JPS62142791A - 真空処理装置 - Google Patents

真空処理装置

Info

Publication number
JPS62142791A
JPS62142791A JP28472485A JP28472485A JPS62142791A JP S62142791 A JPS62142791 A JP S62142791A JP 28472485 A JP28472485 A JP 28472485A JP 28472485 A JP28472485 A JP 28472485A JP S62142791 A JPS62142791 A JP S62142791A
Authority
JP
Japan
Prior art keywords
vacuum
chamber
substrate
processing
preliminary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP28472485A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6345467B2 (enrdf_load_stackoverflow
Inventor
Katsuzo Ukai
鵜飼　勝三
Tsutomu Tsukada
勉 塚田
Toshio Adachi
安達　俊男
Koji Ikeda
浩二 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anelva Corp filed Critical Anelva Corp
Priority to JP28472485A priority Critical patent/JPS62142791A/ja
Publication of JPS62142791A publication Critical patent/JPS62142791A/ja
Publication of JPS6345467B2 publication Critical patent/JPS6345467B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
JP28472485A 1985-12-18 1985-12-18 真空処理装置 Granted JPS62142791A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28472485A JPS62142791A (ja) 1985-12-18 1985-12-18 真空処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28472485A JPS62142791A (ja) 1985-12-18 1985-12-18 真空処理装置

Publications (2)

Publication Number Publication Date
JPS62142791A true JPS62142791A (ja) 1987-06-26
JPS6345467B2 JPS6345467B2 (enrdf_load_stackoverflow) 1988-09-09

Family

ID=17682162

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28472485A Granted JPS62142791A (ja) 1985-12-18 1985-12-18 真空処理装置

Country Status (1)

Country Link
JP (1) JPS62142791A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0394070A (ja) * 1989-09-05 1991-04-18 Kokusai Electric Co Ltd Ｃｖｄ装置
JP2002198411A (ja) * 2000-12-26 2002-07-12 Tokyo Electron Ltd 圧力制御方法、搬送装置およびクラスタツール
JP2006324367A (ja) * 2005-05-18 2006-11-30 Disco Abrasive Syst Ltd プラズマエッチング装置
JP2010089014A (ja) * 2008-10-08 2010-04-22 Jpe:Kk プラズマ洗浄装置
CN103866282A (zh) * 2012-12-14 2014-06-18 北京北方微电子基地设备工艺研究中心有限责任公司 Pecvd设备
JPWO2014103677A1 (ja) * 2012-12-26 2017-01-12 麒麟麦酒株式会社 薄膜の成膜装置及び成膜方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3851154B2 (ja) * 2001-11-30 2006-11-29 株式会社日本製鋼所 ロードロック装置の基板搬送方法及びその装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0394070A (ja) * 1989-09-05 1991-04-18 Kokusai Electric Co Ltd Ｃｖｄ装置
JP2002198411A (ja) * 2000-12-26 2002-07-12 Tokyo Electron Ltd 圧力制御方法、搬送装置およびクラスタツール
JP2006324367A (ja) * 2005-05-18 2006-11-30 Disco Abrasive Syst Ltd プラズマエッチング装置
JP2010089014A (ja) * 2008-10-08 2010-04-22 Jpe:Kk プラズマ洗浄装置
CN103866282A (zh) * 2012-12-14 2014-06-18 北京北方微电子基地设备工艺研究中心有限责任公司 Pecvd设备
JPWO2014103677A1 (ja) * 2012-12-26 2017-01-12 麒麟麦酒株式会社 薄膜の成膜装置及び成膜方法

Also Published As

Publication number Publication date
JPS6345467B2 (enrdf_load_stackoverflow) 1988-09-09

Similar Documents

Publication Publication Date Title
US4816638A (en) Vacuum processing apparatus
KR890002837B1 (ko) 연속 스퍼터 장치
US5223001A (en) Vacuum processing apparatus
US20020197145A1 (en) Substrate processing apparatus and a method for fabricating a semiconductor device by using same
US20040013501A1 (en) Wafer load lock and magnetically coupled linear delivery system
JPH08330202A (ja) 半導体ウェハ処理装置
JPS62142791A (ja) 真空処理装置
JPH11158618A (ja) 実質的に扁平な円板形の基板に成膜処理を施すための成膜装置
JP3012328B2 (ja) 圧力密閉室内の基板をガス中の汚染物質から保護する方法および装置
JPH0232351B2 (enrdf_load_stackoverflow)
JPS639586B2 (enrdf_load_stackoverflow)
JP3671983B2 (ja) 真空処理装置
JPH10247675A (ja) マルチチャンバシステム及びその搬送台車並びにゲートバルブさらにはその排気制御方法及びその装置
JPH0613751B2 (ja) 連続スパッタ装置
JPH11125491A (ja) 連続式熱処理炉
KR0166381B1 (ko) 진공처리장치
JP2003306771A (ja) グローブボックス付き成膜装置
JPH07161598A (ja) 真空処理装置
CN114023687B (zh) 一种用于探测器的干法刻蚀装置
JP3276382B2 (ja) 真空処理装置および真空処理方法
JPH0615720B2 (ja) 真空処理装置
JP3666636B2 (ja) 基板の処理装置
KR100808820B1 (ko) 진공처리 장치
JPH0783011B2 (ja) 減圧処理方法及び装置
JPH0732133B2 (ja) 半導体製造装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term