JPS6217379B2 - - Google Patents

Info

Publication number
JPS6217379B2
JPS6217379B2 JP54165568A JP16556879A JPS6217379B2 JP S6217379 B2 JPS6217379 B2 JP S6217379B2 JP 54165568 A JP54165568 A JP 54165568A JP 16556879 A JP16556879 A JP 16556879A JP S6217379 B2 JPS6217379 B2 JP S6217379B2
Authority
JP
Japan
Prior art keywords
gold
layer
silver
silicon
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54165568A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5688340A (en
Inventor
Hajime Terakado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP16556879A priority Critical patent/JPS5688340A/ja
Publication of JPS5688340A publication Critical patent/JPS5688340A/ja
Publication of JPS6217379B2 publication Critical patent/JPS6217379B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
JP16556879A 1979-12-21 1979-12-21 Heat resistant electrode and manufacture thereof Granted JPS5688340A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16556879A JPS5688340A (en) 1979-12-21 1979-12-21 Heat resistant electrode and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16556879A JPS5688340A (en) 1979-12-21 1979-12-21 Heat resistant electrode and manufacture thereof

Publications (2)

Publication Number Publication Date
JPS5688340A JPS5688340A (en) 1981-07-17
JPS6217379B2 true JPS6217379B2 (cg-RX-API-DMAC7.html) 1987-04-17

Family

ID=15814827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16556879A Granted JPS5688340A (en) 1979-12-21 1979-12-21 Heat resistant electrode and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS5688340A (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59213145A (ja) * 1983-05-18 1984-12-03 Toshiba Corp 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JPS5688340A (en) 1981-07-17

Similar Documents

Publication Publication Date Title
US3323956A (en) Method of manufacturing semiconductor devices
US2990502A (en) Method of alloying a rectifying connection to a semi-conductive member, and semi-conductive devices made by said method
JPH08181392A (ja) 電気素子の接合材料および接合方法
US2820932A (en) Contact structure
US4042951A (en) Gold-germanium alloy contacts for a semiconductor device
US3241011A (en) Silicon bonding technology
US3227933A (en) Diode and contact structure
JP4724355B2 (ja) 半導体装置
US2878432A (en) Silicon junction devices
JPS6217379B2 (cg-RX-API-DMAC7.html)
JP2687017B2 (ja) ショットキバリア半導体装置
US3032695A (en) Alloyed junction semiconductive device
JPS5850021B2 (ja) 半導体装置の製法
JPS6346984B2 (cg-RX-API-DMAC7.html)
US3254389A (en) Method of making a ceramic supported semiconductor device
US3108209A (en) Transistor device and method of manufacture
US3353073A (en) Magnesium-aluminum alloy contacts for semiconductor devices
JPS6148776B2 (cg-RX-API-DMAC7.html)
JP2708798B2 (ja) 炭化ケイ素の電極形成方法
JP2007514312A (ja) 補強された内部接続メタライゼーションを有するワイヤボンディングされた半導体部品
US3324361A (en) Semiconductor contact alloy
US3331995A (en) Housed semiconductor device with thermally matched elements
JPS59189625A (ja) 半導体装置の製造方法
JP2529397B2 (ja) チップ部品載置用電極
US4987476A (en) Brazed glass pre-passivated chip rectifier