JPS62157157U - - Google Patents
Info
- Publication number
- JPS62157157U JPS62157157U JP2944386U JP2944386U JPS62157157U JP S62157157 U JPS62157157 U JP S62157157U JP 2944386 U JP2944386 U JP 2944386U JP 2944386 U JP2944386 U JP 2944386U JP S62157157 U JPS62157157 U JP S62157157U
- Authority
- JP
- Japan
- Prior art keywords
- utility
- model registration
- heat dissipation
- electronic component
- dissipation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ａはこの考案が適用されるモールド型ト
ランジスタの外観斜視図、同図ｂはその側面図、
第２図〜第４図は本案で用いられる放熱体の外観
斜視図、第５図〜第７図は従来用いられていたパ
ツケージ構造を持つトランジスタの斜視図である
。
１０……トランジスタ（部品）、１０ａ……本
体、１２……雄ネジ、２０，３０，４０……放熱
体、２１，３２，４２……雌ネジ。
FIG. 1a is an external perspective view of a molded transistor to which this invention is applied, and FIG. 1b is a side view thereof.
FIGS. 2 to 4 are external perspective views of a heat sink used in the present invention, and FIGS. 5 to 7 are perspective views of a conventional transistor having a package structure. 10... Transistor (component), 10a... Main body, 12... Male screw, 20, 30, 40... Heat sink, 21, 32, 42... Female screw.
Claims (1)
面に雄ネジを螺設したことを特徴とする電子部品
の放熱構造。 (2) 内周面に雌ネジを形成した筒状部を有する
放熱体を前記部品に着脱可能に螺着するようにし
たことを特徴とする実用新案登録請求の範囲第(1
)項に記載の電子部品の放熱構造。[Scope of Claim for Utility Model Registration] (1) A heat dissipation structure for an electronic component characterized by having a male screw threaded onto the surface of the main body of the electronic component molded with a resin mold. (2) Utility model registration claim No. (1) characterized in that a heat radiator having a cylindrical part with a female thread formed on the inner peripheral surface is removably screwed onto the part.
) The heat dissipation structure of electronic components described in section 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2944386U JPS62157157U (en) | 1986-02-28 | 1986-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2944386U JPS62157157U (en) | 1986-02-28 | 1986-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62157157U true JPS62157157U (en) | 1987-10-06 |
Family
ID=30833327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2944386U Pending JPS62157157U (en) | 1986-02-28 | 1986-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62157157U (en) |
-
1986
- 1986-02-28 JP JP2944386U patent/JPS62157157U/ja active Pending
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