JPS6216209B2 - - Google Patents
Info
- Publication number
- JPS6216209B2 JPS6216209B2 JP10808982A JP10808982A JPS6216209B2 JP S6216209 B2 JPS6216209 B2 JP S6216209B2 JP 10808982 A JP10808982 A JP 10808982A JP 10808982 A JP10808982 A JP 10808982A JP S6216209 B2 JPS6216209 B2 JP S6216209B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- varnish
- weight
- parts
- alcohol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 8
- 239000011134 resol-type phenolic resin Substances 0.000 claims description 5
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 2
- 239000002966 varnish Substances 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 238000001035 drying Methods 0.000 description 10
- 239000011342 resin composition Substances 0.000 description 10
- 239000003507 refrigerant Substances 0.000 description 7
- 239000005011 phenolic resin Substances 0.000 description 5
- MSXVEPNJUHWQHW-UHFFFAOYSA-N 2-methylbutan-2-ol Chemical compound CCC(C)(C)O MSXVEPNJUHWQHW-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 4
- 239000008096 xylene Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 150000003138 primary alcohols Chemical class 0.000 description 3
- 150000003333 secondary alcohols Chemical class 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 229920003987 resole Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000012043 crude product Substances 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10808982A JPS58225119A (ja) | 1982-06-23 | 1982-06-23 | 含浸用電気絶縁樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10808982A JPS58225119A (ja) | 1982-06-23 | 1982-06-23 | 含浸用電気絶縁樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58225119A JPS58225119A (ja) | 1983-12-27 |
| JPS6216209B2 true JPS6216209B2 (cg-RX-API-DMAC7.html) | 1987-04-11 |
Family
ID=14475588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10808982A Granted JPS58225119A (ja) | 1982-06-23 | 1982-06-23 | 含浸用電気絶縁樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58225119A (cg-RX-API-DMAC7.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3412095A1 (de) * | 1984-03-31 | 1985-10-17 | Hoechst Ag, 6230 Frankfurt | Mischung zur herstellung von saeurefesten dichtungen und impraegnierungen, verfahren zu ihrer herstellung sowie ihre verwendung |
-
1982
- 1982-06-23 JP JP10808982A patent/JPS58225119A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58225119A (ja) | 1983-12-27 |
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