JPS62179723A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS62179723A
JPS62179723A JP2155286A JP2155286A JPS62179723A JP S62179723 A JPS62179723 A JP S62179723A JP 2155286 A JP2155286 A JP 2155286A JP 2155286 A JP2155286 A JP 2155286A JP S62179723 A JPS62179723 A JP S62179723A
Authority
JP
Japan
Prior art keywords
film
forming
contact hole
semiconductor device
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2155286A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0558564B2 (enExample
Inventor
Koji Eguchi
江口　剛治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2155286A priority Critical patent/JPS62179723A/ja
Publication of JPS62179723A publication Critical patent/JPS62179723A/ja
Publication of JPH0558564B2 publication Critical patent/JPH0558564B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
JP2155286A 1986-02-03 1986-02-03 半導体装置の製造方法 Granted JPS62179723A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2155286A JPS62179723A (ja) 1986-02-03 1986-02-03 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2155286A JPS62179723A (ja) 1986-02-03 1986-02-03 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS62179723A true JPS62179723A (ja) 1987-08-06
JPH0558564B2 JPH0558564B2 (enExample) 1993-08-26

Family

ID=12058161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2155286A Granted JPS62179723A (ja) 1986-02-03 1986-02-03 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS62179723A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01298765A (ja) * 1988-05-27 1989-12-01 Fujitsu Ltd 半導体装置及びその製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9386327B2 (en) 2006-05-24 2016-07-05 Time Warner Cable Enterprises Llc Secondary content insertion apparatus and methods
US8024762B2 (en) 2006-06-13 2011-09-20 Time Warner Cable Inc. Methods and apparatus for providing virtual content over a network

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01298765A (ja) * 1988-05-27 1989-12-01 Fujitsu Ltd 半導体装置及びその製造方法
US5384485A (en) * 1988-05-27 1995-01-24 Fujitsu Limited Contact structure for connecting an electrode to a semiconductor
US5512516A (en) * 1988-05-27 1996-04-30 Fujitsu Limited Contact structure for connecting an electrode to a semiconductor device and a method of forming the same

Also Published As

Publication number Publication date
JPH0558564B2 (enExample) 1993-08-26

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