JPH0272690A - Printed board having thick film circuit - Google Patents
Printed board having thick film circuitInfo
- Publication number
- JPH0272690A JPH0272690A JP22422388A JP22422388A JPH0272690A JP H0272690 A JPH0272690 A JP H0272690A JP 22422388 A JP22422388 A JP 22422388A JP 22422388 A JP22422388 A JP 22422388A JP H0272690 A JPH0272690 A JP H0272690A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- conductor
- thick film
- printed board
- film circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010949 copper Substances 0.000 claims abstract description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 12
- 239000004020 conductor Substances 0.000 abstract description 47
- 239000000919 ceramic Substances 0.000 abstract description 4
- 238000007650 screen-printing Methods 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 8
- 238000001035 drying Methods 0.000 description 4
- 238000010304 firing Methods 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、厚膜混成集積回路基板、特に同基板を製造す
る際に用いられる導体スルホールに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to thick film hybrid integrated circuit boards, and more particularly to conductor through-holes used in the manufacture of such boards.
従来の技術
近年、テレビジョン受像機やビデオカメラ等に使用され
る厚膜混成集積回路には、配線用の導体に銅（以下Ｃｕ
と呼ぶ）を用い、基板の表面と裏面の両面に導体パター
ンが形成され、両面を結ぶスルホールには、Ｃｕ導体が
塗布形成されている。Background of the Invention In recent years, thick film hybrid integrated circuits used in television receivers, video cameras, etc. have been using copper (hereinafter referred to as Cu) as a wiring conductor.
A conductive pattern is formed on both the front and back surfaces of the substrate using a conductive material (referred to as .
スルホールに、Ｃｕ導体を形成するには、Ｃｕ導体ペー
ストを用いて表面又は裏面の導体パターンをスクリーン
印刷塗布する「！１に、スルホール部を真空吸引し、ス
ルホール内にＣｕ導体ペーストを塗布する方法が一般に
行なわれている。To form a Cu conductor in a through hole, use Cu conductor paste to screen-print a conductor pattern on the front or back side. is commonly practiced.
以下図面を参照しながら、従来の厚膜回路印刷基板につ
いて説明する。第５図は従来の厚膜回路印刷基板の導体
パターン未形成のスルホール部を示す断面図である。第
６図は従来の厚膜回路印刷基板のスルホール部にＣｕ導
体が塗布形成された構成を示す断面図である。第５図、
第６図において、１は厚膜回路印刷基板を構成するアル
ミナセラミックス基板である。２は、アルミナセラミッ
クス基板１に形成された孔、即ちスルホールで、表面及
び裏面のスルホールエツジ部は直角形状である。３はス
ルホール２に塗布形成されたＣｕ導体で、厚膜回路印刷
基板の表面と裏面とを電気的に結んでいる。A conventional thick film circuit printed board will be described below with reference to the drawings. FIG. 5 is a sectional view showing a through hole portion of a conventional thick film circuit printed board on which a conductor pattern is not formed. FIG. 6 is a sectional view showing a structure in which a Cu conductor is coated on the through-hole portion of a conventional thick film circuit printed board. Figure 5,
In FIG. 6, 1 is an alumina ceramic substrate constituting a thick film circuit printed board. Reference numeral 2 denotes a hole formed in the alumina ceramic substrate 1, that is, a through hole, and the through hole edge portions on the front and back surfaces are in a right-angled shape. Reference numeral 3 denotes a Cu conductor coated on the through hole 2, which electrically connects the front and back surfaces of the thick film circuit printed board.
スルホール２にＣｕ導体を塗布形成するには、表面又は
裏面のＣｕ導体パターンをスクリーン印刷塗布する貼に
、スルホール部のＣｕ導体ペーストを真空吸引し、スル
ホール内にＣｕ導体ペーストを塗布し、乾燥後、窒素雰
囲気で焼成し、Ｃｕ導体を形成する。To form a Cu conductor by applying it to the through-hole 2, vacuum the Cu conductor paste in the through-hole area on the paste to which the Cu conductor pattern on the front or back side is screen-printed, apply the Cu conductor paste inside the through-hole, and after drying. , and then fired in a nitrogen atmosphere to form a Cu conductor.
発明が解決しようとする課題
しかしながら、従来のような第５図の形状を有するスル
ホール２を持つ厚膜回路印刷基板では、第６図に示され
るように、スルホール２内にＣｕ導体ペーストを塗布し
、乾燥後、窒素雰囲気で焼成してＣｕ導体を形成すると
、スルホール２のエツジ部のＣｕ導体３に塗布厚みの薄
いかつ微妙な塗布部ができ、厚膜回路印刷基板の両面導
体パターンのスルホール２の電気的接続が不安定になり
やすいという問題点を有していた。Problems to be Solved by the Invention However, in a conventional thick film circuit printed board having through holes 2 having the shape shown in FIG. 5, as shown in FIG. After drying, when the Cu conductor is formed by firing in a nitrogen atmosphere, a thin and delicate coating area is formed on the Cu conductor 3 at the edge of the through hole 2, and the through hole 2 of the double-sided conductor pattern on the thick film circuit printed board is The problem is that the electrical connection tends to become unstable.
本発明は前記問題点に鑑み、厚膜回路印刷基板の両面を
結ぶスルホールのエツジ部Ｃｕ 導体の塗布厚みが薄く
かつ微少な塗布部が生ずることなく、電気的接続が安定
なスルホールを有する厚膜回路印刷基板を提供するもの
である。In view of the above-mentioned problems, the present invention has been developed to provide a thick film having through-holes in which the Cu conductor is thinly coated and does not produce minute coated areas, allowing for stable electrical connection. The present invention provides circuit printed boards.
課題を解決するための手段
この目的を達成するために本発明の厚膜回路印刷基板は
、両面に厚膜回路が印刷形成された基板の両面を結ぶス
ルホールのエツジ部形状が０．０５〜０．２ｍｍのコー
ナー又は半径０．０５〜０．２ ｍｍの面とり部を有し
、前記スルホールは銅を主成分とする導体ペーストが塗
布形成された厚膜回路印刷基板から構成されている。Means for Solving the Problem In order to achieve this object, the thick film circuit printed board of the present invention has a thick film circuit printed on both sides, and the edge shape of the through hole connecting both sides of the board is 0.05 to 0. The through hole has a corner of 0.2 mm or a chamfered portion with a radius of 0.05 to 0.2 mm, and the through hole is made of a thick film circuit printed board coated with a conductive paste containing copper as a main component.
作 用
この構成により、スルホール内にＣｕ導体を形成する際
、スルホールのエツジ部は面とりがなされているため、
Ｃｕ導体ペーストをスクリ−ン印刷しスルホール部のＣ
ｕ導体ペーストを真空吸引した時、Ｃｕ導体ペーストが
アルミナセラミックス基板のスルホールエツジ部の面と
りした面にそってスルホール内に入り、エツジ部のＣｕ
導体ペーストの厚みが薄くならず、そのため微少な未
塗布部を生ずることなく、電気的接続が安定にできるこ
ととなる。Function: With this configuration, when forming a Cu conductor in the through hole, the edges of the through hole are chamfered, so
Screen print Cu conductor paste and mark C in the through-hole area.
When the U conductor paste is vacuum-suctioned, the Cu conductor paste enters the through-hole along the chamfered surface of the through-hole edge part of the alumina ceramic substrate, and the Cu conductor paste at the edge part
The thickness of the conductor paste does not become thinner, and therefore, electrical connections can be stably made without producing minute uncoated parts.
実施例
以下本発明の一実施例について、図面を参照しながら説
明する。第１図は本発明の一実施例における厚膜回路印
刷基板の導体パターン未形成のスルホール部を示す断面
図である。第３図は第１図のスルホール部にＣｕ導体を
塗布形成した構造を示す断面図である。第１図、第３図
において、１．２．３は第５図、第６図の構成と同じも
ので、アルミナセラミックス基板、スルホール、Ｃｕ導
体である。EXAMPLE An example of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing a through-hole portion on which a conductor pattern is not formed in a thick film circuit printed board according to an embodiment of the present invention. FIG. 3 is a sectional view showing a structure in which a Cu conductor is coated on the through-hole portion of FIG. 1. In FIGS. 1 and 3, 1.2.3 has the same structure as in FIGS. 5 and 6, which is an alumina ceramic substrate, through holes, and a Cu conductor.
厚膜回路印刷基板を形成する為、厚さ０．４〜１、Ｏｗ
ｎの９６％アルミナセラミックス基板に、スルホール径
φ０．２〜１．０ｍのスルホールを形成し、スルホール
エツジ部を０．０２〜０．５１ｍの範囲で０面とりを行
なった。これらのアルミナセラミックス基板にＣｕ導体
ペースト（９１５３，９１６３Ｄ、４００３．３７５５
）を所定のパターン形状にスクリーン印刷しながら真
空吸引を行ない、スルホール内に塗布後、１２０’（：
１０分の乾燥をし、ピーク温度９００°Ｃ６０分間窒素
雰囲気中で焼成を行ないＣｕ導体を形成した。To form a thick film circuit printed board, the thickness is 0.4~1, Ow.
Through holes with a through hole diameter of 0.2 to 1.0 m were formed on a 96% alumina ceramic substrate, and the edges of the through holes were flattened in a range of 0.02 to 0.51 m. Cu conductor paste (9153, 9163D, 4003.3755
) was screen printed in a predetermined pattern shape while applying vacuum suction, and after applying it inside the through hole, 120' (:
After drying for 10 minutes, firing was performed in a nitrogen atmosphere at a peak temperature of 900° C. for 60 minutes to form a Cu conductor.
０面とりが０．０４ｍｍ以下では、エツジ部が直角形状
の厚膜回路印刷基板と同じＣｕ導体の塗布厚みの薄いか
つ微妙な未塗布部ができ、０面とりが０２５聴以上では
、スルホール径よりも大きな０面とりとなり、両面のパ
ターン形成面積が少なくなり、実用的でなくなった。本
発明の０．０５〜００．２調の０面とりのものはエツジ
部のＣｕ導体の厚みが薄くならず、そのため微少な未塗
布部を生ずることもなく、電気的にも接続が安定してい
た。If the 0-face removal is 0.04 mm or less, there will be a thin and subtle uncoated area of Cu conductor, which is the same as a thick film circuit printed board with a right-angled edge, and if the 0-face removal is 0.025 mm or more, the through-hole diameter This resulted in a larger 0-sided area, and the pattern formation area on both sides became smaller, making it impractical. The thickness of the Cu conductor at the edge of the 0.05 to 00.2 tone zero-faced one of the present invention does not become thinner, so there is no slight uncoated area, and the connection is electrically stable. was.
以上のように構成された厚膜回路印刷基板について、さ
らに詳細に説明する。The thick film circuit printed board configured as above will be explained in more detail.
Ｃｕｉ体ペーストをスクリーン印刷し、スルホール部の
Ｃｕ導体ペーストを真空吸引した時、Ｃｕ導体ペースト
がアルミナセラミックス基板のスルホールエツジ部の面
とりした面にそってスルホール内に入り、エツジ部の面
取り部に導体ペーストの厚みが薄くならずに塗布され、
そのためＣｕ導体ペーストの乾燥及び焼成時の体積収縮
時にも微少な未塗布部を生ずることなく、厚膜回路印刷
基板の表面、裏面とスルホール内のＣｕ導体が安定して
接続される。When the Cu conductor paste is screen printed and the Cu conductor paste in the through-hole part is vacuum-suctioned, the Cu conductor paste enters the through-hole along the chamfered surface of the through-hole edge part of the alumina ceramics substrate, and is absorbed into the chamfered part of the edge part. The thickness of the conductor paste is applied without thinning,
Therefore, even when the Cu conductor paste shrinks in volume during drying and firing, the Cu conductor in the through hole can be stably connected to the front and back surfaces of the thick film circuit printed board without producing a minute uncoated area.
なお、本実施例では、スルホールエツジ部の面とり形状
を０面とりとしたが、第２図、第４図に示すようなＲ面
とりでも同様の効果が得られる。In this embodiment, the chamfered shape of the through-hole edge portion is zero-sided, but the same effect can be obtained by using rounded chamfering as shown in FIGS. 2 and 4.
第２図は本発明の他の実施例における厚膜回路印刷基板
の導体パターン未形成のスルホール部を示す断面図であ
る。第４図は本発明のスルホール部にＣｕ導体を塗布形
成した構造を示す断面図である。第２図、第４図におい
て、１．２．３は第１図、第２図の構成と同じものであ
る。FIG. 2 is a sectional view showing a through-hole portion on which a conductor pattern is not formed in a thick film circuit printed board in another embodiment of the present invention. FIG. 4 is a cross-sectional view showing a structure in which a Cu conductor is coated on a through-hole portion of the present invention. In FIGS. 2 and 4, 1.2.3 has the same configuration as in FIGS. 1 and 2.
発明の効果
以上のように本発明の厚膜印刷回路基板は、両面に厚膜
回路が印刷形成された基板の、両面を結ぶスルホールの
エツジ部形状が０．０５〜０．２ ｍｍの０面又は半径
０．０５〜０．２＋＋＋ｍの面とり部をなし、前記スル
ホールは銅を主成分とする導体ペーストが塗布形成され
たものであり、厚膜回路印刷基板のスルホールエツジ部
のＣｕ導体の厚みを薄くすることなく、微少な未塗布部
を生ずることなく電気的に安定した厚膜回路印刷基板を
提供することができるものである。Effects of the Invention As described above, the thick film printed circuit board of the present invention has a substrate on which thick film circuits are printed on both sides, and the edge shape of the through hole connecting both sides is 0.05 to 0.2 mm. The through hole has a chamfered portion with a radius of 0.05 to 0.2+++m, and the through hole is formed by applying a conductive paste containing copper as a main component, and the thickness of the Cu conductor at the through hole edge portion of the thick film circuit printed board is It is possible to provide an electrically stable thick film circuit printed board without thinning the substrate or producing minute uncoated areas.
第１図は本発明の第１の実施例における厚膜回路印刷基
板の導体パターン未形成時のスルホール部を示す断面図
、第２図は第２の実施例における厚膜回路印刷基板の導
体パターン未形成時のスルホール部を示す断面図、第３
図は第１図の実施例におけるスルホール部にＣｕ導体を
塗布形成した構造を示の断面図、第４図は第２の実施例
におけるスルホール部にＣｕ導体を塗布形成した構造を
示す断面図、第５図は従来のエツジ部が直角形状の厚膜
回路印刷基板の導体パターン未形成時のスルホール部を
示す断面図、第６図は従来の厚膜回路印刷基板のスルホ
ール部にＣｕｉ体を塗布形成した構造を示す断面図であ
る。
１・・・・・・アルミナセラミックス基板、２・・・・
・・アルミナセラミックス基板に形成された孔（スルホ
ール）、３・・・・・・スルホール２に塗布形成された
Ｃｕ導体。
代理人の氏名 弁哩士 粟 野 重 孝 ほか１名法
綜FIG. 1 is a cross-sectional view showing the through-hole portion of a thick film circuit printed board according to the first embodiment of the present invention when no conductor pattern is formed, and FIG. 2 is a cross-sectional view showing the conductor pattern of the thick film circuit printed board according to the second embodiment. Cross-sectional view showing the through hole part when not formed, 3rd
The figure is a sectional view showing a structure in which a Cu conductor is applied and formed on the through-hole portion in the embodiment of FIG. 1, and FIG. 4 is a sectional view showing a structure in which a Cu conductor is applied and formed in the through-hole portion in the second embodiment. Fig. 5 is a cross-sectional view showing the through-hole portion of a conventional thick-film circuit printed board with right-angled edges when no conductor pattern is formed, and Fig. 6 is a cross-sectional view showing the through-hole portion of a conventional thick-film circuit printed board with a Cu body applied. FIG. 3 is a cross-sectional view showing the formed structure. 1... Alumina ceramics substrate, 2...
... Hole (through hole) formed in the alumina ceramics substrate, 3 ... Cu conductor coated and formed in the through hole 2. Name of agent: Attorney Shigetaka Awano and one other attorney
Claims (1)
スルホールのエッジ部に０．０５〜０．２ｍｍのＲ面取
り又は半径０．０５〜０．２ｍｍのＣ面取り部を有し、
前記スルホールは銅を主成分とする導体ペーストが塗布
形成された厚膜回路印刷基板。A substrate with thick film circuits printed on both sides has an R chamfer of 0.05 to 0.2 mm or a C chamfer of radius 0.05 to 0.2 mm on the edge of a through hole connecting both sides,
The through holes are formed on a thick film circuit printed board on which a conductive paste containing copper as a main component is applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22422388A JPH0272690A (en) | 1988-09-07 | 1988-09-07 | Printed board having thick film circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22422388A JPH0272690A (en) | 1988-09-07 | 1988-09-07 | Printed board having thick film circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0272690A true JPH0272690A (en) | 1990-03-12 |
Family
ID=16810437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22422388A Pending JPH0272690A (en) | 1988-09-07 | 1988-09-07 | Printed board having thick film circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0272690A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010238732A (en) * | 2009-03-30 | 2010-10-21 | Toppan Forms Co Ltd | Wiring board and method of manufacturing the same |
| JP2010238733A (en) * | 2009-03-30 | 2010-10-21 | Toppan Forms Co Ltd | Wiring board and method of manufacturing the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6124296A (en) * | 1984-07-13 | 1986-02-01 | 松下電器産業株式会社 | Thick film hybrid ic |
| JPS6327090A (en) * | 1986-07-18 | 1988-02-04 | 松下電器産業株式会社 | Thick film hybrid integrated circuit |
-
1988
- 1988-09-07 JP JP22422388A patent/JPH0272690A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6124296A (en) * | 1984-07-13 | 1986-02-01 | 松下電器産業株式会社 | Thick film hybrid ic |
| JPS6327090A (en) * | 1986-07-18 | 1988-02-04 | 松下電器産業株式会社 | Thick film hybrid integrated circuit |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010238732A (en) * | 2009-03-30 | 2010-10-21 | Toppan Forms Co Ltd | Wiring board and method of manufacturing the same |
| JP2010238733A (en) * | 2009-03-30 | 2010-10-21 | Toppan Forms Co Ltd | Wiring board and method of manufacturing the same |
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