JPS62152193A - Printed wiring board for ic card - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a printed wiring board for an IC card, and more particularly to a printed wiring board for an IC card that is thinned and equipped with electronic components such as conductors. .

(Prior art) This type of thin printed wiring board for IC cards is
This card is used for various purposes such as a cash withdrawal card called a D card, an identification card called a TD card, a medical chart, a telephone card, etc. In order to connect the printed wiring board for IC cards, it is necessary to form contact terminals exposed to the outside on the surface of the printed wiring board for IC cards. Since each contact terminal of this printed wiring board for an IC card is exposed outward from its surface, it is easy to come into contact with various things and is also easily exposed to dust and moisture.

In the conventional printed wiring board for this type of IC card,
The connection between each contact terminal (22) and the electronic component 23) is made through a through hole (21a) formed in the substrate (21) of the printed wiring board for the IC card, as shown in FIGS. 5 and 6. ). That is, when forming the conductor layer (24) in the through hole (21a), each contact terminal (22) and the substrate (21) are electrically connected to the conductor layer (24) and arranged on the surface side of the substrate (21). A conductor circuit (25) arranged on the back side of the electronic component (23) and the electronic component (23) to be fixed in the cavity (21b) of the substrate (21) are simultaneously formed by etching or plating. 25) and bonding wire (25)
It is formed by connecting with Q9.

In the conventional printed wiring board for IC cards formed in this way, the conductor layer (24) in the through hole (21a) is usually
), the through hole (21a) is not completely sealed, so the substrate (21a) is not completely sealed as shown in FIG.
) is in a state where the front and back sides are connected.

(Problem to be solved by the invention) If a conventional printed wiring board for an IC card is connected to both the front and back sides through the through-hole (21a) as described above, the through-hole (21a) will cause dirt to collect. This allows moisture to enter. Further, as shown in FIG. 6, this through hole (21a) is often located at the center of the contact terminal (22), and moreover, this contact terminal (22) must be exposed to the outside. , the intrusion of dirt and moisture as mentioned above cannot be avoided.

On the other hand, electronic components (23) and their respective bonding wires (23) mounted on this type of IC card printed wiring board
6) Electrical continuity must be ensured.If the condition allows the intrusion of dust and I&A air from each through hole (21a) as described in the following, it is necessary to ensure electrical continuity. Electronic parts (23) and each punch ink wire (2
5) or be violated, which means that problem 1 has not been solved.

In other words, in conventional printed wiring boards for IC cards, dust and moisture enter the electronic component (23) through each of the four holes (21a), and these dust and moisture damage the bonding wire ( This may cause problems such as corrosion and disconnection of the wire (26) or destruction of the electronic component (23).

The present invention has been made in view of the above-mentioned circumstances, and the problem to be solved is the incomplete sealing of the electronic component (23) and its connection portion in this type of IC card printed wiring board. It is.

One object of the present invention is to reliably seal electronic components (23) and their connections in this type of IC card printed wiring board with a simple structure.

(Means for solving the problems) The means taken by the present invention to solve the above problems are as follows:
This will be explained with reference to FIGS. 1 to 4, which correspond to embodiments.

Electronic components (13) mounted on the board (I+) and contact terminals (12) that are exposed on the surface or outside and serve as external contacts.
), in which the contact terminals (12) and the electronic component (13) are electrically connected to each other, the contact terminals (12) are formed without holes, and , connect this contact terminal (12) to the substrate (1
The through holes (l la) formed in 1) are fixed to the front side of the board (11) with the through holes (l la) closed, and the electronic component (13) is placed on the back side of the board (11). This is a printed wiring board (1O) for an IC card, characterized in that an electronic component (13) and each contact terminal (12) are electrically connected on the back side of a substrate (11).

(Actions of the Invention) By adopting the above-described measures, the present invention has the following effects.

In other words, in this IC card printed wiring board (1 socket), each through hole (lla) is completely covered by the contact terminal (12) fixed to the board (11). be. This is because this contact terminal (12) does not have a hole. Therefore, the intrusion of dirt and moisture into the IC card printed wiring board (10) through the d-hole, which has been a problem in the past, is completely prevented.

In addition, each contact terminal (
12), and the others are arranged on the back side of the board (11), so the rise of each bonding wire (16) is low, and the printed wiring board (10) for C card is Overall, the design has been made thinner.

(Example) Next, the present invention will be described in more detail based on an example shown in the drawings.

FIG. 1 and FIG. 2 show a printed wiring board (10) for IC cards according to the present invention, and this printed wiring board (10) for IC cards mainly consists of a substrate (11), this substrate (II). A plurality of through holes (lla) are formed in this substrate (
It consists of a contact terminal (rg), an electronic component (+3), a conductor layer (14), and a conductor circuit (15) fixed to the surface of II).

The board (11) has contact terminals (12) and electronic components (
+3), etc., printed wiring board for IC cards (10)
The most typical example is a copper-clad laminate with a one-sided adhesive layer made of glass m-fiber epoxy resin. In addition to the above substrates, rigid or flexible substrates made of composite materials such as paper phenol and paper epoxy, triazine-modified resins, polyimide resin films, and the like can be used as the substrate (1).

Incidentally, as the adhesive layer of the four-laminate plate for attaching the single-sided adhesive layer, an uncured thermosetting resin or thermoplastic resin is usually used.

Each σ through hole (lla) and cavity (Ilb) are formed in this substrate (11), or these four through holes (lla) are formed.
) and the cavity (llb) are formed by drilling or punching with a die.

Then, these six holes (lla) and cavities (l
Each contact terminal (12) is bonded to the front surface side of lb) by, for example, heat press. The contact terminal (12) is not only made of copper foil, but may also be made of other metals such as gold-nickel alloy.

Of course, these contact terminals (12) do not have any holes, and each of these contact terminals (12) is
Each through-hole (lla) is completely covered by fixing it to the surface side of the through-hole (lla). The cavity (Ilb) is the part where the electronic component (13) is stored, and -L is placed on the surface side of this cavity (Ilb).
A metal foil made of the same material as the contact terminal (12) described above is fixed to the plate (11) at the same time as the contact terminal (12) is fixed. Of course.

In some cases, this metal foil constitutes a part of each contact terminal (12).

In addition, the conductor layer (
I4) and conductor circuit (15) are through-hole plated,
It is formed through various steps such as resist formation and etching. These conductor layers (14) and conductor circuits (15) form a cavity (Ilb) on the back side of the substrate (11).
) and the electronic component (13) fixed in the board (11).
) is connected to each contact terminal (12) located on the front surface side using a bonding wire (16). That is, each terminal of the electronic component (13) and the conductor circuit (
15) by a bonding wire (16). Note that this kind of connection is sufficient, so
Thin η of printed wiring board (lO) for wood tC cards! This is why it has become a Noh play.

After constructing the structure as described above, various electroless and electrolytic platings are applied to form the necessary metal layers, and protective films are applied to both sides to form a printed wiring board (IO) for IC cards. It will be completed.

Next, five of the most typical examples of the present invention will be explained by citing specific numerical values.

Example 1 A glass epoxy resin substrate (C8-35 manufactured by Risho T-gyo) with a thickness of 0.13 mm (hereinafter IHm thickness is abbreviated as t)
24 one side Q-035t E foil material, one side 0. (125 with adhesive layer), cavity hole and diameter 1.01 (
A conductive hole with a diameter of I (hereinafter abbreviated as φ) is punched out using a mold, copper foil of Q and Q7t is adhered to the adhesive layer surface using a thermocompression press, and copper through-hole plating is applied to 3g and m to form a resist. , etching, electrolytic nickel plating 3
A printed wiring board (10) for an IC card according to the present invention as shown in FIG. 2 was obtained by applying 0.3 m of electrolytic gold foil.

Example 2 0.13t glass triazine substrate with 0.025t adhesive layer on one side (Mitsubishi Gas Chemical, GIIL-8093)
After punching out a cavity and a 1.0φ conductive hole using a mold, 0.07 t of copper foil was bonded using a thermocompression press, resist formation, etching, electrolytic nickel plating of 54 m, and electrolytic gold plating of 0.0 m. A printed wiring board (10) for an IC card according to the present invention as shown in FIG. 4 was obtained by applying 5 μm.

(Effects of the Invention) As described in detail below, in the present invention, as exemplified in each of the embodiments described above, the electronic component (13) mounted on the board (11) and the surface Contact terminals (12
), in which the contact terminals (12) and the electronic component (13) are electrically connected to each other, the contact terminals (12) are formed without holes, and , this contact terminal (12) is connected to the knife plate (
It is assumed that the through hole (lla) formed in 11) is fixed to the front surface side of the board (1) with the through hole (lla) formed in the board (11) closed, and the electronic component (+3) is placed on the front side of the board (11). Its characteristic lies in the electrical connection between the electronic component (1 piece) and each contact terminal (I2) on the back side of the board (11), which allows the electronic component and its connection parts to be sealed inside the tube. This can be reliably carried out with a simple structure, thereby making it possible to provide a printed wiring board (IO) for an IC card that reliably prevents the intrusion of dust and moisture. That is, it is possible to prevent deterioration such as corrosion and disconnection of each conductor circuit (I5) and bonding wire (+6) (and in some cases, the conductor layer (14)) in the IC card printed wiring board (IO), The reliability of the IC card printed wiring board (1+) can be improved.

Further, in this IC card printed wiring board (10), each contact terminal (12) is provided on the front side of the board (11).
), a cavity (llb) is formed on the π-plane side of the substrate (11), and this cavity (llb) is disposed.
b) Arranging the electronic component (13) in the interior, as well as bonding wire (16) and conductor circuit (15) therefor.
By arranging the IC card, the protrusion from the board (11) can be minimized, and the overall thickness of the IC card printed wiring board (10) can be made thinner.
It is also possible to have an optimal structure as a printed wiring board (10) for a C card.

[Brief explanation of drawings]

FIG. 1 is a perspective view of the back side of the printed wiring board for IC cards according to the present invention, showing the state before applying the protective film;
Figure 2 is an enlarged longitudinal sectional view taken along the line ■-■ in Figure 1;
FIG. 3 is a plan view showing the surface of a printed wiring board for an IC card, and FIG. 4 is a longitudinal sectional view corresponding to FIG. 2 showing another embodiment of the present invention. FIG. 5 is a longitudinal sectional view corresponding to FIG. 2 showing the conventional one;
FIG. 6 is a plan view of a conventional printed wiring board for IC cards. Explanation of symbols 10--Printed wiring board for IC car 1~, II-1 board, 11a...i'i through hole, 12...contact terminal, 13--electronic component, 14...・Conductor layer, 15...
・Conductor circuit, 16...bonde ink wire.

Claims (1)

[Claims] 1) A device comprising an electronic component mounted on a substrate and a contact terminal whose surface is exposed to the outside and serves as an external contact, and electrically connects the contact terminal and the electronic component. In a printed wiring board for an IC card, the contact terminal is formed without a hole, and the contact terminal is fixed to the surface side of the substrate in a state where a through hole formed in the substrate is closed, A printed wiring board for an IC card, characterized in that the electronic component is arranged on the back side of the substrate, and the electronic component and each of the contact terminals are electrically connected on the back side of the substrate. 2) The electrical connection is made by forming a conductor layer electrically connected to the back surface of the contact terminal in the through hole, and connecting the electronic component and each contact terminal via this conductor layer. A printed wiring board for an IC card according to claim 1, characterized in that: 3) The IC card print according to claim 1 or 2, wherein the surface of the contact terminal exposed in the through hole is a bonding terminal connected to the electronic component. wiring board.