JPS62151749U - - Google Patents
Info
- Publication number
- JPS62151749U JPS62151749U JP3839986U JP3839986U JPS62151749U JP S62151749 U JPS62151749 U JP S62151749U JP 3839986 U JP3839986 U JP 3839986U JP 3839986 U JP3839986 U JP 3839986U JP S62151749 U JPS62151749 U JP S62151749U
- Authority
- JP
- Japan
- Prior art keywords
- snap groove
- ceramic wafer
- utility
- scope
- same position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986038399U JPH0517887Y2 (US07122547-20061017-C00273.png) | 1986-03-18 | 1986-03-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986038399U JPH0517887Y2 (US07122547-20061017-C00273.png) | 1986-03-18 | 1986-03-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62151749U true JPS62151749U (US07122547-20061017-C00273.png) | 1987-09-26 |
| JPH0517887Y2 JPH0517887Y2 (US07122547-20061017-C00273.png) | 1993-05-13 |
Family
ID=30850605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986038399U Expired - Lifetime JPH0517887Y2 (US07122547-20061017-C00273.png) | 1986-03-18 | 1986-03-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0517887Y2 (US07122547-20061017-C00273.png) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02119246A (ja) * | 1988-10-28 | 1990-05-07 | Shindengen Electric Mfg Co Ltd | 半導体装置の製造方法 |
| JP2000068414A (ja) * | 1998-08-24 | 2000-03-03 | Ngk Spark Plug Co Ltd | リードレスパッケージの製造方法 |
| JP2008544549A (ja) * | 2005-06-22 | 2008-12-04 | フリースケール セミコンダクター インコーポレイテッド | 化学的ダイ単一化技法 |
| JP2015023095A (ja) * | 2013-07-17 | 2015-02-02 | コーア株式会社 | チップ抵抗器の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60183747A (ja) * | 1984-03-01 | 1985-09-19 | Ngk Spark Plug Co Ltd | 面取り付き電解チツプキヤリアの製造法 |
-
1986
- 1986-03-18 JP JP1986038399U patent/JPH0517887Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60183747A (ja) * | 1984-03-01 | 1985-09-19 | Ngk Spark Plug Co Ltd | 面取り付き電解チツプキヤリアの製造法 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02119246A (ja) * | 1988-10-28 | 1990-05-07 | Shindengen Electric Mfg Co Ltd | 半導体装置の製造方法 |
| JP2000068414A (ja) * | 1998-08-24 | 2000-03-03 | Ngk Spark Plug Co Ltd | リードレスパッケージの製造方法 |
| JP2008544549A (ja) * | 2005-06-22 | 2008-12-04 | フリースケール セミコンダクター インコーポレイテッド | 化学的ダイ単一化技法 |
| JP2015023095A (ja) * | 2013-07-17 | 2015-02-02 | コーア株式会社 | チップ抵抗器の製造方法 |
| CN105393316A (zh) * | 2013-07-17 | 2016-03-09 | 兴亚株式会社 | 芯片电阻器的制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0517887Y2 (US07122547-20061017-C00273.png) | 1993-05-13 |
