JPS62164757A - 導電性回路を形成する方法 - Google Patents
導電性回路を形成する方法Info
- Publication number
- JPS62164757A JPS62164757A JP593786A JP593786A JPS62164757A JP S62164757 A JPS62164757 A JP S62164757A JP 593786 A JP593786 A JP 593786A JP 593786 A JP593786 A JP 593786A JP S62164757 A JPS62164757 A JP S62164757A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- component
- solvent
- silver powder
- conductive composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims description 13
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000003822 epoxy resin Substances 0.000 claims abstract description 9
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 9
- 239000002904 solvent Substances 0.000 claims abstract description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 4
- 239000002075 main ingredient Substances 0.000 claims 1
- 239000011230 binding agent Substances 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- 229920000877 Melamine resin Polymers 0.000 abstract description 3
- 239000004640 Melamine resin Substances 0.000 abstract description 3
- 229920001807 Urea-formaldehyde Polymers 0.000 abstract description 3
- 239000012948 isocyanate Substances 0.000 abstract description 3
- 150000002513 isocyanates Chemical class 0.000 abstract description 3
- 239000005011 phenolic resin Substances 0.000 abstract description 3
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 abstract description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 2
- 239000003607 modifier Substances 0.000 abstract description 2
- 239000002245 particle Substances 0.000 abstract description 2
- 229920001568 phenolic resin Polymers 0.000 abstract description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 abstract 1
- 238000004132 cross linking Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 14
- 238000012360 testing method Methods 0.000 description 12
- JYGXADMDTFJGBT-VWUMJDOOSA-N hydrocortisone Chemical compound O=C1CC[C@]2(C)[C@H]3[C@@H](O)C[C@](C)([C@@](CC4)(O)C(=O)CO)[C@@H]4[C@@H]3CCC2=C1 JYGXADMDTFJGBT-VWUMJDOOSA-N 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP593786A JPS62164757A (ja) | 1986-01-14 | 1986-01-14 | 導電性回路を形成する方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP593786A JPS62164757A (ja) | 1986-01-14 | 1986-01-14 | 導電性回路を形成する方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62164757A true JPS62164757A (ja) | 1987-07-21 |
| JPH0339536B2 JPH0339536B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-06-14 |
Family
ID=11624810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP593786A Granted JPS62164757A (ja) | 1986-01-14 | 1986-01-14 | 導電性回路を形成する方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62164757A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994010697A1 (en) * | 1992-11-04 | 1994-05-11 | E.I. Du Pont De Nemours And Company | Electrically conductive resin pastes and multilayer ceramic capacitors having a terminal electrode comprised of the same |
| JP2015168825A (ja) * | 2014-03-04 | 2015-09-28 | ヘレウス プレシャス メタルズ ノース アメリカ コンショホーケン エルエルシー | はんだ付け可能な導電性ポリマー厚膜組成物 |
| US10287442B2 (en) | 2011-12-13 | 2019-05-14 | Heraeus Precious Metals North America Conshohocken Llc | Electrically conductive polymeric compositions, contacts, assemblies, and methods |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60170658A (ja) * | 1984-02-15 | 1985-09-04 | Toshiba Chem Corp | 導電性ペ−スト |
-
1986
- 1986-01-14 JP JP593786A patent/JPS62164757A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60170658A (ja) * | 1984-02-15 | 1985-09-04 | Toshiba Chem Corp | 導電性ペ−スト |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994010697A1 (en) * | 1992-11-04 | 1994-05-11 | E.I. Du Pont De Nemours And Company | Electrically conductive resin pastes and multilayer ceramic capacitors having a terminal electrode comprised of the same |
| US10287442B2 (en) | 2011-12-13 | 2019-05-14 | Heraeus Precious Metals North America Conshohocken Llc | Electrically conductive polymeric compositions, contacts, assemblies, and methods |
| JP2015168825A (ja) * | 2014-03-04 | 2015-09-28 | ヘレウス プレシャス メタルズ ノース アメリカ コンショホーケン エルエルシー | はんだ付け可能な導電性ポリマー厚膜組成物 |
| CN105176174A (zh) * | 2014-03-04 | 2015-12-23 | 赫劳斯贵金属北美康舍霍肯有限责任公司 | 可焊接导电聚合物厚膜组合物 |
| US9986650B2 (en) | 2014-03-04 | 2018-05-29 | Heracus Precious Metals North America Conshohocken LLC | Solderable conductive polymer thick film composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0339536B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-06-14 |