JPH0242787U - - Google Patents
Info
- Publication number
- JPH0242787U JPH0242787U JP1988122993U JP12299388U JPH0242787U JP H0242787 U JPH0242787 U JP H0242787U JP 1988122993 U JP1988122993 U JP 1988122993U JP 12299388 U JP12299388 U JP 12299388U JP H0242787 U JPH0242787 U JP H0242787U
- Authority
- JP
- Japan
- Prior art keywords
- solder material
- melting point
- view
- point solder
- showing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
-
- H10W72/073—
-
- H10W72/381—
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988122993U JPH0242787U (enExample) | 1988-09-19 | 1988-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988122993U JPH0242787U (enExample) | 1988-09-19 | 1988-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242787U true JPH0242787U (enExample) | 1990-03-23 |
Family
ID=31371439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988122993U Pending JPH0242787U (enExample) | 1988-09-19 | 1988-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242787U (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007109834A (ja) * | 2005-10-13 | 2007-04-26 | Fuji Electric Holdings Co Ltd | 半導体装置およびその製造方法 |
| JP2008137034A (ja) * | 2006-11-30 | 2008-06-19 | Honda Motor Co Ltd | ろう材およびろう付け方法 |
| JP2008181939A (ja) * | 2007-01-23 | 2008-08-07 | Mitsubishi Materials Corp | パワーモジュール用基板の製造方法およびパワーモジュール用基板並びにパワーモジュール |
| JP2008277335A (ja) * | 2007-04-25 | 2008-11-13 | Fuji Electric Device Technology Co Ltd | 半導体装置およびその製造方法 |
-
1988
- 1988-09-19 JP JP1988122993U patent/JPH0242787U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007109834A (ja) * | 2005-10-13 | 2007-04-26 | Fuji Electric Holdings Co Ltd | 半導体装置およびその製造方法 |
| JP2008137034A (ja) * | 2006-11-30 | 2008-06-19 | Honda Motor Co Ltd | ろう材およびろう付け方法 |
| JP2008181939A (ja) * | 2007-01-23 | 2008-08-07 | Mitsubishi Materials Corp | パワーモジュール用基板の製造方法およびパワーモジュール用基板並びにパワーモジュール |
| JP2008277335A (ja) * | 2007-04-25 | 2008-11-13 | Fuji Electric Device Technology Co Ltd | 半導体装置およびその製造方法 |