JPS6218035Y2 - - Google Patents
Info
- Publication number
- JPS6218035Y2 JPS6218035Y2 JP958582U JP958582U JPS6218035Y2 JP S6218035 Y2 JPS6218035 Y2 JP S6218035Y2 JP 958582 U JP958582 U JP 958582U JP 958582 U JP958582 U JP 958582U JP S6218035 Y2 JPS6218035 Y2 JP S6218035Y2
- Authority
- JP
- Japan
- Prior art keywords
- drum
- resin
- resin layer
- solvent
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 37
- 239000011347 resin Substances 0.000 claims description 37
- 239000004065 semiconductor Substances 0.000 claims description 14
- 239000002904 solvent Substances 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 6
- 238000009736 wetting Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 22
- 239000011241 protective layer Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP958582U JPS58111937U (ja) | 1982-01-27 | 1982-01-27 | 半導体素子表面保護樹脂層被覆装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP958582U JPS58111937U (ja) | 1982-01-27 | 1982-01-27 | 半導体素子表面保護樹脂層被覆装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58111937U JPS58111937U (ja) | 1983-07-30 |
| JPS6218035Y2 true JPS6218035Y2 (enrdf_load_stackoverflow) | 1987-05-09 |
Family
ID=30022210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP958582U Granted JPS58111937U (ja) | 1982-01-27 | 1982-01-27 | 半導体素子表面保護樹脂層被覆装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58111937U (enrdf_load_stackoverflow) |
-
1982
- 1982-01-27 JP JP958582U patent/JPS58111937U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58111937U (ja) | 1983-07-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4133697A (en) | Solar array strip and a method for forming the same | |
| US4173820A (en) | Method for forming a solar array strip | |
| US3847647A (en) | Process of applying adhesive to a floor covering | |
| CA2159242A1 (en) | Process for Manufacturing Semiconductor Device and Semiconductor Wafer | |
| JPS6218035Y2 (enrdf_load_stackoverflow) | ||
| JPS53111739A (en) | Flexible means for image forming device | |
| JPS5748249A (en) | Semiconductor device | |
| JPH043652Y2 (enrdf_load_stackoverflow) | ||
| US2353789A (en) | Repellent roll for handling adhesive sheets | |
| JPS58189059A (ja) | グラビアロ−ル型塗工機 | |
| JPH03145715A (ja) | 回転塗布膜形成装置 | |
| JPS6246252Y2 (enrdf_load_stackoverflow) | ||
| JP2508084Y2 (ja) | プリント基板用吸水ロ―ラ | |
| JPS54101282A (en) | Two layer rolysilicon semiconductor device | |
| JPS5349964A (en) | Manufacture of semiconductor device | |
| JPH0221740U (enrdf_load_stackoverflow) | ||
| JPS6323705Y2 (enrdf_load_stackoverflow) | ||
| JPS5541745A (en) | Preparation of semiconductor device | |
| JPH0255280A (ja) | セラミック成型体の製造法 | |
| JPH0650521Y2 (ja) | 内熱型パウダースプレー装置 | |
| JPS62195121A (ja) | スピンコ−タ− | |
| JPS622102Y2 (enrdf_load_stackoverflow) | ||
| JPS5586555A (en) | Method and device for coating bonding agent on one side of sheet or the like | |
| JPS62286225A (ja) | 半導体製造装置 | |
| JP3583393B2 (ja) | 薄膜形成方法 |