JPS62141038U - - Google Patents
Info
- Publication number
- JPS62141038U JPS62141038U JP2947686U JP2947686U JPS62141038U JP S62141038 U JPS62141038 U JP S62141038U JP 2947686 U JP2947686 U JP 2947686U JP 2947686 U JP2947686 U JP 2947686U JP S62141038 U JPS62141038 U JP S62141038U
- Authority
- JP
- Japan
- Prior art keywords
- reel
- separator
- filler
- adhesive layer
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000002390 adhesive tape Substances 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
- Adhesive Tapes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2947686U JPS62141038U (US07494231-20090224-C00006.png) | 1986-03-01 | 1986-03-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2947686U JPS62141038U (US07494231-20090224-C00006.png) | 1986-03-01 | 1986-03-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62141038U true JPS62141038U (US07494231-20090224-C00006.png) | 1987-09-05 |
Family
ID=30833389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2947686U Pending JPS62141038U (US07494231-20090224-C00006.png) | 1986-03-01 | 1986-03-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62141038U (US07494231-20090224-C00006.png) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0372585A (ja) * | 1989-05-29 | 1991-03-27 | Tomoegawa Paper Co Ltd | 接着シート及び半導体装置 |
| JPH03296582A (ja) * | 1990-04-14 | 1991-12-27 | Tomoegawa Paper Co Ltd | 接着シート |
| JP2001176895A (ja) * | 1994-10-31 | 2001-06-29 | Hitachi Chem Co Ltd | フィルム状有機ダイボンディング材のラミネ−ト方法、ダイボンディング方法、ラミネ−ト装置、ダイボンディング装置、半導体装置および半導体装置の製造法 |
| JP2009235402A (ja) * | 2008-03-05 | 2009-10-15 | Hitachi Chem Co Ltd | 接着フィルム |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57196415A (en) * | 1981-05-28 | 1982-12-02 | Nitto Electric Ind Co | Insulating tape |
| JPS5947281A (ja) * | 1982-09-13 | 1984-03-16 | Nitto Electric Ind Co Ltd | 粘着テ−プもしくはシ−トの製造方法 |
| JPS5980482A (ja) * | 1982-10-29 | 1984-05-09 | Hitachi Chem Co Ltd | 導電性粘着シ−ト |
| JPS606776A (ja) * | 1983-06-27 | 1985-01-14 | Nitto Electric Ind Co Ltd | α線シ−ルド用接着フイルム |
| JPS6028469A (ja) * | 1983-07-26 | 1985-02-13 | Aisin Seiki Co Ltd | エポキシ樹脂製テ−プ |
| JPS60102750A (ja) * | 1983-11-09 | 1985-06-06 | Nitto Electric Ind Co Ltd | 半導体素子固定用導電性接着フイルム |
| JPS6134085A (ja) * | 1984-07-26 | 1986-02-18 | Hitachi Chem Co Ltd | フイルム状接合部材 |
-
1986
- 1986-03-01 JP JP2947686U patent/JPS62141038U/ja active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57196415A (en) * | 1981-05-28 | 1982-12-02 | Nitto Electric Ind Co | Insulating tape |
| JPS5947281A (ja) * | 1982-09-13 | 1984-03-16 | Nitto Electric Ind Co Ltd | 粘着テ−プもしくはシ−トの製造方法 |
| JPS5980482A (ja) * | 1982-10-29 | 1984-05-09 | Hitachi Chem Co Ltd | 導電性粘着シ−ト |
| JPS606776A (ja) * | 1983-06-27 | 1985-01-14 | Nitto Electric Ind Co Ltd | α線シ−ルド用接着フイルム |
| JPS6028469A (ja) * | 1983-07-26 | 1985-02-13 | Aisin Seiki Co Ltd | エポキシ樹脂製テ−プ |
| JPS60102750A (ja) * | 1983-11-09 | 1985-06-06 | Nitto Electric Ind Co Ltd | 半導体素子固定用導電性接着フイルム |
| JPS6134085A (ja) * | 1984-07-26 | 1986-02-18 | Hitachi Chem Co Ltd | フイルム状接合部材 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0372585A (ja) * | 1989-05-29 | 1991-03-27 | Tomoegawa Paper Co Ltd | 接着シート及び半導体装置 |
| JPH03296582A (ja) * | 1990-04-14 | 1991-12-27 | Tomoegawa Paper Co Ltd | 接着シート |
| JP2001176895A (ja) * | 1994-10-31 | 2001-06-29 | Hitachi Chem Co Ltd | フィルム状有機ダイボンディング材のラミネ−ト方法、ダイボンディング方法、ラミネ−ト装置、ダイボンディング装置、半導体装置および半導体装置の製造法 |
| JP2009235402A (ja) * | 2008-03-05 | 2009-10-15 | Hitachi Chem Co Ltd | 接着フィルム |
