JP3644045B2 - Manufacturing method of multilayer electronic component mounting substrate - Google Patents

Description

[0001]
[Industrial application fields]
The present invention does not generate the outflow fiber in the adhesive, it is possible to reliably bond the bonding wire to the bonding pad, a method of manufacturing a multilayer electronic component mounting board for wire bonding.
[0002]
[Prior art]
[0003]
[Problems to be solved]
Conventionally, as a multilayer electronic component mounting substrate, for example, as shown in FIG. 7, a multilayer plate 99 in which insulating substrates 91 and 92 are laminated, and a concave electronic component mounting portion 95 provided on the multilayer plate 99, Some have
The multilayer board 99 is laminated and pressure-bonded with an adhesive 90 interposed between insulating substrates 91 and 92.
The adhesive material 90 includes a base material 900 and prepregs 901 and 902 that are coated on the front side surface and the back side surface.
[0004]
A wiring circuit 5 having a bonding pad 53 is provided on the front side surface of the insulating substrate 92. The bonding pad 53 is exposed from the electronic component mounting portion 95.
A resin sealing frame 913 is provided on the front side surface of the insulating substrate 91.
The electronic component mounting portion 95 includes through holes 915 and 905 formed in the insulating substrate 91 and the adhesive material 90, and a recess 925 formed in the insulating substrate 92 below the electronic substrate mounting portion 95. The concave portion 925 has a smaller diameter than the openings 915 and 905.
[0005]
Next, a method for manufacturing the multilayer electronic component mounting board will be described.
First, as shown in FIG. 8A, a substrate 900 having a thickness of about 0.1 mm in which a fiber 906 is impregnated with a resin is prepared.
Next, as shown in FIG. 8B, prepregs 901 and 902 are laminated on the front side surface and the back side surface of the substrate 900, respectively. The prepregs 901 and 902 are sheets having a thickness of about 60 μm, in which fibers 906 are impregnated with resin. Next, these are temporarily bonded at a low temperature to obtain an adhesive 90.
Next, as shown in FIG. 8C, a through hole 905 is formed in the adhesive 90 using the end mill 65.
[0006]
Next, as shown in FIG. 9, a through hole 915 is formed in the insulating substrate 91 serving as an upper layer plate. On the other hand, the wiring circuit 5 having the bonding pads 53 is formed on the insulating substrate 92 serving as the lower layer plate, and the recess 925 is formed.
Next, the insulating substrates 91 and 92 are laminated on the front and back sides of the adhesive 90, respectively. Next, the insulating substrate 92, the adhesive 90, and the insulating substrate 91 are aligned so that the through holes 905 and 915 are positioned above the recess 925. Next, these are thermocompression bonded to produce a multilayer board 99.
Next, a resin sealing frame 913 is bonded to the front side surface of the multilayer board 99. Thereby, the multilayer electronic component mounting substrate 9 shown in FIG. 7 is obtained.
[0007]
The electronic component 3 is mounted on the bottom surface of the electronic component mounting portion 95 of the multilayer electronic component mounting substrate 9. The pad portion 31 of the electronic component 3 and the bonding pad 53 of the wiring circuit 5 are bonded to each other by wire bonding using a capillary, and both are electrically connected.
[0008]
[Problems to be solved]
However, the multilayer electronic component mounting board according to the conventional example has the following problems.
That is, as shown in FIG. 8C, when the through hole 905 is drilled in the adhesive 90 by the end mill 65, the fiber 906 impregnated in the prepregs 901 and 902 becomes a burr, and the wall of the through hole 905 is formed. Remains.
[0009]
Therefore, when the adhesive 90 is interposed between the insulating substrate 91 and the insulating substrate 92 and thermocompression bonded, the fibers 906 in the prepregs 901 and 902 flow out to the wall surface of the through hole 905 together with the softened resin of the prepreg. Come.
As shown in FIG. 10, the outflow fiber 909 may cover a part of the upper portion of the bonding pad 53 on the insulating substrate 92. Therefore, when bonding the wire 30 between the pad portion 31 on the electronic component 3 and the bonding pad 53 on the insulating substrate 92, wire bonding by the capillary 63 is hindered. Therefore, there is a possibility that a bonding failure may occur between the wire 30 and the bonding pad 53.
[0010]
SUMMARY OF THE INVENTION In view of such conventional problems, there is no occurrence of the outflow fiber in the adhesive, it is possible to reliably bond the bonding wire to the bonding pad, and to provide a method for manufacturing a multilayer electronic component mounting board To do.
[0011]
[Means for solving problems]
The present invention is made by providing a through hole in the electronic component mounting portion formed with formed by coating without adhesive resin each having a glass cloth on the front surface and back surface of the substrate made of a glass cloth and resin, also the adhesive An adhesive material producing step for producing an adhesive material that is semi-cured by heating before the through hole is drilled ;
A substrate manufacturing process for manufacturing an upper layer plate having a through hole for forming an electronic component mounting portion and a lower layer plate provided with a wiring circuit having a bonding pad;
A laminating step of forming a laminate by interposing the adhesive between the upper layer plate and the lower layer plate;
A multilayer electronic device for wire bonding, comprising: a thermocompression bonding step of thermocompression bonding the laminated plate at a temperature and pressure at which the adhesive resin in the adhesive is melted and one of the substrates is not melted. There is a method for manufacturing a component mounting board.
[0012]
In the present invention, the adhesive comprises a base material made of glass cloth and resin, and an adhesive resin without glass cloth coated on the front and back sides.
As the adhesive resin, it is preferable to use one or more synthetic resins selected from the group of bismaleimide triazine resin, epoxy resin, and polyimide resin.
[0013]
The base material is made of glass cloth impregnated with a resin, and the same insulating substrate used for the upper and lower layers is used. In other words, an insulating substrate without a copper foil layer is used. As the substrate, it is preferable to use one or more selected from the group consisting of a glass epoxy substrate, a glass polyimide substrate, and a glass bismaleimide triazine substrate.
[0014]
The adhesive material constitutes an integrated multilayer board together with the upper and lower layers laminated and pressed on top and bottom.
The upper layer plate and the adhesive are provided with through holes for forming an electronic component mounting portion that penetrate the upper layer plate and the adhesive.
A wiring circuit having bonding pads is provided on the front side surface of the lower layer plate. A plurality of upper and lower layers can be used.
[0015]
In the electronic component mounting portion, the bonding pads are exposed from the front side surface of the lower layer plate. The bonding pad is wire bonded to an electronic component mounted on the bottom surface of the electronic component mounting portion using a capillary or the like.
A resin sealing frame may be provided on the upper layer plate of the upper layer plate.
As the upper layer plate and the lower layer plate, for example, an insulating substrate such as a glass epoxy substrate, a glass polyimide substrate, or a glass bismaleimide triazine substrate is used.
[0017]
Hereinafter, the manufacturing method will be described in detail.
(1) Adhesive material production process First, an adhesive material is prepared by coating the front side surface and the back side surface of the base material with an adhesive resin, and a through hole for forming an electronic component mounting portion is formed in the adhesive material. .
It is preferable to use the aforementioned materials for the base material and the adhesive resin.
In general, the thickness of the substrate is preferably 25 to 500 μm.
[0018]
The through hole can be drilled after the adhesive resin is coated on the substrate. The through hole may be formed before the adhesive resin is coated on the substrate.
The adhesive resin for covering the front surface and back surface of the substrate is in prior to drilling through-holes in the adhesive, that is semi-cured by heating. Thereby, the through hole can be formed with high accuracy.
[0019]
(2) Substrate manufacturing step Next, an upper layer plate having a through hole for forming an electronic component mounting portion and a lower layer plate provided with a wiring circuit having a bonding pad are manufactured.
The wiring circuit having the bonding pad is formed at least on the front side surface of the lower layer plate. The wiring circuit can be formed not only on the front side surface of the lower layer board but also on the upper layer board.
The upper layer plate and the lower layer plate are one or more insulating substrates. For example, a glass epoxy substrate, a glass polyimide substrate, a glass bismaleimide triazine substrate, or the like is used.
[0020]
(3) Laminating step Next, a laminated plate is formed by interposing the adhesive between the upper layer plate and the lower layer plate.
At this time, the lower layer plate, the adhesive material, and the upper layer plate are aligned so that the bonding pads formed on the lower layer plate are exposed from the through holes of the adhesive material and the upper layer plate.
[0021]
(4) Thermocompression bonding process Next, the laminated board is thermocompression bonded to obtain a multilayer board.
This thermocompression bonding is performed at a temperature and pressure at which the adhesive resin in the adhesive melts while the substrate does not melt.
After the thermocompression bonding step, a wiring circuit can be formed on the outer surface of the multilayer board. Moreover, a resin sealing frame, a heat radiating plate, etc. can be provided in a multilayer board.
As a result, the multilayer electronic component mounting board can be obtained.
[0022]
[Action and effect]
Oite this onset bright, adhesive material, the more a substrate, an adhesive resin coating the front surface and back surface of the substrate. The adhesive resin is made of resin only and does not contain fibers. Therefore, as will be described later, no outflow fiber is generated during thermocompression bonding. Therefore, it is possible to obtain a multilayer electronic component mounting substrate in which the wire and the bonding pad are securely bonded.
[0023]
Next, in the method for manufacturing a multilayer electronic component mounting substrate according to the present invention, the adhesive is provided with an adhesive resin on the front side surface and the back side surface of the base material.
Since the adhesive resin is made of resin only and does not contain fibers, the fiber does not flow out from the adhesive resin to the electronic component mounting portion at the time of thermocompression bonding. Therefore, it does not hinder wire bonding with capillaries. Therefore, the wire can be reliably bonded to the bonding pad.
[0024]
Moreover, the fiber in the base material of the adhesive does not flow out during the thermocompression bonding. This is because these fibers have a cloth shape and do not easily come out of the cloth, and are not pulled out by the softening resin during thermocompression bonding.
Note that the resin in the adhesive resin elutes somewhat to the electronic component mounting portion, but since the amount is small, there is no problem of hindering the wire bonding.
[0025]
As described above, according to the present invention, there is no occurrence of the outflow fiber in the adhesive, it is possible to reliably bond the bonding wire to the bonding pad, is to provide a method for manufacturing a multilayer electronic component mounting board it can.
[0026]
【Example】
Example 1
A multilayer electronic component mounting board according to an embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 1, the multilayer electronic component mounting substrate of this example is composed of a multilayer plate 79 in which an upper layer plate 71 and a lower layer plate 72 are laminated with an adhesive 1 interposed therebetween and then pressure-bonded.
The multilayer board 79 has an electronic component mounting portion 75 that penetrates the upper layer board 71 and the adhesive 1.
In the electronic component mounting portion 75, the bonding pad 53 provided on the lower layer plate 72 is exposed.
[0027]
The adhesive 1 has a through hole 15 for forming an electronic component mounting portion. The adhesive 1 includes a base material 10 and adhesive resins 11 and 12 coated on the front side surface and the back side surface.
Epoxy resin is used as the adhesive resins 11 and 12.
The base material 10 is a glass epoxy substrate in which a glass fiber cloth 106 as a reinforcing material is impregnated with an epoxy resin.
[0028]
The upper layer plate 71 has a through hole 715 for forming an electronic component mounting portion.
The lower layer plate 72 has a recess 725 having a smaller diameter than the through hole 715 and the wiring circuit 5 having the bonding pad 53.
As the upper layer plate 71 and the lower layer plate 72, for example, an insulating substrate such as a glass epoxy substrate is used.
A resin sealing frame 713 is provided on the multilayer board 79.
[0029]
In the multilayer electronic component mounting substrate 70 of this example, as shown in FIG. 5, the pad 31 of the electronic component 3 mounted on the bottom surface of the electronic component mounting portion 75 is bonded to the bonding pad 53 and the wire bonding using the capillary 63. Is done. The pad 31 and the bonding pad 53 are electrically connected by the wire 30.
[0030]
Next, a method for manufacturing the multilayer electronic component mounting board 70 will be described with reference to FIGS.
(1) Adhesive Material Production Step First, as shown in FIG. 2, a base material 10 (thickness 100 μm) made of glass epoxy resin and adhesive resins 11 and 12 (thickness 25 μm) made of epoxy resin are prepared.
[0031]
Next, the surface treatment agent 101 is applied to the front side surface and the back side surface of the base material 10 in which the glass fiber cloth 106 is impregnated with the epoxy resin (FIG. 2A). Next, the rolling resin 61 is used to coat the adhesive resin 101 on the front and back sides of the substrate 10 (FIG. 2B).
Next, the base material 10 and the adhesive resin 101 are heated at a temperature of 100 ° C., and the adhesive resin 101 is semi-cured to produce the adhesive 1 (FIG. 2C). Next, using the end mill 65, the through hole 15 for forming the electronic component mounting portion is formed in the adhesive 1 (FIG. 2D).
[0032]
(2) Substrate manufacturing process Next, an upper layer plate 71 and a lower layer plate 72 are manufactured.
That is, a through hole 715 for forming an electronic component mounting portion is formed in the insulating substrate 7 to produce the upper layer plate 71. The through hole 715 is approximately the same as the diameter of the through hole 15 of the adhesive 1.
[0033]
Further, the recess 715 having a smaller diameter than the through hole 725 and the wiring circuit 5 having the bonding pad 53 are formed on the insulating substrate 7 to produce the lower layer plate 72. The recess 715 is made smaller than the diameter of the through hole 15 of the adhesive 1.
As the insulating substrate 7, a glass epoxy resin is used.
[0034]
(3) Laminating Step Next, as shown in FIG. 3, a laminated plate 78 is formed by interposing the adhesive 1 between the upper layer plate 71 and the lower layer plate 72.
At this time, the lower layer plate 72, the adhesive material 1, and the upper layer plate 71 are positioned so that the bonding pad 53 formed on the lower layer plate 72 is exposed from the through holes 15 and 715 of the adhesive material 1 and the upper layer plate 71. Match.
[0035]
(4) Thermocompression bonding step Next, as shown in FIG.
Thereafter, a resin sealing frame is bonded to the front side surface of the multilayer board 79 to obtain the multilayer electronic component mounting substrate 70 shown in FIG.
[0036]
Next, the function and effect of this example will be described.
In the multilayer electronic component mounting substrate 70 of this example, the adhesive 1 is composed of a base material 10 and adhesive resins 11 and 12 covering the front and back sides of the base material 10 as shown in FIG. . The adhesive resins 11 and 12 are made of resin only and do not contain fibers. Therefore, as will be described later, no outflow fiber is generated during thermocompression bonding. Therefore, the multilayer electronic component mounting substrate 70 in which the wire 30 and the bonding pad 53 are securely bonded can be obtained.
[0037]
Next, in the multilayer electronic component mounting substrate 70 of this example, the adhesive 1 is provided with only the adhesive resins 11 and 12 on the front side surface and the back side surface of the base material 10.
Since the adhesive resins 11 and 12 are made of resin only and do not contain fibers, the fibers do not flow out from the adhesive resin to the electronic component mounting portion 75 at the time of thermocompression bonding.
Therefore, as shown in FIG. 5, the wire bonding by the capillary 63 is not hindered. Therefore, as shown in FIG. 1, the wire 30 can be reliably bonded to the bonding pad 53.
[0038]
Further, during the thermocompression bonding, the fibers of the glass fiber cloth 106 in the substrate 10 do not flow out. This is because these fibers are in the form of a cloth and do not easily come out of the cloth and are not pulled out by being pulled by the softening resin during thermocompression bonding.
Note that the amount of resin in the adhesive resins 11 and 12 eluting to the electronic component mounting portion 75 is small, so that the problem of hindering the wire bonding does not occur.
[0039]
Further, the adhesive resins 11 and 12 covering the front side surface and the back side surface of the base material 10 are semi-cured by heating before the through holes 15 are formed in the adhesive material 1. Therefore, the through hole 15 can be drilled with high accuracy.
[0040]
Example 2
In the multilayer electronic component mounting substrate of this example, as shown in FIG. 6, through holes 105, 115, and 125 are formed in the base material 10 and the adhesive resins 11 and 12, respectively. And the resin 11 and 12 for adhesion | attachment are each coat | covered on the back side.
[0041]
That is, the surface treatment agent 101 is applied to each of the front side surface and the back side surface of the base material 10 in the adhesive preparation process. Next, a through hole 105 is formed in the base material 10 using the end mill 65 (FIG. 6A).
Further, through holes 115 and 125 are provided in the adhesive resins 11 and 12 by a punching method (FIG. 6B).
[0042]
Next, using the rolling roller 61, the adhesive resin 101 is coated on the front side surface and the back side surface of the substrate 10 (FIG. 2C).
Thereby, the adhesive material 1 which has the through-hole 15 for electronic component mounting part formation is obtained (FIG.2 (d)).
Others are the same as in the first embodiment.
[0043]
In this example, since the through holes 105, 115, and 125 are provided in the base material 10 and the adhesive resins 11 and 12 in advance, and these are joined thereafter, the effect of controlling the outflow of the resin can be obtained. . In addition, the same effects as those of the first embodiment can be obtained.
[Brief description of the drawings]
1 is a cross-sectional view of a multilayer electronic component mounting board according to Embodiment 1;
FIG. 2 is an explanatory view showing an adhesive material manufacturing process according to the method for manufacturing a multilayer electronic component mounting board of Example 1. FIG.
FIG. 3 is an explanatory diagram illustrating a substrate manufacturing process and a stacking process following FIG. 2;
FIG. 4 is an explanatory view showing a thermocompression bonding process following FIG. 3;
FIG. 5 is an explanatory view showing the function and effect of the first embodiment.
6 is an explanatory view showing a method for manufacturing a multilayer electronic component mounting board of Example 2. FIG.
FIG. 7 is a cross-sectional view of a conventional multilayer electronic component mounting board.
FIG. 8 is an explanatory view showing a conventional method for manufacturing a multilayer electronic component mounting board.
FIG. 9 is a manufacturing process explanatory diagram subsequent to FIG. 8;
FIG. 10 is an explanatory diagram showing problems of a conventional example.
[Explanation of symbols]
1. . . Adhesive,
10. . . Base material,
11,12. . . Adhesive resin,
3. . . Electronic components,
5. . . Wiring circuit,
53. . . Bonding pads,
63. . . Capillary,
65. . . End mill,
7). . . Insulating substrate,
70. . . Multi-layer electronic component mounting board,
705, 715. . . Through hole,
71. . . Upper layer,
72. . . Lower plate,
75. . . Electronic component mounting part,
79. . . Multilayer board,

Claims (5)

The front and back sides of the substrate made of glass cloth and resin are respectively coated with an adhesive resin without glass cloth and provided with through holes for forming an electronic component mounting portion. An adhesive preparation process for producing an adhesive that is semi-cured by heating before the through-hole is drilled ;
A substrate manufacturing process for manufacturing an upper layer plate having a through hole for forming an electronic component mounting portion and a lower layer plate provided with a wiring circuit having a bonding pad;
A laminating step of forming a laminate by interposing the adhesive between the upper layer plate and the lower layer plate;
A multilayer electronic device for wire bonding, comprising: a thermocompression bonding step of thermocompression bonding the laminated plate at a temperature and pressure at which the adhesive resin in the adhesive is melted and one of the substrates is not melted A method for manufacturing a component mounting board. 2. The method of manufacturing a substrate for mounting a multilayer electronic component for wire bonding according to claim 1, wherein the through hole of the adhesive is formed after the base material is coated with an adhesive resin. 2. The method of manufacturing a substrate for mounting a multilayer electronic component for wire bonding according to claim 1, wherein the through hole of the base material in the adhesive is formed before the adhesive resin is coated on the base material. The wire according to any one of claims 1 to 3, wherein the substrate is one or more selected from the group consisting of a glass epoxy substrate, a glass polyimide resin, and a glass bismaleimide triazine resin. A method of manufacturing a multilayer electronic component mounting substrate for bonding . 4. The adhesive resin according to claim 1, wherein the adhesive resin is one or more synthetic resins selected from the group of bismaleimide triazine resin, epoxy resin, and polyimide resin. A method of manufacturing a substrate for mounting a multilayer electronic component for wire bonding .

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