JPS62145345U - - Google Patents
Info
- Publication number
- JPS62145345U JPS62145345U JP3280886U JP3280886U JPS62145345U JP S62145345 U JPS62145345 U JP S62145345U JP 3280886 U JP3280886 U JP 3280886U JP 3280886 U JP3280886 U JP 3280886U JP S62145345 U JPS62145345 U JP S62145345U
- Authority
- JP
- Japan
- Prior art keywords
- soldered
- protrusion
- semiconductor element
- heat
- stud
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
従来のスタツドマウント型半導体装置の断面図で
ある。
１…半導体基板、２…スタツド側熱補償板、３
，８…連結線側熱補償板、４…周辺保護材、５，
９…半導体素子、６…スタツド、７，１０…連結
線。
FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional stud-mount type semiconductor device. 1... Semiconductor substrate, 2... Stud side heat compensation plate, 3
, 8... Connection line side heat compensating plate, 4... Peripheral protection material, 5,
9... Semiconductor element, 6... Stud, 7, 10... Connection line.
Claims (1)
リブデン等の熱補償板をろう接したサンドイツチ
構造の半導体素子をスタツドにろう接し、連結線
を該半導体素子にろう接した半導体装置において
、前記連結線とろう接する側の半導体素子の熱補
償板に突起を、連結線の熱補償板とろう接する面
に前記熱補償板の突起よりもわずかに大きな座グ
リ穴を有し、前記突起と座グリ穴とが互いに嵌合
されていることを特徴とする半導体装置。 In a semiconductor device in which a semiconductor element having a sandwich structure in which heat compensating plates such as tungsten or molybdenum are soldered to a semiconductor substrate from both sides is soldered to a stud, and a connecting wire is soldered to the semiconductor element, the side to be soldered to the connecting line is soldered to a stud. A protrusion is provided on the heat compensating plate of the semiconductor element, and a counterbore hole slightly larger than the protrusion of the heat compensator plate is provided on the surface of the connecting wire that is to be soldered to the heat compensator plate, and the protrusion and the counterbore hole are fitted into each other. A semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3280886U JPS62145345U (en) | 1986-03-06 | 1986-03-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3280886U JPS62145345U (en) | 1986-03-06 | 1986-03-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62145345U true JPS62145345U (en) | 1987-09-12 |
Family
ID=30839837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3280886U Pending JPS62145345U (en) | 1986-03-06 | 1986-03-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62145345U (en) |
-
1986
- 1986-03-06 JP JP3280886U patent/JPS62145345U/ja active Pending
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