JPS6217127U - - Google Patents
Info
- Publication number
- JPS6217127U JPS6217127U JP1985107730U JP10773085U JPS6217127U JP S6217127 U JPS6217127 U JP S6217127U JP 1985107730 U JP1985107730 U JP 1985107730U JP 10773085 U JP10773085 U JP 10773085U JP S6217127 U JPS6217127 U JP S6217127U
- Authority
- JP
- Japan
- Prior art keywords
- tip
- conical
- angle
- wire bonder
- curved surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
第1図は本考案になるワイヤボンダ用ツールの
一実施例を示し、第2図のA―B線、A―C線、
A―D線の共通断面図、第2図は第1図の底面図
、第3図はボンデイング部品の一例を示し、aは
斜視図、bは拡大平面図、第4図は本考案の他の
実施例を示す底面図である。
10:ワイヤボンダ用ツール、12:円錐状、
13,14,15:平面斜面、16:曲面、θ1
:円錐角度、θ2:角度。
FIG. 1 shows an embodiment of the wire bonder tool according to the present invention.
2 is a bottom view of FIG. 1, FIG. 3 is an example of bonding parts, a is a perspective view, b is an enlarged plan view, and FIG. 4 is a cross-sectional view taken along line A-D. It is a bottom view showing an example of this. 10: Wire bonder tool, 12: Conical shape,
13, 14, 15: Plane slope, 16: Curved surface, θ 1
: cone angle, θ 2 : angle.
Claims (1)
ールにおいて、前記先端部の一部を前記円錐角度
より小さな角度の平面または曲面に形成したこと
を特徴とするワイヤボンダ用ツール。 A wire bonder tool having a conical tip, characterized in that a part of the tip is formed into a flat or curved surface with an angle smaller than the conical angle.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985107730U JPH0219966Y2 (en) | 1985-07-15 | 1985-07-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985107730U JPH0219966Y2 (en) | 1985-07-15 | 1985-07-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6217127U true JPS6217127U (en) | 1987-02-02 |
JPH0219966Y2 JPH0219966Y2 (en) | 1990-05-31 |
Family
ID=30984278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985107730U Expired JPH0219966Y2 (en) | 1985-07-15 | 1985-07-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0219966Y2 (en) |
-
1985
- 1985-07-15 JP JP1985107730U patent/JPH0219966Y2/ja not_active Expired
Non-Patent Citations (1)
Title |
---|
GAISER TOOL COMPANYªfj|h´=1984 * |
Also Published As
Publication number | Publication date |
---|---|
JPH0219966Y2 (en) | 1990-05-31 |