JPS62177992A - Formation of through-hole of circuit board - Google Patents
Formation of through-hole of circuit boardInfo
- Publication number
- JPS62177992A JPS62177992A JP1980486A JP1980486A JPS62177992A JP S62177992 A JPS62177992 A JP S62177992A JP 1980486 A JP1980486 A JP 1980486A JP 1980486 A JP1980486 A JP 1980486A JP S62177992 A JPS62177992 A JP S62177992A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- circuit board
- pilot hole
- forming
- formation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000015572 biosynthetic process Effects 0.000 title 1
- 238000000034 method Methods 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概要〕
回路基板に形成するスルーホールの下孔のエツジ部分に
、階段状のテーパを形成して導体ペーストがスルーボー
ルの下孔に均等に付着するようにした。DETAILED DESCRIPTION OF THE INVENTION [Summary] A step-like taper is formed at the edge of the pilot hole of a through hole to be formed in a circuit board so that the conductive paste adheres evenly to the pilot hole of the through ball.
本発明は、回路基板のスルーホール形成方法に係’Ｑ、
とくにスルーホールの下孔のエツジ部分に階段状のテー
パを形成した回路基板のスルーホール形成方法に関する
。The present invention relates to a method for forming through holes in a circuit board.
In particular, the present invention relates to a method for forming a through hole in a circuit board in which a stepped taper is formed at the edge of the pilot hole of the through hole.
混成集積回路等に用いられるセラミック等からなる回路
基板のスルーボールの形成は、基板にスルーホールの下
孔を穿設し、この上孔の壁面に導体ペーストをコーティ
ングする方法が多用されている。BACKGROUND ART To form through balls on circuit boards made of ceramic or the like used in hybrid integrated circuits, etc., a method is often used in which a pilot hole for a through hole is bored in the board and the wall surface of the upper hole is coated with a conductive paste.
第２図は、従来の回路基板のスルーホール形成方法を説
明する側断面図である。FIG. 2 is a side sectional view illustrating a conventional method for forming through holes in a circuit board.
図において、セラミック等からなる回路基板１にスルー
ホール下孔１１を穿設し、該下孔１１に図示しないスク
リーンを介してスクリーンの反対側から図示しない真空
ポンプ等で吸引しながら、スルーボール下孔１１の壁面
に導電性の良好な金属たとえば銅等からなる導体ペース
トをコーティングし、導体部２を形成する方法が行なわ
れている。In the figure, a through-hole pilot hole 11 is bored in a circuit board 1 made of ceramic or the like, and a through-ball is sucked into the pilot hole 11 through a screen (not shown) from the opposite side of the screen with a vacuum pump (not shown). A method is used in which the wall surface of the hole 11 is coated with a conductive paste made of a metal with good conductivity, such as copper, to form the conductor portion 2.
上記従来のスルーホール形成方法にあっては、基板に穿
設したスルーホール下孔のエツジ部（角部）に付着する
導体ペーストが、下孔の壁面に付着する導体ペーストよ
り薄くなり、エツジ部にクラックが発生し易いという問
題点があった。In the conventional through-hole forming method described above, the conductive paste that adheres to the edges (corners) of the pilot hole of the through-hole drilled in the board is thinner than the conductive paste that adheres to the wall surface of the pilot hole, and There was a problem that cracks were likely to occur.
本発明は、」二記の問題点を解決してエツジ部のクラン
クの発生を防止し、歩留りの向上を図った回路基板のス
ルーホール形成方法を提供するものである。The present invention provides a method for forming through-holes in a circuit board, which solves the above two problems, prevents the occurrence of cranks at the edges, and improves the yield.
すなわち、回路基板に形成するスルーホールの下孔のエ
ツジ部分に、階段状のテーパを形成したことによって解
決される。That is, the problem is solved by forming a stepped taper at the edge of the pilot hole of the through hole formed in the circuit board.
上記回路基板のスルーホール形成方法は、スルーホール
の下孔のエツジ部に階段状のテーパ部を形成したことに
より、エツジ部分にも均等な膜厚の導体ペーストが付着
し、信頼性が向上する。The method for forming through-holes in circuit boards described above involves forming a step-like taper at the edge of the pilot hole of the through-hole, which allows the conductive paste to adhere to the edge with an even thickness, improving reliability. .
第１図は、本発明の一実施例を説明する図で、同図（ａ
）は側断面図、（ｂ）は平面図で、第２図と同等の部分
については同一符号を付している。FIG. 1 is a diagram illustrating an embodiment of the present invention.
) is a side sectional view, and (b) is a plan view, in which the same parts as in FIG. 2 are given the same reference numerals.
図において、セラミック等からなる回路基板１にスルー
ホール下孔１１を穿設し、該下孔１１のエツジ部分に階
段状のテーパ１２を形成したるのち、図示しないスクリ
ーンを介してスクリーンの反対側から図示しない真空ポ
ンプ等で吸引しながら、スルーホール下孔１１の壁面に
導電性の良好な金属たとえば銅等からなる導体ペースト
をコーティングして、導体部２を形成するもので比較的
均等な膜厚の導体部２が得られる。In the figure, a through-hole pilot hole 11 is bored in a circuit board 1 made of ceramic or the like, and a step-like taper 12 is formed at the edge of the pilot hole 11. The conductive paste made of a metal with good conductivity, such as copper, is coated on the wall surface of the through-hole pilot hole 11 while suction is applied using a vacuum pump (not shown) to form the conductor portion 2, and a relatively uniform film is formed. A thick conductor portion 2 is obtained.
なお、本実施例では回路基板１をセラミックについて説
明したが、セラミックに限らずガラスエポキシ樹脂その
他の印刷配線基板にも適用が可能である。In this embodiment, the circuit board 1 has been described as a ceramic circuit board, but the present invention is not limited to ceramics, but can also be applied to glass epoxy resin or other printed wiring boards.
以−ヒの説明から明らかなように、本発明によればスル
ーホールの導体部の膜厚が比較的均等に形成できるので
、コーナクラック等の発生が防止でき、歩留りが向上す
るとともに信頼性の向上に極めて有効である。As is clear from the following explanation, according to the present invention, the film thickness of the conductor portion of the through hole can be formed to be relatively uniform, so occurrence of corner cracks etc. can be prevented, yield is improved, and reliability is improved. It is extremely effective for improvement.
第１図は、本発明の一実施例を説明する図で、同図（ａ
ｌは側断面図２（ｂ）は平面図、第２図は、従来の回路
基板のスルーホール形成方法を説明する側断面図である
。
図において、１は回路基板、２は導体部、１１はスルー
ホール下孔、１２は階段状テーパ、をそれぞれ示す。
（［）Ｊ
本発明ｎ −ｆ語例
やｔ圭りズルー氷−ル乃イ判ｔケ面回
第 ２ 図FIG. 1 is a diagram illustrating an embodiment of the present invention.
2(b) is a plan view, and FIG. 2 is a side sectional view illustrating a conventional method for forming through holes in a circuit board. In the figure, 1 is a circuit board, 2 is a conductor part, 11 is a through-hole pilot hole, and 12 is a stepped taper. ([)J This invention n -f word examples and t Kei ri Zulu ice - Le noi version t kamen times Figure 2
Claims (1)
（１１）のエッジ部分に、階段状のテーパを形成したこ
とを特徴とする回路基板のスルーホール形成方法。A method for forming a through hole in a circuit board, characterized in that a step-like taper is formed at an edge portion of a pilot hole (11) of a through hole (2) formed in a circuit board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980486A JPS62177992A (en) | 1986-01-30 | 1986-01-30 | Formation of through-hole of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980486A JPS62177992A (en) | 1986-01-30 | 1986-01-30 | Formation of through-hole of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62177992A true JPS62177992A (en) | 1987-08-04 |
Family
ID=12009522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980486A Pending JPS62177992A (en) | 1986-01-30 | 1986-01-30 | Formation of through-hole of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62177992A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04206990A (en) * | 1990-11-30 | 1992-07-28 | Nippondenso Co Ltd | Ceramic substrate production device |
| JP2003007777A (en) * | 2001-06-27 | 2003-01-10 | Toppan Printing Co Ltd | Film carrier and manufacturing method therefor |
-
1986
- 1986-01-30 JP JP1980486A patent/JPS62177992A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04206990A (en) * | 1990-11-30 | 1992-07-28 | Nippondenso Co Ltd | Ceramic substrate production device |
| JP2003007777A (en) * | 2001-06-27 | 2003-01-10 | Toppan Printing Co Ltd | Film carrier and manufacturing method therefor |
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