JPS62162531A - Manufacture of metallic base laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for producing metal-based laminates used in electrical equipment, electronic equipment, computers, communication equipment, etc.

[Background technology]

Conventionally, metal-based bond laminated sheets are obtained by bonding metal plates and metal foils, and during processing, holes are drilled at desired locations, resin is poured into the holes, and then the center of the resin layer filled in the holes is Although the surface metal foil layer and the metal plate are electrically connected by reopening the holes and plating the holes, there is a problem in that smears and minute quacks frequently occur when the resin layer is opened.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a metal-based laminate that does not generate smear or micro-pockets when holes are formed in the resin layer.

[Disclosure of the invention]

The present invention is characterized in that a laminate is formed by laminating and heating forming a laminate in which metal foil is disposed on the upper and/or lower surfaces of metal plates via a resin-impregnated base material containing a highly thermally conductive insulator and a coupling agent. Since the base is a 111M plate, the heat generated during drilling etc. can be easily dissipated during processing, preventing smearing, and is resistant to mechanical shock and thermal shock generated during drilling etc. Therefore, cracks can be prevented. Furthermore, since the coupling agent can prevent agglomeration of the highly thermally conductive insulator, performance buffing and appearance of the laminate can be improved.The present invention will be described in detail below.

Metal plates used in the present invention include aluminum plates, iron plates,
Brass plates, stainless steel plates, nickel plates, steel plates can be used alone or in combination, and there are no particular limitations.

Alternatively, by using a metal plate with holes drilled in predetermined positions as the metal plate, the resin containing a highly thermally conductive insulator in the resin-impregnated base material can flow into and fill the holes during laminated heat molding. be.

In this case, the effect of preventing the occurrence of smear and the occurrence of smearing during opening of the resin layer becomes even greater. As the resin layer, pheno-/
L' resin, creso/L/resin, epoxy resin, unsaturated polyether lv resin, melamine resin, polyimide, polygetadiene, polyamide, polyamideimide, polysulfone, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc. alone; Alumina, magnesium oxide, boron oxide treated magnesium oxide, silica, beryllium oxide, dino-L oxide for resins such as modified products and mixtures.
A resin phenol containing a highly thermally conductive insulator such as /mnium and a coupling agent such as a silane coupling agent, a titanate coupling agent, or a silcoa μ laminate yarn coupling agent. aiii
M fiber, polyester, polyamide, polyvinyl alcohol
If necessary, one or more resin-impregnated base materials are impregnated into woven fabrics, non-woven fabrics, mats, or paper made of organic synthetic fibers such as μ, acrylic fibers, natural fibers such as cotton, or combinations thereof, and then dried. Multiple sheets are used. As the metal foil, a metal foil of copper, aluminum, iron, stainless steel, nickel, brass, etc., provided with an adhesive layer as required, is used.

The present invention will be explained below based on t-Example.

Example ' 0.1 m thick boron oxide treated magnesium oxide TL-25% by weight and a diy core μ laminate coupling agent were applied to the top and bottom surfaces of an aluminum plate with a thickness of 1.0jEI with holes drilled at the required positions, respectively. A laminate in which a 5-micron-thick copper foil was placed between two glass cloths impregnated with epoxy resin containing 0.1% by weight was laminated and heated at a molding pressure of 40ψ-1160'C for ω minutes to form a metal base laminate. Got the board.

Comparative Example A laminate in which copper foil with a thickness of 5 microns was placed on the upper and lower surfaces of a 1.0 m thick aluminum plate with holes drilled at the required positions, respectively, through a 0.1 m thick epoxy resin-impregnated goose cloth. A metal base laminate was obtained by lamination and heat molding at a molding pressure of 40 kg at 160° C. for 2 minutes.

〔Effect of the invention〕

As is clear from Table 1, the appearance of the metal-based laminates and the results of drilling the resin-filled parts of the metal-based laminates of Examples and Comparative Examples show that the performance of the metal-based laminates of the present invention is good, and the metal-based bond laminates of the present invention are superior. It was confirmed.

Chapter 1 Table

Claims (3)

[Claims] (1) A metal characterized by laminating and heating forming a laminate in which metal foil is arranged on the upper and/or lower surfaces of metal plates via a resin-impregnated base material containing a highly thermally conductive insulator and a coupling agent. Method of manufacturing base laminate. (2) The method for producing a metal base laminate according to claim 1, wherein the highly thermally conductive insulator is magnesium oxide treated with boron oxide. (3) The method for producing a metal-based laminate according to claim 1, wherein the coupling agent is a zircoaluminate-based coupling agent.