JPS62178541U - - Google Patents
Info
- Publication number
- JPS62178541U JPS62178541U JP6663586U JP6663586U JPS62178541U JP S62178541 U JPS62178541 U JP S62178541U JP 6663586 U JP6663586 U JP 6663586U JP 6663586 U JP6663586 U JP 6663586U JP S62178541 U JPS62178541 U JP S62178541U
- Authority
- JP
- Japan
- Prior art keywords
- glass sleeve
- glass
- end surface
- layer
- intermediate layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 claims description 6
- 239000008188 pellet Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図及び第２図は本考案に係るダイオードの
一実施例を示す断面図及び側面図、第３図乃至第
５図は第１図のダイオードの各製造工程での断面
図、第６図は第１図のダイオードを製造する封着
治具における部分断面図である。第７図は従来の
リードレス型ダイオードの断面図、第８図は第７
図のダイオードを製造する封着治具における部分
断面図である。
１５……半導体ペレツト、１６，１７……電極
、１８……ガラススリーブ、１９……中間層、２
０……導電層。
1 and 2 are cross-sectional views and side views showing one embodiment of the diode according to the present invention, FIGS. 3 to 5 are cross-sectional views of the diode shown in FIG. 1 at various manufacturing steps, and FIG. 2 is a partial sectional view of a sealing jig for manufacturing the diode shown in FIG. 1. FIG. Figure 7 is a cross-sectional view of a conventional leadless diode, and Figure 8 is a cross-sectional view of a conventional leadless diode.
It is a partial sectional view of the sealing jig which manufactures the diode of a figure. 15... Semiconductor pellet, 16, 17... Electrode, 18... Glass sleeve, 19... Intermediate layer, 2
0... Conductive layer.
Claims (1)
納された一対の柱状電極の外周に前記ガラススリ
ーブを固着すると共に、前記ガラススリーブの端
面にガラスとの濡れ性に劣る中間層を形成し、こ
の中間層上と前記電極のガラススリーブより露呈
する端面上に導電層を被着形成したことを特徴と
するダイオード。 The glass sleeve is fixed to the outer periphery of a pair of columnar electrodes that sandwich a semiconductor pellet in the glass sleeve, and an intermediate layer having poor wettability with glass is formed on the end surface of the glass sleeve, and a layer is formed on the intermediate layer. A diode characterized in that a conductive layer is formed on the end surface of the electrode exposed from the glass sleeve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986066635U JPH0442933Y2 (en) | 1986-04-30 | 1986-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986066635U JPH0442933Y2 (en) | 1986-04-30 | 1986-04-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62178541U true JPS62178541U (en) | 1987-11-12 |
| JPH0442933Y2 JPH0442933Y2 (en) | 1992-10-12 |
Family
ID=30904824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986066635U Expired JPH0442933Y2 (en) | 1986-04-30 | 1986-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442933Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5828859A (en) * | 1981-08-13 | 1983-02-19 | Matsushita Electronics Corp | Leadless glass sealing diode |
-
1986
- 1986-04-30 JP JP1986066635U patent/JPH0442933Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5828859A (en) * | 1981-08-13 | 1983-02-19 | Matsushita Electronics Corp | Leadless glass sealing diode |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0442933Y2 (en) | 1992-10-12 |