JPS62208940A - Manufacture of metallic-base laminated board - Google Patents
Manufacture of metallic-base laminated boardInfo
- Publication number
- JPS62208940A JPS62208940A JP5201386A JP5201386A JPS62208940A JP S62208940 A JPS62208940 A JP S62208940A JP 5201386 A JP5201386 A JP 5201386A JP 5201386 A JP5201386 A JP 5201386A JP S62208940 A JPS62208940 A JP S62208940A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- metal
- layer
- holes
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 229920005989 resin Polymers 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 27
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 239000004744 fabric Substances 0.000 claims description 10
- 239000011888 foil Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 11
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- -1 polybutylene terephthalate Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000012209 synthetic fiber Substances 0.000 description 2
- 229920002994 synthetic fiber Polymers 0.000 description 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
本発明は電気機器、成子機器、計算機％通伽機器等に用
すられる金属ベースｆｉｉ１層板の製造方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing a metal base FII single-layer board used for electrical equipment, commercial equipment, computer equipment, etc.
従来、金属ベース積層板は金属板と金属箔を接着して得
られるもので、加工に際しては所要位置を開穴し穴部に
液状樹脂を流し込み次いで穴部に充填された樹脂層の中
心部を再開穴し鍍金処理等で表面金属箔層と金属板とを
導通させてｂるが、樹脂層の開穴に際してスミア、微小
クラック及び板反りの発生が多発する問題があった。Conventionally, metal base laminates are obtained by bonding metal plates and metal foils, and during processing, holes are drilled at desired locations, liquid resin is poured into the holes, and then the center of the resin layer filled in the holes is Although the surface metal foil layer and the metal plate are made conductive by reopening the holes and performing plating treatment, etc., there is a problem in that smears, microcracks, and plate warping occur frequently when holes are opened in the resin layer.
本発明の目的とするところは、樹脂層の開穴に際してス
ミア、微小クラック及び板反りの発生しない金属ベース
積Ｉ−板を提供することにある。An object of the present invention is to provide a metal-based I-plate that does not cause smearing, microcracks, or board warping when holes are formed in the resin layer.
本発明は貫通穴を有する金属板の片面に、布基材離型層
を介して樹脂層を重ね、加熱加圧によって＆ｌ脂層の樹
脂を金属板貫通穴に充填後、離型層、樹脂ｌ―を除去し
、つ論で樹脂充填穴を有する金属板の上面及び又は下面
に僧脂層を介して金属箔を配設した積層体を加熱加圧す
ることを特徴とする金属ベース積層板の製造方法のため
、穴部に充填する樹脂をスミア−発生、微小クラックの
発生しやすめ液状樹脂に限定されることがなく、スミア
−発生、微小クラック発生のな−樹脂を充填することが
できるようになったもので、以下本発明の詳細な説明す
る。In the present invention, a resin layer is stacked on one side of a metal plate having a through hole through a cloth base mold release layer, and after filling the metal plate through hole with the resin of the &l fat layer by heating and pressurizing, the mold release layer and the resin A metal base laminate, which is characterized by removing l- and heating and pressing a laminate in which metal foil is arranged on the upper and/or lower surfaces of a metal plate having resin-filled holes via a resin layer. Due to the manufacturing method, the resin used to fill the holes is not limited to liquid resin, which tends to cause smearing and microcracks, and can be filled with resin that does not cause smearing and microcracks. The present invention will now be described in detail.
本発明に用−る金属板としてはアルミニウム板、鉄板、
眞鍮板、ステンレス鋼板、二重ケル板。Metal plates used in the present invention include aluminum plates, iron plates,
Brass plate, stainless steel plate, double kel plate.
銅板の嵐独１合金、組合せ等を用いることができ、予じ
め所要位置を開穴したものである。布基材離型層として
はガラス布、フッ化樹脂布、綿等等のような無機繊維、
合成繊維、天然繊維等の朧独、合撚、合糸からなる布基
材凰独或は上記布基材に樹脂を含浸、ｔ！！布したもの
である。樹脂層としてはフェノール樹脂、クレゾール樹
脂、エポキシ樹脂、不飽和ポリエステル樹脂、メラミン
樹脂、ポリイミド、ポリブタジェン、ポリアミド、ポリ
アミドイミド、ポリスルフォン、ポリブ千しンテレフタ
レート、ポリエーテルエーテルケトン、弗化樹脂等の瓜
独、変性物、混合物等の樹脂塗布層。Arashi Germany 1 alloy of copper plates, combinations, etc. can be used, and holes are pre-drilled at the required positions. As the cloth base material release layer, inorganic fibers such as glass cloth, fluorinated resin cloth, cotton, etc.
A cloth base material made of synthetic fibers, natural fibers, etc., which are made of synthetic fibers, natural fibers, etc. ! It is clothed. The resin layer may be made of phenol resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc. Resin coating layer of German, modified products, mixtures, etc.
樹脂フィルム、樹脂含浸基材等が用すられるが好ましく
は樹脂含浸基材が厚み粘度の点でよく望ましす、又、必
要に応じて樹脂にアルミナ、酸化マグネシウム、酸化ホ
ウ素処理酸化マグネシウム、シリカ、酸化ベリリウム、
酸化ジルコニウム等の高熱伝導性絶縁物を添加すること
ができる。金属箔としては銅、アルミニウム、鉄、ステ
ンレス鋼、二りケル、眞鍮等の金、ａ箔に必要に応じて
接着剤層を設けたものを甲いるものである。Resin films, resin-impregnated base materials, etc. are used, but resin-impregnated base materials are preferred in terms of thickness and viscosity.Also, if necessary, alumina, magnesium oxide, boron oxide-treated magnesium oxide, silica, etc. can be used in the resin. , beryllium oxide,
Highly thermally conductive insulators such as zirconium oxide can be added. Examples of the metal foil include copper, aluminum, iron, stainless steel, gold such as Nikeru, brass, etc., and A-foil provided with an adhesive layer if necessary.
以下本発明を実施例に基づｂで説明する。The present invention will be explained below based on Examples.
実施例
所要位置に貫通穴を設けた厚さ１．Ｏｆｆのアルミニウ
ム板の片面に、厚さＱ、１５１ｆｆのガラス布を介して
厚さ０．２ｆｌのエポキシ樹脂含浸ガラス２枚を重ね、
成形圧力４ＱＫｑ／ｄ 、１６５℃で６０分間加熱加圧
することによってアルミニウム板開穴部にエポキシ樹脂
を充填後、ガラス布、エポキシ樹脂含浸ガラス布２枚を
除去し、ついで上記開穴部にエポキシ樹脂を充填したア
ルミニウム板の上、下［］Ｋ夫々厚さ０．１ｆｉ のエ
ポキシ樹脂含浸ガラス布２枚づつを介して厚さ０．０３
５ｔｌの銅箔を配設した積層体を成形圧力４ｏＫｑ／ｄ
、 １６５℃で６０分間加熱加圧して金属ベース積層
板を得た。Example Thickness with through holes provided at required positions 1. Two sheets of epoxy resin-impregnated glass with a thickness of Q and 151 ff are placed on one side of the aluminum plate with a thickness of 0.2 fl, and
After filling the holes in the aluminum plate with epoxy resin by heating and pressurizing at 165°C for 60 minutes at a molding pressure of 4QKq/d, the glass cloth and two sheets of epoxy resin-impregnated glass cloth were removed, and then the epoxy resin was filled into the holes. The upper and lower parts of the aluminum plate filled with
A laminate with 5 tl of copper foil was molded at a pressure of 4 oKq/d.
A metal base laminate was obtained by heating and pressing at 165° C. for 60 minutes.
比較例
所要位置に貫通穴を設けた淳さ１．ＯＭのアルミニウム
板の開穴部に液状エポキシ樹脂（松下電工株式会社製、
品番ＣＶ５０１１６）を充填後９０℃で１５０分間加熱
硬化させてから、該アルミニウム板の上、下面に夫々厚
さ０．１８のエポキシ樹脂含浸ガラス布２枚づつを介し
て厚さＱ、１１３５ｆｌの銅箔を配設した積層体を成形
圧力４ＱＫｑ／ｄ 、１６５℃で６０分間加熱加圧して
金部ベース積層板を得た。Comparative example: Junsa with through holes provided at required positions 1. Liquid epoxy resin (manufactured by Matsushita Electric Works Co., Ltd.,
After filling with epoxy resin-impregnated glass cloth (product number CV50116) and curing it by heating at 90°C for 150 minutes, copper of thickness Q and 1135 fl was placed on the upper and lower surfaces of the aluminum plate through two pieces of epoxy resin-impregnated glass cloth with a thickness of 0.18, respectively. The laminate provided with the foil was heated and pressed at 165° C. for 60 minutes at a molding pressure of 4QKq/d to obtain a metal base laminate.
実施例及び比較例の金属ベース積層板の板反り及び樹脂
充填部をドリル加工した結果は第１表で明白なように本
発明の本のの性能はよく、本発明の金属ベース積層板の
優れてＡることを確認した。As is clear from Table 1, the results of drilling the warped and resin-filled parts of the metal-based laminates of Examples and Comparative Examples show that the performance of the present invention is good, and the superiority of the metal-based laminates of the present invention is clearly shown in Table 1. It was confirmed that A.
第１表Table 1
Claims (2)
介して樹脂層を重ね、加熱加圧によって樹脂層の樹脂を
金属板貫通穴に充填後、離型層、樹脂層を除去し、つい
で樹脂充填穴を有する金属板の上面及び又は下面に樹脂
層を介して金属箔を配設した積層体を加熱加圧すること
を特徴とする金属ベース積層板の製造方法。(1) Layer a resin layer on one side of a metal plate having through-holes via a cloth-based mold release layer, fill the metal plate through-holes with the resin of the resin layer by heating and pressurizing, and then remove the mold release layer and the resin layer. 1. A method for producing a metal base laminate, the method comprising: removing the laminate, and then heating and pressurizing a laminate in which metal foil is disposed on the upper and/or lower surfaces of the metal plate having resin-filled holes via a resin layer.
許請求の範囲第１項記載の金属ベース積層板の製造方法
。(2) The method for manufacturing a metal base laminate according to claim 1, wherein the resin layer is a resin-impregnated base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5201386A JPS62208940A (en) | 1986-03-10 | 1986-03-10 | Manufacture of metallic-base laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5201386A JPS62208940A (en) | 1986-03-10 | 1986-03-10 | Manufacture of metallic-base laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62208940A true JPS62208940A (en) | 1987-09-14 |
Family
ID=12902935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5201386A Pending JPS62208940A (en) | 1986-03-10 | 1986-03-10 | Manufacture of metallic-base laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62208940A (en) |
-
1986
- 1986-03-10 JP JP5201386A patent/JPS62208940A/en active Pending
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