JPS62163349A - Chip carrier for electronic element - Google Patents

Abstract

PURPOSE:To improve the reliability of the electrical connection of an electronic part chip and a printed wiring board by a method wherein a recessed section is formed to one-side surface of a laminated board, a plating acceptor containing materials is applied in said recessed section, a plating acceptor is exposed to the inner surface of said recessed section, and an exposed surface is plated to shape a plating layer. CONSTITUTION:A recessed section is formed to one-side surface of a laminated board, in which a required number of resin impregnated base materials impregnated with a woven fabric, a nonwoven fabric, a mat or paper consisting of an inorganic fiber, such as glass, asbestos, etc. an organic synthetic fiber such as acryl or a naturals fiber such as cotton or these combination base material are superposed and metallic foils are stacked, laminated and molded on the upper surface and/or lower surface of the resin impregnated base materials, or a metal-base laminated board in which one part of the resin impregnated base materials is replaced with a metallic plate. Resin paste, resin varnish, etc. containing a plating acceptor, such as palladium, gold, silver, copper, etc. are applied into said recessed section, the plating acceptor is exposed to the inner surface of the recessed section through mechanical treatment, chemical treatment by chromic acid, etc., ultraviolet treatment previously making anthraquinone, etc., be contained as a photosensitizer, etc., and an exposed surface is electroless-plated or the upper section of the exposed surface is electroplated, thus forming a plating layer.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a chip carrier for electronic devices used as a mounting substrate for electronic devices such as IC packages.

[Background technology]

BACKGROUND ART Electronic devices such as IC packages are manufactured by packaging an electronic component chip such as a semicircular chip attached to a lead frame and sealed with resin or airtight. And in such electronic devices,
With the increase in the number of terminals t, attempts have been made to use a printed wiring board instead of a lead frame as a carrier for supporting electronic component chips, but the reliability of the electrical connection between the electronic component chip and the printed wiring board is low. Problems frequently occurred during wire bonding and die bonding.

[Object of the Invention] An object of the present invention is to provide a chip carrier for an electronic device that has excellent electrical connection reliability between an electronic component chip and a printed wiring board.

[Disclosure of the invention]

In the present invention, a recess is provided on one surface of an 81-layer board, and after coating a material containing a plating receptive substance in the recess, the plating receptive substance is exposed on the inner surface of the recess, and a coating is applied to the exposed surface to form a plating layer. The present invention will be described in detail below.The present invention will be described in detail below.

In the laminate according to the present invention, resins for the laminate include phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone, polybutylene resin, etc. Polyesters, modified products, and combinations of sinter terephthalate, polyether ether ketone, fluoride, etc. are used, as well as inorganic fibers such as glass, smooth, polyester, polyamide, polyvinyl alcohol, and acrylic. Layer the required number of resin-impregnated base materials impregnated with woven fabrics, non-woven fabrics, mats, paper, or combinations of these materials made from natural fibers such as organic synthetic fibers, cotton, etc., and then Laminated Ti made by layering metal foil on the top and/or bottom surface
→ Create a recess on one side surface of the gold circle base @layer board by replacing a part of the plate or resin-impregnated base material with a metal plate, by any means such as counterboring or drilling, and then inside the recess ((palladium, After applying a resin paste, resin face, etc. that contains plating receptors such as gold, silver, copper, etc., it is treated with sulfuric acid, chemical treatment with chromic acid, etc., and pre-sensitized with titanium oxide, anthraquinone, etc. A plating receptor pipe is exposed on the inner surface of the concave part by ultraviolet treatment, etc., and the exposed surface is electroless plated or further 1C plating is applied on top of it to form a gold layer to form a chip carrier for electronic devices. This is what you get.

The present invention will be explained below based on the first implementation.

Example: Glass cloth with a thickness of 0.2 mm was coated with epoxy resin varnish and the amount of resin was 45! A laminate was prepared by placing 8 sheets of the grease-resistant impregnated base vr obtained by impregnating and drying it so that M % (denoted as JJ Shimotaru) and then placing copper foil with a thickness of 35 microns on the bottom surface of each layer. Molding pressure sor: yi, 90 minutes at 17nC 1
A glass cloth base epoxy resin laminate with a thickness of 1.6 fl was obtained by molding, and then a recess with a depth Q of 7 M was provided at the required position of the laminate by counterboring, and the inside of the recess was 1 cm 0.1 cm. %
Palladium chloride-containing nitrile rubber modified epoxy (base)
After applying the fat paste, palladium chloride was exposed on the inner surface of the recess by chromic acid treatment, and then the exposed surface was plated to form copper plating to obtain a chip carrier for a single element.

Comparative Example A laminate consisting of 8 sheets of prepreg A stacked together, each with a 35 micron thick copper foil on the bottom surface, was molded under a molding pressure of 5.
0'v'd, laminated at 170℃ for 90 minutes to a thickness of 1
．． A 6fl glass cloth base epoxy resin laminate was obtained. First, a recess with a depth of 0.7M was provided by counterboring the laminate at the desired position, and the inner surface of the recess was subjected to a normal through-hole plating process.
A copper plating layer was formed by applying and activating a plating core to obtain a chip carrier for an electronic device.

〔Effect of the invention〕

The results of wire-bonding and die-bonding of semi-intrusive chips to the chip carriers for electronic devices of Examples and Comparative Examples are as shown in Table 1. As is clear from Table 1, the performance of the present invention was good;
It was confirmed that the chip carrier for electronic devices of the present invention is excellent.

Claims (1)

[Claims] (1) A recess is provided on one surface of the laminate, a material containing a plating receptive substance is applied inside the recess, the plating receptive substance is exposed on the inner surface of the recess, and the exposed surface is plated to form a plating layer. A chip carrier for electronic devices featuring: