JPS59218750A - Method and device for separating pellet - Google Patents

Abstract

PURPOSE:To automatically and efficiently separate the pellets of a wafer by bending and separating the wafer semi-cut in both X and Y directions, and then bending and separating it in the other directions. CONSTITUTION:When a semi-cut wafer 1 which is disposed on an intermittent feeder of the first bending mechanism 10 is intermittently fed via a vacuum attracting conveying mechanism 20 to the first bending mechanism 10, the wafer is broken and separated into sole array pellet pieces. The wafer is then attracted and fixed to a lower retainer 3, and vacuum-attracted and conveyed at a pellet interval via an intermittent pitch feeding ain a perpendicular direction from this state. The wafer is bent in a perpendicular direction in the second bending mechanism 11, broken and individually separated, and mechanically contained into the prescribed jig 19 via a pellet retainer 15.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a pellet separation technique, and particularly to a pellet separation technique effective for separating a semiconductor wafer that has been cut in half in the X and Y directions into individual pieces.

[Background Art] Separation and individualization into individual pellets after cutting a semiconductor wafer in half after completing the pre-processing process is shown in FIGS. 1 to 3, for example.
As shown in the figure, a semiconductor wafer 1 is sandwiched between paper sheets 2 and fed intermittently at perenotopic intervals, and
Y) It is conceivable that after the sheet is broken in both directions by the bending mechanism 3 along the cutting groove la, it is sucked from the sheet 2 with a vacuum Vincent 5 or the like, picked up, and stored in a predetermined jig 6.

However, in this case, the position of the pellets on the sear 1-2 is not fixed and the aligned state is disrupted, so mechanization is not possible.

As another method, as shown in FIGS. 4 and 5, the semiconductor wafer 1 is pasted on the lower sheet as an adhesive tape 2', and the wafer I is attached from the upper surface via the rubber 7. ZVV was laid on the bottom surface of the adhesive tape 2' while applying pressure.
B2 After being bent and broken by using the step created by gradually pulling it, heating the entire adhesive tape on the bottom and stretching it in the vertical and horizontal (XY) directions, vacuum Bincera 1 ~
5, it may be possible to store it in a predetermined jig 6.

In this case, it is conceivable that the pellets of the wafer 1 be packed in an automatic jig in which a substantially aligned state is maintained.

However, in this case, in order to separate the pellet from the adhesive tape 2', the lower surface of the pellet is pushed up with the needle 9 through the adhesive tape 2', but even in this case, the adhesive state of the pellet is not constant, and the needle 9 is pushed up. There is a drawback that the timing of the adsorption is not properly adjusted, resulting in a mistake in adsorption of the beret. Furthermore, the inventors have discovered that there is a problem in that an extra adhesive sheet is required to maintain the aligned state, and extra work such as stretching is added.

[Object of the Invention] The object of the present invention is to remove individual pereno! of a wafer.・Minute δ1
An object of the present invention is to provide a pellet separation technology that can automatically and efficiently perform step 1.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the Invention] A brief overview of typical inventions disclosed in this application is as follows.

That is, when separating the wafer into pellets, the wafer, which has been cut in half in both the X and Y directions, is bent in one direction.
The above object is achieved by bending and separating in the other direction after the L is completed.

[Embodiment] FIG. 6 is a plan view of a pellet separation apparatus which is an embodiment of the present invention, and FIGS. 7 to 10 are partial sectional views of each processing mechanism thereof.

In this embodiment, the pellet separating device is constructed by connecting two folding mechanisms 10.11 and 10.11, as shown in FIG. A tool insertion mechanism 17 is arranged. In the first folding mechanism 10, the wafer 1 can be pinch fed to the folding position by, for example, a vacuum suction transport mechanism 20 at each pellet interval, and in synchronization with this, the half-cut upper part of the wafer 1 (
In this structure, the scribe region is broken and separated in one direction of the cutting groove 1a at the half cassotching portion, and a convoy-shaped pellet 7+- is formed.

At the bending and breaking part of the first bending mechanism 10, a tray 13 is provided for receiving pellets separated in a single row, and a 1M feeding path 1 that can be fixed by vacuum suction from the bottom surface when folding.
This is the structure of 2. The conveyance path 12 is capable of vacuum suctioning the conveyed object through the hole 12a, and
If necessary, air can be blown out from the hole 12a to also be used as a near-hair ring force type conveyance means for objects to be conveyed.

Incidentally, the object to be transported by IB may be transported by a device similar to the vacuum suction transport mechanism 20 described above.

There is a second folding mechanism 11 directly connected to the first folding mechanism 10 at a position that is a multiple of the pellet interval pitch. Second
The stand 15 for receiving the pellet after it is bent and broken by the bending mechanism 11 is also provided with a suction hole 16 at the lower part, and has a structure in which the broken pellet is suctioned and fixed.

Further, when the second bending mechanism 11 finishes bending and breaking, the suction nozzle 18 of the jig packing mechanism 17 transports each pellet on the table 15 to a predetermined suction jig 19.

Next, the operation of this embodiment will be explained.

When the half-cut upper wafer 1 placed in the intermittent feeding section of the first folding mechanism 10 is intermittently fed into the first folding mechanism 10 by the vacuum suction conveyance mechanism 20, it is broken and separated into single row pellet pieces, and the lower part The receiver is suction-fixed to the stand I3, and from this state, it is conveyed by vacuum suction in the perpendicular direction by intermittent pinch feeding at pellet intervals, and in the second bending mechanism 11, it is bent in the perpendicular direction to the above, broken, and separated into individual pieces. The pellet receiver is mechanically stored in a predetermined jig 19 from the stand 15.

As described above, according to this embodiment, it is possible to mechanically and efficiently separate and individualize half-cut sea urchins/S into pellets, store them in a predetermined jig, and process them without human intervention. This is also effective in preventing contamination during handling. According to this method, since an adhesive sheet is not required, it is clear that the one-band work that occurs in adhesion is also unnecessary.

[Effects] By using the two folding mechanisms in combination, pellet separation can be automatically and smoothly performed.

(2) Adhesive sheet 1 or tape is not required, and costs can be reduced.

Although the invention made by Akashi Kinoe has been specifically explained above based on examples, it goes without saying that the present invention is not limited to the above-mentioned examples and can be modified in various ways without departing from the gist thereof. do not have.

For example, in the present invention, the first and second bending mechanisms 1
By adding the shape detection signal of the pellet and the ink detection signal of the defective mark to 0.11, only good pellets can be stored in a predetermined jig.

[Brief explanation of drawings]

Figure 1 (al, (bl) is a plan view and front view of a half-cut wafer, Figures 2 and 3 are sectional views showing a possible Verent separation device, Figures 4 and 5 are other possible Verent separation devices. 11 is a sectional view showing the separation device, FIG. 6 is a plan view showing a pellet separation device which is an embodiment of the present invention, FIG. 7 is a sectional view of the first folding mechanism, and FIG. 8 is a wafer after bending and breaking. Figure 9 is a cross-sectional view of the Ill feeding section of the El1 row separated pellets, Figure 9 is an IJj plane view of the second folding mechanism, and Figure 10 is a cross-sectional view of the jig packing mechanism for separating pellets 7+ after bending and breaking. 1... Wafer, 10... First bending mechanism, 11
. . . second bending mechanism, 12 . . . vacuum suction conveyance mechanism, 13 .
The receiver is a stand vacuum suction hole, 15...The receiver for separated pellets is a stand, 1
6... cradle vacuum suction hole, 17... jig packing mechanism,
18... Suction nozzle, 19... Jig, 20... Vacuum suction conveyance mechanism. 22

Claims (1)

[Claims] ■ A method for separating a wafer into individual pellets,
A pellet separation method characterized by cutting a wafer in half in both the X and Y directions, then folding the wafer in one direction to separate it into rows, and then folding it in the other direction to separate it into individual pellets. 2. The pellet separation method according to claim 1, wherein the folding separation in one direction and the bending separation in the other direction are performed consistently and continuously. 3. In an apparatus for separating wafers into individual pellets,
a first folding means for folding and separating the wafers cut in half in both the X and Y directions in one direction with respect to the first transport direction; and a second transport for separating the wafers into rows by the first folding means. a conveyance means for conveying in the direction 1111;
a second wafer arranged at a predetermined angle with respect to the folding means for separating the row-separated wafers into individual pellets;
and a bending means. 4. The pellet separating device according to claim 3, wherein the first bending means and the second bending means are arranged at right angles to each other.