JPS6214705Y2 - - Google Patents

Info

Publication number
JPS6214705Y2
JPS6214705Y2 JP1980004152U JP415280U JPS6214705Y2 JP S6214705 Y2 JPS6214705 Y2 JP S6214705Y2 JP 1980004152 U JP1980004152 U JP 1980004152U JP 415280 U JP415280 U JP 415280U JP S6214705 Y2 JPS6214705 Y2 JP S6214705Y2
Authority
JP
Japan
Prior art keywords
insulated
heat sink
lead
frame
insulating plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980004152U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5744556U (enFirst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980004152U priority Critical patent/JPS6214705Y2/ja
Publication of JPS5744556U publication Critical patent/JPS5744556U/ja
Application granted granted Critical
Publication of JPS6214705Y2 publication Critical patent/JPS6214705Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1980004152U 1980-01-17 1980-01-17 Expired JPS6214705Y2 (enFirst)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980004152U JPS6214705Y2 (enFirst) 1980-01-17 1980-01-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980004152U JPS6214705Y2 (enFirst) 1980-01-17 1980-01-17

Publications (2)

Publication Number Publication Date
JPS5744556U JPS5744556U (enFirst) 1982-03-11
JPS6214705Y2 true JPS6214705Y2 (enFirst) 1987-04-15

Family

ID=29434483

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980004152U Expired JPS6214705Y2 (enFirst) 1980-01-17 1980-01-17

Country Status (1)

Country Link
JP (1) JPS6214705Y2 (enFirst)

Also Published As

Publication number Publication date
JPS5744556U (enFirst) 1982-03-11

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