contact terminal surface 15c is formed on the terminal surface 14a of the terminal portion 14. When the terminal surface 14a of the terminal portion 14 is rectangular, the plating film 15 is formed on the terminal surface 14a in a substantially halved columnar shape (so-called bowl shape). In this case, the jet scrub process or the liquid honing process for the contact terminal surface 15c is performed by, for example, tilting the wiring board with terminal portions and changing the irradiation angle of the liquid in which abrasive grains are dispersed in water with respect to the contact terminal surface. It is possible to achieve a satin finish on the entire contact terminal surface.

As shown in FIG. 13B, the above-described hard gold plating terminal 11B can also perform reflection characteristic measurement using the reflection characteristic measuring device 4 illustrated in FIG.
An irradiation point 46 for irradiating incident light 44 is set on the contact terminal surface 15c, and the incident light 44 has an inclination angle (incident angle) of 45 degrees with respect to a virtual vertical line 47 perpendicular to the contact terminal surface 15c at the irradiation point 46. Is applied to the contact terminal surface 15c. Incident light 44 has its optical axis aligned with irradiation point 46. The reflected light reflected by the contact terminal surface 15c of the incident light 44 is received by the light receiver 42, and the reflected light intensity distribution in the angle range of the reflection angle 45 ± 25 degrees is analyzed.

The present invention is not limited to the above embodiment, and can be modified as appropriate.
When the required level of gloss on the surface of the hard gold plating terminal 11 is low and the luster may be poor, it is not necessary to use the glossy hard electroplating as the hard electrogold plating, and the plating bath does not contain a brightener. It is also possible to employ hard electrogold plating obtained by electroplating. Even in this case, the matte treatment of the surface of the hard electroplated gold can suppress or prevent the polishing streaks formed by buffing the contact terminals 14 and the reinforcing fibers described above from affecting the surface state and aesthetics of the contact terminal surface. Needless to say, it contributes to
Further, in the present invention, it is possible to easily realize the aesthetic appearance of the hard gold plated terminal by the surface of the hard electro gold plating, so that the surface of the contact terminal is polished before forming the plating film having the hard electro gold plating as a surface layer. There is an advantage that accuracy control can be relaxed and the polishing time can be shortened. Further, when a clean surface is secured on the contact terminal, the polishing step can be omitted.

1 is a diagram showing an IC memory card according to an embodiment of the present invention. It is the perspective view which expanded and showed the hard gold plating terminal vicinity provided in the board | substrate with a contact terminal of one Embodiment which concerns on this invention. It is sectional drawing which expanded and showed the structure of the hard gold plating terminal vicinity of the board | substrate with a contact terminal of FIG. 2, (a) is the sectional view on the AA line of FIG. 2, (b) is B of FIG. FIG. (A), (b) is sectional drawing which shows the structure of the hard gold plating terminal of another aspect. It is an expanded sectional view showing the structure of a hard gold plating terminal. It is a figure which shows the structure of a reflection characteristic measuring apparatus. It is a graph which shows the measurement result of the light reflection characteristic in the grinding | polishing direction of the contact terminal surface of the glossy hard gold plating terminal of the comparative example 1. It is a graph which shows the measurement result of the light reflection characteristic in the direction orthogonal to the grinding | polishing direction of the contact terminal surface of the glossy hard gold plating terminal of the comparative example 1. It is a graph which shows the measurement result of the light reflection characteristic of the comparative example 2, and shows the result of measuring the light reflection characteristic in the direction perpendicular to the polishing direction of the contact terminal surface for the gloss uneven portion and the normal portion of the glossy hard gold plated terminal. . It is a graph which shows the measurement result of the light reflection characteristic in the grinding | polishing direction of the contact terminal surface of the glossy hard gold plating terminal of Example 1. FIG. It is a graph which shows the measurement result of the light reflection characteristic in the direction orthogonal to the grinding | polishing direction of the contact terminal surface of the glossy hard gold plating terminal of Example 1. FIG. It is sectional drawing which shows the example of the board | substrate with a contact terminal which comprises the reinforcement layer by which the mesh-shaped reinforcement which consists of a reinforcement fiber is embed | buried in resin. (A) is a figure which shows the example of the hard gold plating terminal which has a contact terminal surface of a curved surface (convex curved surface), and a board | substrate with a contact terminal which comprises this hard gold plating terminal, (b) is the hard of FIG. 13 (a). It is a figure explaining the reflective characteristic characteristic of a gold plating terminal. Form

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Board | substrate with a contact terminal, 11 ... Hard gold plating terminal, 12 ... Wiring, 13 ... Insulating resin board, 14 ... Contact terminal, 14a ... Terminal surface, 15 ... Plating film, 15a ... Nickel plating, electro nickel plating (gloss electric) Nickel plating), 15b ... hard gold plating (bright hard electro gold plating), 15c ... contact terminal surface, 16 ... pattern plating resist, 2 ... exterior case, 21 ... window, 3 ... IC memory card, 4 ... reflection characteristic measuring device , 42 ... light receiver, 51 ... reinforcing fiber, 52 ... reinforcing material, 53 ... reinforcing layer.

Claims (10)

A substrate with contact terminals for an IC memory card,
A substrate with a contact terminal, wherein a contact terminal provided on a wiring board is coated with a plating film having a hard electrogold plating as a surface layer, and the surface of the hard electrogold plating has a satin finish.   The hard electrogold plating surface receives reflected light of incident light irradiated on the hard electrogold plating surface at an incident angle of 45 degrees with a light receiver, and reflects the reflected light with respect to an angle range of 45 ± 25 degrees with respect to the incident light. When analyzing the light intensity distribution, the satin surface where the total received light amount A in the range of the reflection angle 45 ± 25 degrees and the total received light quantity B in the range of the reflection angle 45 ± 3 degrees satisfy B / A ≦ 0.4 The substrate with contact terminals according to claim 1, wherein:   The hard electrogold plating having a matte surface is characterized in that the surface of a hard electrogold plating film obtained by gloss electroplating is made into a satin state by jet scrubbing or liquid honing. The substrate with a contact terminal according to 1 or 2.   2. The multilayer plating film according to claim 1, wherein the plating film includes a nickel plating formed on a surface of the contact terminal and the hard electric gold plating formed so as to cover the nickel plating. The board | substrate with a contact terminal in any one of -3.   The wiring board includes a reinforcing layer in which a reinforcing material formed in a mesh shape with reinforcing fibers is embedded in a resin on the surface of an insulating resin plate, and the pad-shaped contact terminals are formed on the reinforcing layer. The board | substrate with a contact terminal in any one of Claims 1-4 characterized by the above-mentioned.   An IC memory card comprising the substrate with contact terminals according to claim 1. A method of manufacturing a substrate with a contact terminal comprising a contact terminal coated with a plating film having a hard electrogold plating as a surface layer,
A plating step for forming a plating film having hard electrogold plating as a surface layer on a contact terminal provided on the wiring board, and a satin finish in which the surface of the hard electrogold plating is subjected to a jet scrub treatment or a liquid honing treatment. A process for producing a substrate with contact terminals, comprising: a treatment step.   In the plating step, a brightening agent is applied to the surface of the nickel electroplating obtained in the nickel plating step, and a nickel plating step of applying electronickel plating to the contact terminals by bright electroplating using a plating bath containing a brightening agent. A method for producing a substrate with a contact terminal according to claim 7, further comprising: a hard gold plating step in which the hard electrogold plating is performed by gloss electroplating using a plating bath.   In the matte treatment step, reflected light of incident light irradiated onto the surface of the hard electrogold plating at an incident angle of 45 degrees is received by a light receiver in the hard electrogold plating, and a reflection angle of 45 ± 25 with respect to the incident light is received. When the reflected light intensity distribution is analyzed for an angular range of degrees, the total received light amount A in the range of the reflection angle 45 ± 25 degrees and the total received light quantity B in the range of the reflection angle 45 ± 3 degrees are B / A ≦ 0 9. A method for producing a substrate with a contact terminal according to claim 7, wherein a satin surface satisfying .4 is formed.   The method for manufacturing a substrate with contact terminals according to claim 7, wherein the plating step is performed after performing a polishing step of buffing the contact terminals.

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