JPS6214096B2 - - Google Patents
Info
- Publication number
- JPS6214096B2 JPS6214096B2 JP54074114A JP7411479A JPS6214096B2 JP S6214096 B2 JPS6214096 B2 JP S6214096B2 JP 54074114 A JP54074114 A JP 54074114A JP 7411479 A JP7411479 A JP 7411479A JP S6214096 B2 JPS6214096 B2 JP S6214096B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing material
- dielectric ring
- cap
- metallized electrode
- wall member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005219 brazing Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 17
- 239000004065 semiconductor Substances 0.000 claims description 17
- 239000003989 dielectric material Substances 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 8
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910001128 Sn alloy Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- UCHOFYCGAZVYGZ-UHFFFAOYSA-N gold lead Chemical compound [Au].[Pb] UCHOFYCGAZVYGZ-UHFFFAOYSA-N 0.000 description 3
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7411479A JPS55165653A (en) | 1979-06-12 | 1979-06-12 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7411479A JPS55165653A (en) | 1979-06-12 | 1979-06-12 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55165653A JPS55165653A (en) | 1980-12-24 |
JPS6214096B2 true JPS6214096B2 (US06811534-20041102-M00003.png) | 1987-03-31 |
Family
ID=13537844
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7411479A Granted JPS55165653A (en) | 1979-06-12 | 1979-06-12 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55165653A (US06811534-20041102-M00003.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01278683A (ja) * | 1988-04-28 | 1989-11-09 | Yoshihiro Yonahara | はしご |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5849443U (ja) * | 1981-09-26 | 1983-04-04 | 三菱電機株式会社 | 半導体装置用パツケ−ジ |
JP2770994B2 (ja) * | 1989-09-30 | 1998-07-02 | 井関農機株式会社 | 小型ショベルカーに於ける油圧操作レバーのロック装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4925822U (US06811534-20041102-M00003.png) * | 1972-06-08 | 1974-03-05 |
-
1979
- 1979-06-12 JP JP7411479A patent/JPS55165653A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4925822U (US06811534-20041102-M00003.png) * | 1972-06-08 | 1974-03-05 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01278683A (ja) * | 1988-04-28 | 1989-11-09 | Yoshihiro Yonahara | はしご |
Also Published As
Publication number | Publication date |
---|---|
JPS55165653A (en) | 1980-12-24 |
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