JPS62154751A - Positioning apparatus for semiconductor chip - Google Patents

Abstract

PURPOSE:To facilitate correction in positioning and to make it possible to alleviate stress applied on a semiconductor chip, by switching a vacuum source, a compressing air source and a minute compressing air source, which are communicated to a small hole. CONSTITUTION:The position of a semiconductor chip 1 is corrected by pawls 3 in the multiple directions on a state 2 in a positioning apparatus. The upper surface of the stage and the lower surface of the semiconductor chip are sucked and separated by one or a plurality of small holes 5. For the small hole 5, the following parts are provided: a vacuum source 8 and a compressing air source 9, which yield vacuum for sucking the chip and air pressure for separating the chip; a minute compressing air source 10, which alignments the negative pressure after the vacuum sucking and provides minute positive pressure; and an air pressure system, which controls the vacuum and the compressing air of the vacuum source 8, the compressing air source 9 and the minute compressing air source 10. For example, when the semiconductor chip 1 is sucked to the upper surface of the stage 2, both a first solenoid valve 6 and a second solenoid valve 7 are turned OFF, the vacuum pressure in the small hole 5 is cut and the negative pressure yielded in the small hole 5 is eliminated. The minute compressing air is discharged out of the small hole 5.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application] The present invention relates to an apparatus for correcting the positioning of a semiconductor chip in a semiconductor device assembly process.

[Conventional technology]

A conventional semiconductor chip positioning device is shown schematically in FIG. In FIG. 6, (2) (i semiconductor chip (1)
Stage (3) is a claw for correcting the positioning of the loaded semiconductor chip (1).
) is attached with a fixed block (4) that serves as a reference for positioning, and a small hole (5) is drilled in the center of the stage (2) to attract and separate semiconductor chips ( 8
) is a vacuum source for vacuum adsorption, and (9) is a compressed air source for chip separation. (6) is a vacuum source (8) and a compressed air source (9)
The first solenoid valve performs all switching, and the sixth solenoid valve controls the on/off of the compressed air source.

The vacuum source (8) and the compressed air source (9) are piped to the stage (2) so that vacuum and compressed air are generated in the small hole (5).

Next, the operating pressure of the conventional device is shown in Figures 2 (a) and (b).
, (c). First, stage (2)
The semiconductor chip (1) that has been conveyed by the suction nozzle αυ to the top of the small hole (5) of the 17th lenoid valve (6
) is vacuum-adsorbed to the stage (2) (Figure 2 (
(see a)) Next, when the semiconductor chip (11) is attracted to the upper surface of the stage (2), both the first and sixth solenoid pulps (6) are attracted.

(Both 1 and 2 are turned off, and the vacuum pressure is cut.
(see figure fb)). Next, the positioning of the semiconductor chip (1) is corrected by the claws (3). This brings the transport suction collet 02 closer to the semiconductor chip (1). At the same time, the sixth solenoid valve a'jJ is turned on and compressed air is discharged from the small hole (5) to separate the semiconductor chip (]) from the stage (2). (See Figure (C)) [Problems to be Solved by the Invention] Since the conventional semiconductor chip positioning device is configured as described above, the semiconductor chip (1) is placed on the stage (2).
When loading the semiconductor chips into the small hole (5), when trying to correct the positioning of the semiconductor chip by cutting the vacuum pressure in the small hole (5), the small hole (5)
) The residual negative pressure within ) does not disappear, and as a result, the semiconductor chip gets caught in the p1 small hole, which makes it difficult to move, resulting in defective positioning correction.

Also, if the semiconductor chip is difficult to move and the load of the claws applied to the semiconductor chip is increased to correct the positioning,
There were some cases where stress was applied to the sides of the semiconductor chip.

This invention was made to solve the above-mentioned problems, and it eliminates the residual negative pressure inside the small hole that occurs after vacuum suction, and makes it easier to correct the positioning by turning it into a minute positive pressure. It is an object of the present invention to provide a positioning device that can reduce the stress applied to a semiconductor chip.

[Means for solving problems]

This invention is designed to switch between a vacuum source, a compressed air source, and a micro pressurized air source that communicate within the small hole.

[For production]

According to this invention, the residual negative pressure in the small hole generated after vacuum suction is maintained at a minute positive pressure by the minute pressure air source, making it easier to correct the positioning of the semiconductor chip.

[Embodiments of the invention]

An embodiment of the present invention will be described below. In FIG. 1, α1 is a micro-pressure air source for discharging micro-pressure air from a small hole (5) when positioning and correcting a semiconductor chip. <73 Fi, compressed air source (9) and micro compressed air source (1
◇Simplified operation diagram of the above semiconductor chip positioning device Complete Figure 2 (a)
, (d) + (c). The nine semiconductor chips (1) are transported by the suction nozzle (11) to the top of the small hole (5) of the stage (2), and then the first solenoid pulp (6)
) is vacuum-adsorbed to the stage (2) (Figure 2 (
a), (e)).

When the semiconductor chip (1) is attracted to the upper surface of the stage (2), the first solenoid pulp (6) and the second solenoid pulp (forces are both turned off. As a result, the small holes (5)
) is cut, and the residual negative pressure that had been generated in the small hole (5) is extinguished, and a minute pressured air is discharged from the small hole (5). The minute pressure air discharged through the small hole (5) can be moved smoothly to correct the positioning of the semiconductor chip without putting any stress on it. Furthermore, since the semiconductor chip is not caught by the small hole (5) etc., a sound effect is produced that the positioning can be easily and accurately corrected (see FIG. 2(d)). Next, after correcting the positioning of the semiconductor chip using the claws (3), the transport suction collet H is moved closer to the stage (2). Then, at the same time as applying the vacuum pressure of the suction collet a2, the second thread/id pulp (7) is fully turned on and compressed air is discharged from the small hole (5), thereby separating the semiconductor chips (Fig. 2 (c)
), see (f)).

〔Effect of the invention〕

As described above, according to the present invention, it is possible to improve positioning accuracy without adding 7 JU of stress to the semiconductor chip, and to obtain an apparatus in which positioning defects of the semiconductor chip are reduced.

[Brief explanation of drawings]

FIG. 1 is a model diagram showing a semiconductor chip positioning device according to an FM example of the present invention, and FIG. 2(a), (cl+
. (C) is a sectional view showing the operation of a semiconductor chip positioning device according to an embodiment of the present invention, and FIGS. 2(a) and 2(b)
). (C) is a cross-sectional view showing the operation of a conventional semiconductor chip positioning device, FIGS. In the figure, (1) is a semiconductor chip, (2) is a stage, and '(
3Hd claw, (4) is fixed block, (5) is small hole, (6
) is the first solenoid pulp for switching between the vacuum source and the compressed air source,
(The sword is the second solenoid pulp for switching between the pressure source and the micro pressure air source, (8) is the vacuum source, (9) is the pressure air source, uC is the micro pressure air source, 0υ is the suction nozzle, and the circle is the adsorption cholera for transportation), (
13) is the fifth inlay/id pulp for switching on/off the compressed air source. Note that the same reference numerals in each figure indicate corresponding parts. Agent Patent Attorney Tadashi Sato Year R Figure 10: Usuho Repulsion Source No. 2 (a) (b) 11: Wandering Notes (c)

Claims (1)

[Claims] (1) A positioning device that uses claws to correct the position of a saucer-shaped semiconductor chip on a stage from multiple directions, including one or more small holes that attract and separate the top surface of the stage and the bottom surface of the semiconductor chip; A vacuum source and a compressed air source that generate a vacuum for adsorption and air pressure for separation, a micro-pressure air source that eliminates the residual negative pressure after vacuum adsorption and creates a micro-positive pressure, and these vacuum sources, compressed air sources, and micro-pressure air sources. A semiconductor chip positioning device comprising: a pneumatic system for controlling vacuum and compressed air;