JPS62183548A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS62183548A
JPS62183548A JP2628986A JP2628986A JPS62183548A JP S62183548 A JPS62183548 A JP S62183548A JP 2628986 A JP2628986 A JP 2628986A JP 2628986 A JP2628986 A JP 2628986A JP S62183548 A JPS62183548 A JP S62183548A
Authority
JP
Japan
Prior art keywords
lead
island
moisture
semiconductor device
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2628986A
Other languages
Japanese (ja)
Inventor
Shigeji Tonishi
遠西　繁治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2628986A priority Critical patent/JPS62183548A/en
Publication of JPS62183548A publication Critical patent/JPS62183548A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To prevent water from intruding into the interior of a semiconductor device and to protect a semiconductor element against moisture by a method wherein the part coated with sealing resin used for a lead and a suspension lead is formed into a netlike state having innumerable holes. CONSTITUTION:After a semiconductor element has been attached to an island 1, the inside part of an enclosure shown by a dotted line in the diagram is coated with sealing resin, and the part located on the inner end side of the lead 3 on the circumference of the island and inside the enclosure 6 of a suspension lead 2 is formed into netlike parts 2a and 3a having innumerable holes. As a result, the moisture intruding into the internal part along said lead and suspension lead can be blocked, and the semiconductor integrated circuit element can be protected against the trouble arising from moisture.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、リードフレームを用いて半導体素子へリード
付けを行い、樹脂封止した半導体装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device in which leads are attached to a semiconductor element using a lead frame and the semiconductor element is sealed with resin.

〔従来の技術〕[Conventional technology]

半導体素子のリード付は組立に用いられる従来のリード
フレームを第２図の平面図に示す。図において、１は半
導体素子が取付けられるアイランドで、吊りリード２に
よシ外枠５に支持されている。３，３．・・・は、アイ
ランド１の周囲に内端が集るように配置された平板状の
多数のリードであって、タイバー４によシ互いに連結さ
れている。アイランド１に半導体素子を取付けた後、点
線の囲み（樹脂領域）６の内側の部分が封止樹脂で扱わ
れ、外部雰囲気から保護される。その後タイバーの連結
部を切シ落し、リード曲げ成形を行って、樹脂封止半導
体装置が完成する。The plan view of FIG. 2 shows a conventional lead frame used for assembling semiconductor devices with leads. In the figure, reference numeral 1 denotes an island on which a semiconductor element is attached, and is supported on an outer frame 5 by hanging leads 2. 3,3. . . are a large number of flat leads arranged so that their inner ends are gathered around the island 1, and are connected to each other by tie bars 4. After the semiconductor element is attached to the island 1, the portion inside the dotted line box (resin region) 6 is covered with a sealing resin to protect it from the external atmosphere. Thereafter, the connecting portions of the tie bars are cut off and the leads are bent and molded to complete the resin-sealed semiconductor device.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上述の従来のリードフレームによシ組立てられた半導体
装置では、封止樹脂により榎われた、吊りリードおよび
リード部分は平坦な板状となっているため、このリード
と封止樹脂の間の界面の隙間から水分が浸入して内部の
半導体素子に達し、半導体素子の特性劣化を引起すとい
う問題をもっている。In the semiconductor device assembled using the conventional lead frame described above, the hanging leads and lead portions covered by the sealing resin are flat plate-shaped, so the interface between the leads and the sealing resin is The problem is that moisture infiltrates through the gaps and reaches the semiconductor elements inside, causing deterioration of the characteristics of the semiconductor elements.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は、封止樹脂により＝われるリードフレームのリ
ード部分および吊りリードを無数の穴を有する網目状構
造にすることによシ、このリードおよび吊りリードを伝
わっての内部への水分の浸入を阻止し、半導体集積回路
素子を水分の障害から保農しようとするものである。The present invention prevents moisture from penetrating into the interior through the leads and suspension leads by forming the lead portions and suspension leads of the lead frame made of sealing resin into a mesh structure with countless holes. The purpose is to protect semiconductor integrated circuit devices from moisture damage.

〔実施例〕〔Example〕

つぎに本発明を実施例によシ説明する。 Next, the present invention will be explained using examples.

第１図は本発明の一実施例に係るリードフレームの平面
図である。図において、アイランド１に半導体素子を取
付は後、点線の囲み６の内部が封止樹脂で覆われるので
あるが、アイランド周囲のリード３の内端側および、吊
りリード２の囲み６の内側に位置する部分は、無数の穴
のあいた網状部分３ａ、２ａとされている。FIG. 1 is a plan view of a lead frame according to an embodiment of the present invention. In the figure, after the semiconductor element is mounted on the island 1, the inside of the dotted line box 6 is covered with sealing resin. The portions where they are located are net-like portions 3a, 2a with numerous holes.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明に係るリードフレームにおい
て、リードおよび吊りリードの封止樹脂に蝋われる部分
を、無数の穴を有する網状にすることによって、半導体
装置内部への水の浸入を防ぎ、半導体素子を水分から保
護するという効果がある。As explained above, in the lead frame according to the present invention, the portions of the leads and suspension leads that are soldered to the sealing resin are made into a net shape with countless holes, thereby preventing water from entering inside the semiconductor device. This has the effect of protecting the element from moisture.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例に係るリードフレームの平面
図、第２図は従来のリードフレームの平面図である。 １・・・・・・アイランド、２・・・・・・吊りリード
、２ａ・・・・・・吊ルリード網状部、３・・・・・・
リード、３ａ・・・・・・リード網状部、４・・・・・
・タイバー、５・・・・・・外枠、６・・・・・・樹脂
領域。FIG. 1 is a plan view of a lead frame according to an embodiment of the present invention, and FIG. 2 is a plan view of a conventional lead frame. 1...Island, 2...Hanging lead, 2a...Hanging leash reticular part, 3...
Lead, 3a...Lead mesh part, 4...
- Tie bar, 5...outer frame, 6...resin area.

Claims (1)

【特許請求の範囲】[Claims] 半導体素子を取付けるアイランドとこのアイランドの周
囲に内端部が集るように配置された多数のリードとを有
するリードフレームの前記アイランドに半導体素子を取
付け樹脂封止を施した半導体装置において、前記アイラ
ンドを外枠に吊る吊りリードおよび前記リードの、前記
封止樹脂に覆われる部分が無数の穴を有する網状になっ
ていることを特徴とする半導体装置。In a semiconductor device in which a semiconductor element is mounted on the island of a lead frame having an island on which a semiconductor element is mounted and a large number of leads arranged so that inner ends are gathered around the island, the semiconductor element is resin-sealed. What is claimed is: 1. A semiconductor device, characterized in that a suspension lead for hanging the semiconductor device from an outer frame and a portion of the lead covered with the sealing resin have a net shape with numerous holes.
JP2628986A 1986-02-07 1986-02-07 Semiconductor device Pending JPS62183548A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2628986A JPS62183548A (en) 1986-02-07 1986-02-07 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2628986A JPS62183548A (en) 1986-02-07 1986-02-07 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS62183548A true JPS62183548A (en) 1987-08-11

Family

ID=12189139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2628986A Pending JPS62183548A (en) 1986-02-07 1986-02-07 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS62183548A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999043032A3 (en) * 1998-02-20 1999-11-25 Siemens Ag sEMICONDUCTOR COMPONENT WITH A STRUCTURED LEADFRAME AND METHOD FOR PRODUCING THE SAME
JP2009032906A (en) * 2007-07-27 2009-02-12 Seiko Instruments Inc Semiconductor device package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999043032A3 (en) * 1998-02-20 1999-11-25 Siemens Ag sEMICONDUCTOR COMPONENT WITH A STRUCTURED LEADFRAME AND METHOD FOR PRODUCING THE SAME
JP2009032906A (en) * 2007-07-27 2009-02-12 Seiko Instruments Inc Semiconductor device package

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