JPS6218275B2 - - Google Patents
Info
- Publication number
- JPS6218275B2 JPS6218275B2 JP3377881A JP3377881A JPS6218275B2 JP S6218275 B2 JPS6218275 B2 JP S6218275B2 JP 3377881 A JP3377881 A JP 3377881A JP 3377881 A JP3377881 A JP 3377881A JP S6218275 B2 JPS6218275 B2 JP S6218275B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- surface roughness
- filler metal
- present
- brazing filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005219 brazing Methods 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 239000000945 filler Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 7
- 229910052748 manganese Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 230000003746 surface roughness Effects 0.000 description 15
- 238000004439 roughness measurement Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 238000003892 spreading Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3377881A JPS57149092A (en) | 1981-03-11 | 1981-03-11 | Silver solder material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3377881A JPS57149092A (en) | 1981-03-11 | 1981-03-11 | Silver solder material |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6438086A Division JPS61216887A (ja) | 1986-03-22 | 1986-03-22 | 銀ろう材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57149092A JPS57149092A (en) | 1982-09-14 |
| JPS6218275B2 true JPS6218275B2 (fr) | 1987-04-22 |
Family
ID=12395904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3377881A Granted JPS57149092A (en) | 1981-03-11 | 1981-03-11 | Silver solder material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57149092A (fr) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60127093A (ja) * | 1983-12-12 | 1985-07-06 | Tanaka Kikinzoku Kogyo Kk | ろう材 |
| US6596229B2 (en) | 2000-12-29 | 2003-07-22 | United Technologies Corporation | Silver braze alloy |
| DE102004040778B4 (de) * | 2004-08-23 | 2011-11-24 | Umicore Ag & Co. Kg | Silberhartlotlegierungen |
| DE102004040779B4 (de) * | 2004-08-23 | 2009-06-18 | Abb Technology Ag | Verwendung von Silberlegierungen als Hartlote |
| EP2756914A1 (fr) | 2013-01-18 | 2014-07-23 | Umicore AG & Co. KG | Alliage de brasage |
| US9731384B2 (en) * | 2014-11-18 | 2017-08-15 | Baker Hughes Incorporated | Methods and compositions for brazing |
| CN105397334A (zh) * | 2015-12-16 | 2016-03-16 | 郑州机械研究所 | 一种真空环境下使用的银基钎料 |
| CN110238559A (zh) * | 2019-06-17 | 2019-09-17 | 无锡日月合金材料有限公司 | 一种新型四元合金钎料及其制备方法 |
| CN112605556A (zh) * | 2020-12-22 | 2021-04-06 | 无锡日月合金材料有限公司 | 一种真空器件多级钎焊用钎料及其制备方法 |
| CN114393345A (zh) * | 2021-12-30 | 2022-04-26 | 无锡日月合金材料有限公司 | 一种熔点、流点温度差较小的低银真空焊料 |
-
1981
- 1981-03-11 JP JP3377881A patent/JPS57149092A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57149092A (en) | 1982-09-14 |
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