JPH0428152B2 - - Google Patents
Info
- Publication number
- JPH0428152B2 JPH0428152B2 JP61236585A JP23658586A JPH0428152B2 JP H0428152 B2 JPH0428152 B2 JP H0428152B2 JP 61236585 A JP61236585 A JP 61236585A JP 23658586 A JP23658586 A JP 23658586A JP H0428152 B2 JPH0428152 B2 JP H0428152B2
- Authority
- JP
- Japan
- Prior art keywords
- recess
- light
- resin layer
- emitting element
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 5
- 239000011521 glass Substances 0.000 abstract description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052737 gold Inorganic materials 0.000 abstract description 4
- 239000010931 gold Substances 0.000 abstract description 4
- 238000005530 etching Methods 0.000 abstract description 3
- 239000004744 fabric Substances 0.000 abstract description 3
- 229910000976 Electrical steel Inorganic materials 0.000 abstract description 2
- 239000011889 copper foil Substances 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- 238000005553 drilling Methods 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- -1 sheets Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
Abstract
Description
【発明の詳細な説明】
本発明は電気機器、電子機器、計算機器、通信
機器等に用いられる金属ベース配線板に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a metal-based wiring board used in electrical equipment, electronic equipment, computing equipment, communication equipment, and the like.
従来の表示用配線板は平面状配線板の上に形成
した回路パターンに発光素子を実装しているた
め、発光素子の光が配線板面に対し垂直方向に集
光されず180度方向に散乱するので見掛上の輝度
が向上しない欠点があつた。
Conventional display wiring boards have light emitting elements mounted on a circuit pattern formed on a flat wiring board, so the light from the light emitting elements is not focused perpendicular to the wiring board surface but is scattered in a 180 degree direction. Therefore, there was a drawback that the apparent brightness was not improved.
本発明の目的とするところは集光効果の高い金
属ベース配線板を提供することにある。
An object of the present invention is to provide a metal-based wiring board with a high light-concentrating effect.
〔発明の開示〕
本発明は金属板の上面及び又は下面に樹脂層を
介して、回路パターンを有する金属ベース配線基
板の樹脂層所要位置に、凹所を形成し該凹部表面
に金属層を形成後、発光素子を実装したことを特
徴とする金属ベース配線板のため、発光素子の光
が配線板面に対し垂直方向に集光されるため集光
効果を著しく向上せしめることができたもので、
以下本発明を詳細に説明する。[Disclosure of the Invention] The present invention involves forming recesses at desired positions in the resin layer of a metal base wiring board having a circuit pattern through a resin layer on the upper and/or lower surfaces of a metal plate, and forming a metal layer on the surface of the recess. Later, because it was a metal-based wiring board with a light emitting element mounted on it, the light from the light emitting element was focused in a direction perpendicular to the wiring board surface, which significantly improved the light gathering effect. ,
The present invention will be explained in detail below.
本発明に用いる金属板としてはアルミニウム、
銅、鉄、ニツケル、亜鉛等の単独、合金等からな
る金属板全般を用いることができる。樹脂層とし
てはフエノール樹脂、クレゾール樹脂、エポキシ
樹脂、不飽和ポリエステル樹脂、メラミン樹脂、
ポリイミド、ポリブタジエン、ポリアミド、ポリ
アミドイミド、ポリスルフオン、ポリブチレンテ
レフタレート、ポリエーテルエーテルケトン、弗
化樹脂等の単独、変性物、混合物等を塗布した樹
脂層や樹脂シート、樹脂フイルム或はこれらの樹
脂ワニスをガラス、アスベスト等の無機繊維やポ
リエステル、ポリアミド、ポリビニルアルコー
ル、アクリル等の有機合成繊維や木綿等の天然繊
維からなる織布、不織布、マツト或は紙又はこれ
らの組合せ基材等に含浸、乾燥させた樹脂含浸基
材を用いることができるが、好ましくは樹脂含浸
基材を用いることが樹脂層の厚み精度を向上させ
ることができるので望ましいことである。回路パ
ターンとしては銅、アルミニウム、鉄、ニツケ
ル、亜鉛等の単独、合金等からなる金属箔や更に
必要に応じて接着剤層を設けた金属箔からエツチ
ング等で形成されたものである。かくして得られ
た金属ベース配線基板の樹脂層所要位置に凹部を
形成するが凹部形状は三日月状等の半円形凹部で
あることがより集光効果が大きく望ましいことで
ある。又、凹部表面には金、ニツケル、銀、クロ
ム、銅等の金属層を形成するが好ましくは金、ク
ロム、銀、ニツケル等の光反射効率のよい金属層
を鍍金等で形成することがより集光効果が大とな
り望ましいことである。発光素子の実装はワイヤ
ボンデイング、ダイボンドペースト等による常法
で行なうことができる。 The metal plate used in the present invention is aluminum,
Any metal plate made of copper, iron, nickel, zinc, etc. alone or an alloy can be used. The resin layer includes phenol resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin,
Resin layers, sheets, resin films, or resin varnishes coated with polyimide, polybutadiene, polyamide, polyamideimide, polysulfone, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc. alone, modified products, or mixtures. It is impregnated into woven fabric, non-woven fabric, matte, paper, or a combination of these materials made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, and acrylic, and natural fibers such as cotton, and dried. Although a resin-impregnated base material can be used, it is preferable to use a resin-impregnated base material because the thickness accuracy of the resin layer can be improved. The circuit pattern is formed by etching or the like from a metal foil made of copper, aluminum, iron, nickel, zinc, etc. alone or an alloy, or a metal foil provided with an adhesive layer if necessary. Recesses are formed at desired positions in the resin layer of the thus obtained metal base wiring board, and it is preferable that the recesses have a semicircular recess shape, such as a crescent shape, for a greater light-condensing effect. Further, a metal layer of gold, nickel, silver, chromium, copper, etc. is formed on the surface of the recess, but it is more preferable to form a metal layer of gold, chromium, silver, nickel, etc. with high light reflection efficiency by plating or the like. This is desirable because the light condensing effect becomes large. The light emitting element can be mounted using conventional methods such as wire bonding and die bonding paste.
以下本発明を実施例にもとづいて説明する。 The present invention will be explained below based on examples.
実施例
第１図は本発明の一実施例を示す簡略断面図で
ある。第１図に示すように厚さ１mmの珪素鋼板１
の下面に厚さ0.1mmのエポキシ樹脂含浸ガラス布
３枚２を介して厚さ0.035mmの銅箔を載置した積
層体を成形圧力40Kg／cm2、165℃で60分間積層成
形して金属ベース配線基板を得、該基板にエツチ
ング等を施して回路パターン３を作成した。次に
回路パターンのない樹脂層に深さ0.2mmの半円形
凹部４をドリルで設けた後、半円形凹部表面に金
鍍金５を形成してから発光素子６をダイボンドペ
ースト７、ワイヤボンデング８で実装して金属ベ
ース配線板を得た。Embodiment FIG. 1 is a simplified sectional view showing an embodiment of the present invention. As shown in Figure 1, a silicon steel plate 1 with a thickness of 1 mm
A laminate in which copper foil with a thickness of 0.035 mm was placed on the bottom surface of the glass cloth through three sheets of epoxy resin-impregnated glass cloth 2 with a thickness of 0.1 mm was laminated and molded at a molding pressure of 40 Kg/cm 2 at 165°C for 60 minutes. A base wiring board was obtained, and a circuit pattern 3 was created by etching or the like on the board. Next, a semicircular recess 4 with a depth of 0.2 mm is provided in the resin layer without a circuit pattern using a drill, and then gold plating 5 is formed on the surface of the semicircular recess, and the light emitting element 6 is attached using die bonding paste 7 and wire bonding 8. A metal base wiring board was obtained.
比較例
実施例と同じ回路パターンを有する金属ベース
配線基板表面に発光素子をそのままダイボンドペ
ースト、ワイヤボンデイングで実装して金属ベー
ス配線板を得た。Comparative Example A metal base wiring board was obtained by directly mounting a light emitting element on the surface of a metal base wiring board having the same circuit pattern as in the example using die bond paste and wire bonding.
実施例の金属ベース配線板の発光素子の光は従
来例のものより50％集光効果がよく、本発明の金
属ベース配線板の優れていることを確認した。
The light condensing effect of the light-emitting elements of the metal-based wiring board of the example was 50% better than that of the conventional example, confirming the superiority of the metal-based wiring board of the present invention.
第１図は本発明の一実施例を示す簡略断面図で
ある。
１は金属板、２は樹脂層、３は回路パターン、
４は凹部、５は凹部の金属層、６は発光素子、７
はダイボンドペースト、８はワイヤボンデイング
である。
FIG. 1 is a simplified sectional view showing one embodiment of the present invention. 1 is a metal plate, 2 is a resin layer, 3 is a circuit pattern,
4 is a recessed part, 5 is a metal layer in the recessed part, 6 is a light emitting element, 7
8 is die bonding paste, and 8 is wire bonding.
Claims (1)
て、回路パターンを有する金属ベース配線基板の
樹脂層所要位置に、凹部を形成し該凹部表面に金
属層を形成後、発光素子を実装したことを特徴と
する金属ベース配線板。 ２ 樹脂層が樹脂含浸基材であることを特徴とす
る特許請求の範囲第１項記載の金属ベース配線
板。 ３ 凹部が半円形凹部であることを特徴とする特
許請求の範囲第１項、第２項記載の金属ベース配
線板。[Scope of Claims] 1. After forming a recess at a desired position in the resin layer of a metal base wiring board having a circuit pattern through a resin layer on the upper and/or lower surface of a metal plate, and forming a metal layer on the surface of the recess, A metal-based wiring board characterized by mounting a light-emitting element. 2. The metal base wiring board according to claim 1, wherein the resin layer is a resin-impregnated base material. 3. The metal base wiring board according to claim 1 or 2, wherein the recess is a semicircular recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61236585A JPS6390870A (en) | 1986-10-03 | 1986-10-03 | Metallic base circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61236585A JPS6390870A (en) | 1986-10-03 | 1986-10-03 | Metallic base circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6390870A JPS6390870A (en) | 1988-04-21 |
| JPH0428152B2 true JPH0428152B2 (en) | 1992-05-13 |
Family
ID=17002812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61236585A Granted JPS6390870A (en) | 1986-10-03 | 1986-10-03 | Metallic base circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6390870A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1601768A (en) * | 2003-09-22 | 2005-03-30 | 福建省苍乐电子企业有限公司 | LED structure |
| JP2006237156A (en) * | 2005-02-23 | 2006-09-07 | Lg Electronics Inc | Light source equipment and manufacturing method thereof |
-
1986
- 1986-10-03 JP JP61236585A patent/JPS6390870A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6390870A (en) | 1988-04-21 |
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