JPS6214627Y2 - - Google Patents
Info
- Publication number
- JPS6214627Y2 JPS6214627Y2 JP104581U JP104581U JPS6214627Y2 JP S6214627 Y2 JPS6214627 Y2 JP S6214627Y2 JP 104581 U JP104581 U JP 104581U JP 104581 U JP104581 U JP 104581U JP S6214627 Y2 JPS6214627 Y2 JP S6214627Y2
- Authority
- JP
- Japan
- Prior art keywords
- socket
- metal contact
- pair
- power supply
- light bulb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 35
- 229910052751 metal Inorganic materials 0.000 claims description 35
- 230000000630 rising effect Effects 0.000 claims description 32
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 21
- 238000003780 insertion Methods 0.000 claims description 13
- 230000037431 insertion Effects 0.000 claims description 13
- 239000012777 electrically insulating material Substances 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 2
- 229910052573 porcelain Inorganic materials 0.000 claims description 2
- 238000007789 sealing Methods 0.000 description 7
- 238000005192 partition Methods 0.000 description 4
- 238000002788 crimping Methods 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
Landscapes
- Connecting Device With Holders (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP104581U JPS6214627Y2 (zh) | 1981-01-08 | 1981-01-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP104581U JPS6214627Y2 (zh) | 1981-01-08 | 1981-01-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57115193U JPS57115193U (zh) | 1982-07-16 |
| JPS6214627Y2 true JPS6214627Y2 (zh) | 1987-04-14 |
Family
ID=29799566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP104581U Expired JPS6214627Y2 (zh) | 1981-01-08 | 1981-01-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6214627Y2 (zh) |
-
1981
- 1981-01-08 JP JP104581U patent/JPS6214627Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57115193U (zh) | 1982-07-16 |
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