JPS62160540U - - Google Patents

Info

Publication number
JPS62160540U
JPS62160540U JP1986048043U JP4804386U JPS62160540U JP S62160540 U JPS62160540 U JP S62160540U JP 1986048043 U JP1986048043 U JP 1986048043U JP 4804386 U JP4804386 U JP 4804386U JP S62160540 U JPS62160540 U JP S62160540U
Authority
JP
Japan
Prior art keywords
semiconductor element
circuit board
bumps
mounting structure
chip mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986048043U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986048043U priority Critical patent/JPS62160540U/ja
Publication of JPS62160540U publication Critical patent/JPS62160540U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/877—
    • H10W90/724—

Landscapes

  • Wire Bonding (AREA)
JP1986048043U 1986-04-02 1986-04-02 Pending JPS62160540U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986048043U JPS62160540U (enExample) 1986-04-02 1986-04-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986048043U JPS62160540U (enExample) 1986-04-02 1986-04-02

Publications (1)

Publication Number Publication Date
JPS62160540U true JPS62160540U (enExample) 1987-10-13

Family

ID=30869209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986048043U Pending JPS62160540U (enExample) 1986-04-02 1986-04-02

Country Status (1)

Country Link
JP (1) JPS62160540U (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08107164A (ja) * 1994-10-06 1996-04-23 Nec Corp 半導体装置
JP2017050374A (ja) * 2015-09-01 2017-03-09 ローム株式会社 パワーモジュール、パワーモジュールの放熱構造、およびパワーモジュールの接合方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08107164A (ja) * 1994-10-06 1996-04-23 Nec Corp 半導体装置
JP2017050374A (ja) * 2015-09-01 2017-03-09 ローム株式会社 パワーモジュール、パワーモジュールの放熱構造、およびパワーモジュールの接合方法
WO2017038460A1 (ja) * 2015-09-01 2017-03-09 ローム株式会社 パワーモジュール、パワーモジュールの放熱構造、およびパワーモジュールの接合方法
US10485139B2 (en) 2015-09-01 2019-11-19 Rohm Co., Ltd. Power module, thermal dissipation structure of the power module and contact method of the power module

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