JPS62170633U - - Google Patents
Info
- Publication number
- JPS62170633U JPS62170633U JP1986058811U JP5881186U JPS62170633U JP S62170633 U JPS62170633 U JP S62170633U JP 1986058811 U JP1986058811 U JP 1986058811U JP 5881186 U JP5881186 U JP 5881186U JP S62170633 U JPS62170633 U JP S62170633U
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- electrode
- semiconductor chip
- semiconductor device
- mounting board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/07251—
-
- H10W72/20—
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- H10W90/724—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986058811U JPS62170633U (enExample) | 1986-04-21 | 1986-04-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986058811U JPS62170633U (enExample) | 1986-04-21 | 1986-04-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62170633U true JPS62170633U (enExample) | 1987-10-29 |
Family
ID=30889718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986058811U Pending JPS62170633U (enExample) | 1986-04-21 | 1986-04-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62170633U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62281343A (ja) * | 1986-05-29 | 1987-12-07 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置 |
| JP2012156374A (ja) * | 2011-01-27 | 2012-08-16 | Fujitsu Ltd | 基板の接続構造、基板セット、光センサアレイ装置及び基板を接続する方法 |
-
1986
- 1986-04-21 JP JP1986058811U patent/JPS62170633U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62281343A (ja) * | 1986-05-29 | 1987-12-07 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置 |
| JP2012156374A (ja) * | 2011-01-27 | 2012-08-16 | Fujitsu Ltd | 基板の接続構造、基板セット、光センサアレイ装置及び基板を接続する方法 |