JPS62140448A - 集積回路装置 - Google Patents

集積回路装置

Info

Publication number
JPS62140448A
JPS62140448A JP28096085A JP28096085A JPS62140448A JP S62140448 A JPS62140448 A JP S62140448A JP 28096085 A JP28096085 A JP 28096085A JP 28096085 A JP28096085 A JP 28096085A JP S62140448 A JPS62140448 A JP S62140448A
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
power supply
heat dissipation
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP28096085A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0418705B2 (enrdf_load_stackoverflow
Inventor
Takao Funamoto
舟本　孝雄
Ryoichi Kajiwara
良一 梶原
Mitsuo Kato
光雄 加藤
Kyo Matsuzaka
松坂　矯
Tomohiko Shida
志田　朝彦
Hiroshi Wachi
和知　弘
Kazuya Takahashi
和弥 高橋
Masatoshi Watabe
渡部　正敏
Minoru Yamada
稔 山田
Keiichiro Nakanishi
中西　敬一郎
Toshio Sugawara
捷夫 菅原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP28096085A priority Critical patent/JPS62140448A/ja
Priority to EP86309619A priority patent/EP0228212B1/en
Priority to DE8686309619T priority patent/DE3680774D1/de
Priority to US06/941,812 priority patent/US4809058A/en
Publication of JPS62140448A publication Critical patent/JPS62140448A/ja
Publication of JPH0418705B2 publication Critical patent/JPH0418705B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0251—Non-conductive microfibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP28096085A 1985-12-16 1985-12-16 集積回路装置 Granted JPS62140448A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP28096085A JPS62140448A (ja) 1985-12-16 1985-12-16 集積回路装置
EP86309619A EP0228212B1 (en) 1985-12-16 1986-12-10 Integrated circuit device
DE8686309619T DE3680774D1 (de) 1985-12-16 1986-12-10 Integriertes halbleiterbauelement.
US06/941,812 US4809058A (en) 1985-12-16 1986-12-15 Integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28096085A JPS62140448A (ja) 1985-12-16 1985-12-16 集積回路装置

Publications (2)

Publication Number Publication Date
JPS62140448A true JPS62140448A (ja) 1987-06-24
JPH0418705B2 JPH0418705B2 (enrdf_load_stackoverflow) 1992-03-27

Family

ID=17632287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28096085A Granted JPS62140448A (ja) 1985-12-16 1985-12-16 集積回路装置

Country Status (1)

Country Link
JP (1) JPS62140448A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH022699A (ja) * 1987-12-22 1990-01-08 Thomson Csf 高密度ハイブリッド集積回路
JP2010230304A (ja) * 2009-03-04 2010-10-14 Sumitomo Light Metal Ind Ltd 空気調和機用フィン・アンド・チューブ式熱交換器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH022699A (ja) * 1987-12-22 1990-01-08 Thomson Csf 高密度ハイブリッド集積回路
JP2010230304A (ja) * 2009-03-04 2010-10-14 Sumitomo Light Metal Ind Ltd 空気調和機用フィン・アンド・チューブ式熱交換器

Also Published As

Publication number Publication date
JPH0418705B2 (enrdf_load_stackoverflow) 1992-03-27

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term