JPS59218750A - Method and device for separating pellet - Google Patents
Method and device for separating pelletInfo
- Publication number
- JPS59218750A JPS59218750A JP58092377A JP9237783A JPS59218750A JP S59218750 A JPS59218750 A JP S59218750A JP 58092377 A JP58092377 A JP 58092377A JP 9237783 A JP9237783 A JP 9237783A JP S59218750 A JPS59218750 A JP S59218750A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- pellet
- bending
- separating
- folding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
【発明の詳細な説明】
[技術分野]
本発明はペレット分離技術、特にXY方向に半切断され
た半導体ウェハを個々のベレソ1−に分離するのに有効
なペレット分離技術に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a pellet separation technique, and particularly to a pellet separation technique effective for separating a semiconductor wafer that has been cut in half in the X and Y directions into individual pieces.
[背景技術]
前工程処理を完了した半導体ウェハを半切断した後の個
々のペレットへの分離個別化は、たとえば第1図〜第3
図に示すように、半導体ウェハ1を紙シート2に挟み込
んだ状態でペレノトピノヂ間隔で間欠送りし、縦横(X
Y)両方向を切断溝laで折り曲げ機構3により破断
した後にシート2より真空ビンセント5等で吸着して拾
い上げ所定の治具6に収納することが考えられる。[Background Art] Separation and individualization into individual pellets after cutting a semiconductor wafer in half after completing the pre-processing process is shown in FIGS. 1 to 3, for example.
As shown in the figure, a semiconductor wafer 1 is sandwiched between paper sheets 2 and fed intermittently at perenotopic intervals, and
Y) It is conceivable that after the sheet is broken in both directions by the bending mechanism 3 along the cutting groove la, it is sucked from the sheet 2 with a vacuum Vincent 5 or the like, picked up, and stored in a predetermined jig 6.
しかし、この場合、シー1−2上のペレットの位置は固
定されていないため整列状態がくずれているので、機械
化ができない。However, in this case, the position of the pellets on the sear 1-2 is not fixed and the aligned state is disrupted, so mechanization is not possible.
また、別の方式としては、第4図と第5図に示すように
、下面のシートを接着テープ2′としてその上に半導体
ウェハ1を張り付は状態で、上面よりラバー7を介しウ
ェハIを加圧しつつ接着テープ2′下面に敷いたZVV
B2徐々に引いていくことにより生しる段差を利用して
折り曲げて破断した後、下面の接着テープ全体を加熱し
縦横(XY)方向に引き伸ばした後、真空ビンセラ1〜
5により所定の治具6に収納することが考えられる。As another method, as shown in FIGS. 4 and 5, the semiconductor wafer 1 is pasted on the lower sheet as an adhesive tape 2', and the wafer I is attached from the upper surface via the rubber 7. ZVV was laid on the bottom surface of the adhesive tape 2' while applying pressure.
B2 After being bent and broken by using the step created by gradually pulling it, heating the entire adhesive tape on the bottom and stretching it in the vertical and horizontal (XY) directions, vacuum Bincera 1 ~
5, it may be possible to store it in a predetermined jig 6.
また、ごの場合ウェハ1のペレットはほぼ整列状態が保
持されているだめの自動治具詰めを行うことが考えられ
る。In this case, it is conceivable that the pellets of the wafer 1 be packed in an automatic jig in which a substantially aligned state is maintained.
しかしながら、この場合接着テープ2′からペレットを
引き離すため、ペレットの下面を接着テープ2′を介し
て針9で突き上げているが、この場合でもペレットの接
着状態が一定せず、また針9の突き上げと吸着とのタイ
ミングの調整が邦しくベレッ1−の吸着ミスを生じる欠
点がある。さらに、整列状態を保持せしめるため余分な
粘着性シートを必要とし、かつ1これらの引き伸ばし等
の余分な作業が付加されるという問題があることが本発
明者により解明された。However, in this case, in order to separate the pellet from the adhesive tape 2', the lower surface of the pellet is pushed up with the needle 9 through the adhesive tape 2', but even in this case, the adhesive state of the pellet is not constant, and the needle 9 is pushed up. There is a drawback that the timing of the adsorption is not properly adjusted, resulting in a mistake in adsorption of the beret. Furthermore, the inventors have discovered that there is a problem in that an extra adhesive sheet is required to maintain the aligned state, and extra work such as stretching is added.
[発明の目的]
本発明の目的は、ウェハの個々のペレノ!・への分δ1
1を自動的に効率良く行うことのできるペレット分離技
術を提供することにある。[Object of the Invention] The object of the present invention is to remove individual pereno! of a wafer.・Minute δ1
An object of the present invention is to provide a pellet separation technology that can automatically and efficiently perform step 1.
本発明の前記ならびにその他の目的と新規な特徴は、本
明細書の記述および添付図面から明らかになるであろう
。The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.
[発明の概要]
本願において開示される発明のうち代表的なものの概要
を簡単に説明すれば、次の通りである。[Summary of the Invention] A brief overview of typical inventions disclosed in this application is as follows.
ずなわち、ウェハをペレットに分離する際に、XY両方
向に半切上されたウェハを一方向に折り曲げ分Mll
Lだ後、他方向に折り曲げ分離することにより、前記目
的を達成するものである。That is, when separating the wafer into pellets, the wafer, which has been cut in half in both the X and Y directions, is bent in one direction.
The above object is achieved by bending and separating in the other direction after the L is completed.
[実施例]
第6図は本発明の一実施例であるペレット分離装置の平
面図、第7図〜第10図はその各処理機構の部分断面図
である。[Embodiment] FIG. 6 is a plan view of a pellet separation apparatus which is an embodiment of the present invention, and FIGS. 7 to 10 are partial sectional views of each processing mechanism thereof.
本実施例においては、ペレット分離装置は、第6図の如
く、第Iおよび第2の折り曲げ機構10.11を2つ連
結して構成されており、さらにこの延長にこれと連動す
るペレットの治具挿入機構17が配置しである。第1の
折り曲げ機構10では、折り曲げ位置までウェハ1をた
とえば真空吸着搬送機構20によりペレット間隔毎にピ
ンチ送りでき、これと同期してウェハ1の半切上部分(
ハーフカソチング部分でスクライプ領域が切断溝1aの
一方向に破断分離され、車列状のペレ7+−が形成され
る構造である。In this embodiment, the pellet separating device is constructed by connecting two folding mechanisms 10.11 and 10.11, as shown in FIG. A tool insertion mechanism 17 is arranged. In the first folding mechanism 10, the wafer 1 can be pinch fed to the folding position by, for example, a vacuum suction transport mechanism 20 at each pellet interval, and in synchronization with this, the half-cut upper part of the wafer 1 (
In this structure, the scribe region is broken and separated in one direction of the cutting groove 1a at the half cassotching portion, and a convoy-shaped pellet 7+- is formed.
この第1折り曲げ機構10の折り曲げ破断部には、単列
分離されたペレット用の受は台13が設けてあり、折り
曲げ時に下面より真空吸着により固定できる1M送路1
2の構造としである。前記搬送路12は、孔12aを通
して真空吸着により被搬送物を真空吸着できると共に、
必;要に応して孔12aからエアを吹き出してニアヘア
リング力式の被搬送物の搬送手段としても利用すること
かできるようになっている。At the bending and breaking part of the first bending mechanism 10, a tray 13 is provided for receiving pellets separated in a single row, and a 1M feeding path 1 that can be fixed by vacuum suction from the bottom surface when folding.
This is the structure of 2. The conveyance path 12 is capable of vacuum suctioning the conveyed object through the hole 12a, and
If necessary, air can be blown out from the hole 12a to also be used as a near-hair ring force type conveyance means for objects to be conveyed.
なお、被IB送物は前述した真空吸着搬送機構20と同
様なもので搬送できるようにしてもよい。Incidentally, the object to be transported by IB may be transported by a device similar to the vacuum suction transport mechanism 20 described above.
前記第1の折り曲げ機構10に直結してペレット間隔ピ
ッチの倍数位置に第2の折り曲げ機構11がある。第2
の折り曲げ機構11の折り曲げ破断後のペレット単体の
受は台15は同じく下部に吸着孔16が設けてあり、破
断ペレットが吸着固定される構造となっている。There is a second folding mechanism 11 directly connected to the first folding mechanism 10 at a position that is a multiple of the pellet interval pitch. Second
The stand 15 for receiving the pellet after it is bent and broken by the bending mechanism 11 is also provided with a suction hole 16 at the lower part, and has a structure in which the broken pellet is suctioned and fixed.
さらに、第2の折り曲げ機構11での折り曲げ破断終了
時には治具詰め機構17の吸着ノズル18により受は台
15上の個々のペレットを所定の吸着治具19の位置に
搬送する構造にしである。Further, when the second bending mechanism 11 finishes bending and breaking, the suction nozzle 18 of the jig packing mechanism 17 transports each pellet on the table 15 to a predetermined suction jig 19.
次に、本実施例の作用について説明する。Next, the operation of this embodiment will be explained.
第1の折り曲げ機構10の間欠送り部に配置した半切上
ウェハ1は、真空吸着搬送機構20により第1の折り曲
げ機構10に間欠的に送り込まれると単列ペレット片に
破断分離されると共に、下部受は台I3に吸着固定され
、この状態より直角方向にペレット間隔での間欠ピンチ
送りで真空吸着搬送され、第2の折り曲げ機構11にお
いて前記とは直角方向に折り曲げて破断され個別分離さ
れると共にペレット受は台15より所定の治具19に機
械的に収納される。When the half-cut upper wafer 1 placed in the intermittent feeding section of the first folding mechanism 10 is intermittently fed into the first folding mechanism 10 by the vacuum suction conveyance mechanism 20, it is broken and separated into single row pellet pieces, and the lower part The receiver is suction-fixed to the stand I3, and from this state, it is conveyed by vacuum suction in the perpendicular direction by intermittent pinch feeding at pellet intervals, and in the second bending mechanism 11, it is bent in the perpendicular direction to the above, broken, and separated into individual pieces. The pellet receiver is mechanically stored in a predetermined jig 19 from the stand 15.
このように、本実施例によれば、半切断ウニ/Sのペレ
ットへの分離個別化を一貫して機械的に効率良く行い所
定の治具への収納ができ、かつ人手を介することなく処
理できることにより、手扱いにおける汚染の防止にも効
果がある。本方式によれば、接着シートを必要としない
ことから接着において生しるイ1帯作業も不要となるこ
とは明らかである。As described above, according to this embodiment, it is possible to mechanically and efficiently separate and individualize half-cut sea urchins/S into pellets, store them in a predetermined jig, and process them without human intervention. This is also effective in preventing contamination during handling. According to this method, since an adhesive sheet is not required, it is clear that the one-band work that occurs in adhesion is also unnecessary.
[効果]
fil、 2つの折り曲げ機構を組み合わせて使用す
ることにより、ペレット分離を自動的に円滑に行うこと
ができる。[Effects] By using the two folding mechanisms in combination, pellet separation can be automatically and smoothly performed.
(2)、接着シー1〜またはテープは不要であり、コス
トを低減できる。(2) Adhesive sheet 1 or tape is not required, and costs can be reduced.
以上木兄明石によってなされた発明を実施例に基づき具
体的に説明したが、本発明は前記実施例に限定されるも
のではなく、その要旨を逸脱しない範囲で種々変更可能
であることばいうまでもない。Although the invention made by Akashi Kinoe has been specifically explained above based on examples, it goes without saying that the present invention is not limited to the above-mentioned examples and can be modified in various ways without departing from the gist thereof. do not have.
たとえば、本発明では第1および第2の折り曲げ機構1
0.11にそれぞれペレット・の形状検出および不良マ
ークのインク検出信号を伺加させることにより良品ペレ
ットのみ所定の治具に収納できる。For example, in the present invention, the first and second bending mechanisms 1
By adding the shape detection signal of the pellet and the ink detection signal of the defective mark to 0.11, only good pellets can be stored in a predetermined jig.
第1図(al、(blは半切断ウェハの平面図と正面図
、第2図と第3図は考えられるベレント分離装置を示す
断面図、
第4図と第5図は考えられる他のベレソ11分離装置を
示す断面図、
第6図は本発明の一実施例であるペレット分離装置を示
す平面図、
第7図は第1の折り曲げ機構の断面図、 第8図はウェ
ハ折り曲げ破断後のEl1列分離ペレットのIll送部
の断面図、
第9図は第2の折り曲げ機構のIJjj面図、第10図
は折り曲げ破断後のう)離ペレ7+・の治具詰め機構の
断面図である。
1・・・ウェハ、10・・・第1の折り曲げ機構、11
・・・第2の折り曲げ機構、12・・・真空吸着搬送機
構、13・・・分離ペレノ1−用受げ台、13a・・・
受は台真空吸着孔、15・・分離ペレット用受は台、1
6・・・受り台真空吸着孔、17・・・治具詰め機構、
18・・・吸着ノズル、19・・・治具、20・・・真
空吸着搬送機構。
22Figure 1 (al, (bl) is a plan view and front view of a half-cut wafer, Figures 2 and 3 are sectional views showing a possible Verent separation device, Figures 4 and 5 are other possible Verent separation devices. 11 is a sectional view showing the separation device, FIG. 6 is a plan view showing a pellet separation device which is an embodiment of the present invention, FIG. 7 is a sectional view of the first folding mechanism, and FIG. 8 is a wafer after bending and breaking. Figure 9 is a cross-sectional view of the Ill feeding section of the El1 row separated pellets, Figure 9 is an IJj plane view of the second folding mechanism, and Figure 10 is a cross-sectional view of the jig packing mechanism for separating pellets 7+ after bending and breaking. 1... Wafer, 10... First bending mechanism, 11
. . . second bending mechanism, 12 . . . vacuum suction conveyance mechanism, 13 .
The receiver is a stand vacuum suction hole, 15...The receiver for separated pellets is a stand, 1
6... cradle vacuum suction hole, 17... jig packing mechanism,
18... Suction nozzle, 19... Jig, 20... Vacuum suction conveyance mechanism. 22
Claims (1)
ウェハをXY両方向に半切断した後、そのウェハを一方
向に折り曲げて列状に分離し、次いで他方向に折り曲げ
て個々のペレットに分離することを特徴とするペレット
分離方法。 2、前記一方向への折り曲げ分離と他方向への折り曲げ
分離とが一貫連続的に行われることを特徴とする特許請
求の範囲第1項記載のペレット分離方法。 3、ウェハを個々のペレットに分離する装置において、
XY両方向に半切断されたウェハを第1の搬送方向に対
して一方向に折り曲げて分離する第1の折り曲げ手段と
、前記第1の折り曲げ手段で列状に分離されたウェハを
第2の搬送方向に1111送する搬送手段と、前記第1
の折り曲げ手段に対して所定の角度で配置され、前記列
状に分離されたウェハを個々のペレットに分離する第2
の折り曲げ手段とを備えてなることを特徴とするペレソ
]・分1i11を装置。 4、前記第1の折り曲げ手段と第2の折り曲げ手段が互
いに直角方向に配置されているごとを特徴とする特許請
求の範囲第3項記載のベレット分離装置。[Claims] ■ A method for separating a wafer into individual pellets,
A pellet separation method characterized by cutting a wafer in half in both the X and Y directions, then folding the wafer in one direction to separate it into rows, and then folding it in the other direction to separate it into individual pellets. 2. The pellet separation method according to claim 1, wherein the folding separation in one direction and the bending separation in the other direction are performed consistently and continuously. 3. In an apparatus for separating wafers into individual pellets,
a first folding means for folding and separating the wafers cut in half in both the X and Y directions in one direction with respect to the first transport direction; and a second transport for separating the wafers into rows by the first folding means. a conveyance means for conveying in the direction 1111;
a second wafer arranged at a predetermined angle with respect to the folding means for separating the row-separated wafers into individual pellets;
and a bending means. 4. The pellet separating device according to claim 3, wherein the first bending means and the second bending means are arranged at right angles to each other.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58092377A JPS59218750A (en) | 1983-05-27 | 1983-05-27 | Method and device for separating pellet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58092377A JPS59218750A (en) | 1983-05-27 | 1983-05-27 | Method and device for separating pellet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59218750A true JPS59218750A (en) | 1984-12-10 |
Family
ID=14052731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58092377A Pending JPS59218750A (en) | 1983-05-27 | 1983-05-27 | Method and device for separating pellet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59218750A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008071932A (en) * | 2006-09-14 | 2008-03-27 | Disco Abrasive Syst Ltd | Wafer dividing apparatus and method |
JP2013080972A (en) * | 2005-11-10 | 2013-05-02 | Renesas Electronics Corp | Method of manufacturing semiconductor device |
US8772135B2 (en) | 2005-11-10 | 2014-07-08 | Renesas Electronics Corporation | Semiconductor device manufacturing method using laser irradiation and dicing saw and semiconductor device thereof |
-
1983
- 1983-05-27 JP JP58092377A patent/JPS59218750A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013080972A (en) * | 2005-11-10 | 2013-05-02 | Renesas Electronics Corp | Method of manufacturing semiconductor device |
US8772135B2 (en) | 2005-11-10 | 2014-07-08 | Renesas Electronics Corporation | Semiconductor device manufacturing method using laser irradiation and dicing saw and semiconductor device thereof |
US9070560B2 (en) | 2005-11-10 | 2015-06-30 | Renesas Electronics Corporation | Semiconductor chip with modified regions for dividing the chip |
US10002808B2 (en) | 2005-11-10 | 2018-06-19 | Renesas Electronics Corporation | Semiconductor device manufacturing method and semiconductor device |
JP2008071932A (en) * | 2006-09-14 | 2008-03-27 | Disco Abrasive Syst Ltd | Wafer dividing apparatus and method |
JP4721997B2 (en) * | 2006-09-14 | 2011-07-13 | 株式会社ディスコ | Wafer dividing apparatus and wafer dividing method |
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